Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.
Heat Sink TO-220 Aluminum 6.0W @ 50°C Board Level, Vertical
HEAT SINK; Thermal Resistance:6.8°C/W; Packages Cooled:TO-220; External Width - Metric:48.3mm; External Height - Metric:29.01mm; External Length - Metric:24.1mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; Height:29mmRoHS Compliant: Yes
| Richardson RFPD | DigiKey | Heilind Electronics, Inc. | Newark, An Avnet Company | |
|---|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | 7025B-MTG | 7025B-MTG-ND | 7025B-MTG | 18M8227 |
| Product Name | Board Level Heat Sink | Heat Sinks | 042261 | Heat Sink; Thermal Resistance Boyd |
| H | 28.7 mm (1.13 inch) | 29.01 mm (1.14 inch) | ||
| Mounting | PCB | Holes; Socket | ||
| Thermal Resistance | 6.8 °C / W | 6.8 °C / W | 6.8 °C / W | |
| Device | Passive Heat Sink |
