Heat Sink TO-220 Aluminum 10.0W @ 70°C Board Level, Vertical
Thermal Management Heat Sinks & Extrusions
Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.
HEAT SINK; Thermal Resistance:6.5°C/W; Packages Cooled:TO-220; External Width - Metric:50.4mm; External Height - Metric:49.99mm; External Length - Metric:9.53mm; External Diameter - Metric:-; Heat Sink Material:Aluminium RoHS Compliant: Yes
| DigiKey | Heilind Electronics, Inc. | Richardson RFPD | Newark, An Avnet Company | |
|---|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | 7022B-MTG-ND | 7022B-MTG | 7022B-MTG | 99R8258 |
| Product Name | Heat Sinks | Thermal Management Heat Sinks & Extrusions | Board Level Heat Sink | Heat Sink; Thermal Resistance Boyd |
| Device | Passive Heat Sink | |||
| Mounting | Holes; Socket | PCB | ||
| Thermal Resistance | 6.5 °C / W | 6.5 °C / W | 6.5 °C / W | |
| Material | Aluminum | Aluminum; Aluminium |
