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Boyd BGA/FPGA Heat Sink

Description
Aavid provides the broadest product line of heat sinks and thermal solutions for cooling integrated circuits such as Field Programmable Grid Arrays (FPGAs) and the surface mount packaging used for integrated circuits like Ball Grid Arrays (BGAs). Choose from a number of sizes, fin types, and attachment methods, including clip attach, solder anchors, push pin, and tape for easy assembly. Aavid Fans and Thermal Interface Materials can be added for a fully optimized cooling solution that can be quickly and easily mounted to your device. Standard BGA/FPGA heat sinks and fan/heat sink combos can be purchased directly on the Aavid online storefront or through one of our authorized Distribution Partners. For larger quantities, non-standard or custom cooling, or any part numbers not available on the estore, please request a quote.
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Suppliers

Company
Product
Description
Supplier Links
BGA/FPGA Heat Sink -  - Boyd
Pleasanton, CA, United States
BGA/FPGA Heat Sink
BGA/FPGA Heat Sink
Aavid provides the broadest product line of heat sinks and thermal solutions for cooling integrated circuits such as Field Programmable Grid Arrays (FPGAs) and the surface mount packaging used for integrated circuits like Ball Grid Arrays (BGAs). Choose from a number of sizes, fin types, and attachment methods, including clip attach, solder anchors, push pin, and tape for easy assembly. Aavid Fans and Thermal Interface Materials can be added for a fully optimized cooling solution that can be quickly and easily mounted to your device. Standard BGA/FPGA heat sinks and fan/heat sink combos can be purchased directly on the Aavid online storefront or through one of our authorized Distribution Partners. For larger quantities, non-standard or custom cooling, or any part numbers not available on the estore, please request a quote.

Aavid provides the broadest product line of heat sinks and thermal solutions for cooling integrated circuits such as Field Programmable Grid Arrays (FPGAs) and the surface mount packaging used for integrated circuits like Ball Grid Arrays (BGAs).

Choose from a number of sizes, fin types, and attachment methods, including clip attach, solder anchors, push pin, and tape for easy assembly. Aavid Fans and Thermal Interface Materials can be added for a fully optimized cooling solution that can be quickly and easily mounted to your device. Standard BGA/FPGA heat sinks and fan/heat sink combos can be purchased directly on the Aavid online storefront or through one of our authorized Distribution Partners. For larger quantities, non-standard or custom cooling, or any part numbers not available on the estore, please request a quote.

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Technical Specifications

  Boyd
Product Category Heat Sinks
Product Name BGA/FPGA Heat Sink
Device Active Heat Sink (optional feature)
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