Thermal Management Heat Sinks & Extrusions
Heat Sink TO-220 Aluminum 1.5W @ 20°C Board Level
HEAT SINK; Thermal Resistance:12.4°C/W;
HEATSINK TO-220 1.45" HIGH
| Heilind Electronics, Inc. | DigiKey | Newark, An Avnet Company | Utmel Electronic Limited | |
|---|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | 551002B00000G | HS193-ND | 18M8184 | 4-551002B00000G |
| Product Name | Thermal Management Heat Sinks & Extrusions | Heat Sinks | Heat Sink; Thermal Resistance Boyd | HEATSINK TO-220 1.45" HIGH |
| Device | Passive Heat Sink | |||
| Mounting | Holes | |||
| Thermal Resistance | 12.4 °C / W | 12.4 °C / W | ||
| Material | Aluminum | Aluminum; Aluminium | Aluminum |
