Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 30.6 C/W, 10 mm, 27 mm, 27 mm RoHS Compliant: Yes
| DigiKey | Newark, An Avnet Company | |
|---|---|---|
| Product Category | Heat Sinks | Heat Sinks |
| Product Number | HS318-ND | 51R8101 |
| Product Name | Heat Sinks | Heat Sink, Square, Pcb, For Ball Grid Arrays, Bga, 30.6 C/w, 10 Mm, 27 Mm, 27 Mm Rohs Compliant Boyd |
| Device | Passive Heat Sink |
