Heat Sink BGA Aluminum 2.0W @ 50°C Top Mount
HEATSINK, BGA; Thermal Resistance:23.4°C/W;
HEAT SINK; Thermal Resistance:23.4°C/W;
| DigiKey | RS Components, Ltd. | Newark, An Avnet Company | Newark, An Avnet Company | |
|---|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | HS317-ND | 104036 | 20X0754 | 83K9811 |
| Product Name | Heat Sinks | Heatsinks | Heatsink, Bga; Thermal Resistance Boyd | Heat Sink; Thermal Resistance Boyd |
| Device | Passive Heat Sink | |||
| Mounting | Tape or adhesive compound | Adhesive foil | ||
| Thermal Resistance | 23.4 °C / W | 23.4 °C / W | 23.4 °C / W | |
| Material | Aluminum | Aluminum; Aluminium | Aluminum; Aluminium |