Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 30.6 C/W, 10 mm, 27 mm, 27 mm RoHS Compliant: Yes
HEAT SINK; Thermal Resistance:30.6°C/W;
| DigiKey | Newark, An Avnet Company | Newark, An Avnet Company | |
|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | HS522-ND | 51R8102 | 32M7143 |
| Product Name | Heat Sinks | Heat Sink, Square, Pcb, For Ball Grid Arrays, Bga, 30.6 C/w, 10 Mm, 27 Mm, 27 Mm Rohs Compliant Boyd | Heat Sink; Thermal Resistance Boyd |
| Device | Passive Heat Sink | ||
| Mounting | Solder Anchor | ||
| Thermal Resistance | 30.6 °C / W | 30.6 °C / W | |
| Material | Aluminum | Aluminum; Aluminium |
