Boyd Datasheets for Heat Sinks
Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel.
Heat Sinks: Learn more
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| Product Name | Notes |
|---|---|
| A type of bonded fin heat sink, brazed heat sinks offer greater structural integrity and thermal performance than epoxied bonded fins. Aavid offers a number of brazing capabilities including CAB... | |
| Aavid offers thousands of heat sink options for cooling semiconductor packages and other devices for use on printed circuit boards (PCBs). Available in a variety of shapes, sizes, profiles, fabrications,... | |
| Aavid provides the broadest product line of heat sinks and thermal solutions for cooling integrated circuits such as Field Programmable Grid Arrays (FPGAs) and the surface mount packaging used for... | |
| Aavid, Thermal Division of Boyd Corporation’s Hi-Contact™ technology optimizes the contact area liquid tubes have with a cooling surface to provide the best possible liquid cold plate thermal performance. Our... | |
| As heat transfer is directly correlated with surface area, adding surface area within the fluid path of a liquid cold plate can increase how much heat transfers into the liquid. | |
| Bonded fin heat sinks are an assembly of a grooved base with individual fins bonded into the grooves. This type of heat sink fabrication allows for higher fin densities and... | |
| Extruded aluminum is one of the most popular and cost efficient heat sink fabrication methods. Aavid maintains the world's largest portfolio of extruded heat sink profiles with over 5,000 tooled... | |
| Flat Tube Liquid Cold Plates utilizing aluminum multi-port extrusion (MPE) tubing are compact thermal management solutions that offer extremely low thermal resistance. These extrusions utilize thin external walls which minimize... | |
| Graphite is a carbon-based mineral with extreme properties. It is the most stable form of carbon under standard operating conditions with high thermal stability and electrical and thermal conductivity. These... | |
| Heat Sinks – Board Level, BGA/FPGA, Extruded Aluminum, Skived, Zipper, Bonded, Brazed Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. | |
| High Pressure Die Casting is a cost effective option for high volume solutions required to be light weight and superior cosmetic surface quality. Die Cast heat sinks come out in... | |
| Standard Aavid fan heat sink combinations are pre-assembled full thermal solutions for a variety of board level applications. Save time and space and increase thermal performance with these compact solutions. | |
| The Aavid portfolio of folded fins includes over 3,000 different configurations that are manufactured for high heat transfer. Folded fins provide more surface area and design flexibility than extruded heat... |
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