The Aavid Thermalloy line of low profile surface mount heat sinks are suitable for SMT power semiconductor devices in D-PAK, D2PAK, D3PAK and SO-10 packages. Their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. The semiconductor's conventional copper drain pad is modified to extend beyond the edges of the semiconductor package providing space to mount the heat sink. The device and heat sink are soldered directly to the modified drain pad creating a thermal transfer path from the package tab to the surface mount heat sink. In addition, the elevated Wings of the heat sink provide ample surface area to dissipate the heat into the surrounding environment.
Heat Sink TO-263 (D²Pak) Copper 2.0W @ 30°C Top Mount
Heat Sink TO-263 (D²Pak) Copper 2.0W @ 30°C Top Mount
Heat Sink TO-263 (D²Pak) Copper 2.0W @ 30°C Top Mount
SMD HEAT SINK, COPPER, D2PAK/TO-263; Thermal Resistance:11°C/W; Packages Cooled:TO-263; External Width - Metric:19.38mm; External Height - Metric:11.43mm; External Length - Metric:25.4mm; External Diameter - Metric:-; Product Range:-RoHS Compliant: Yes
| Richardson RFPD | DigiKey | Newark, An Avnet Company | |
|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | 7109D/TRG | 7109D/TRGCT-ND | 52T3031 |
| Product Name | Board Level Heat Sink | Heat Sinks | Smd Heat Sink, Copper, D2Pak/to-263; Thermal Resistance Boyd |
| H | 19.38 mm (0.7630 inch) | 11.43 mm (0.4500 inch) | |
| Mounting | PCB | SMD Pad | |
| Thermal Resistance | 11 °C / W | 11 °C / W | 11 °C / W |
| Device | Passive Heat Sink |
