Infineon Technologies AG Datasheets for Transistors
Transistors are electronic devices made of semiconductor material that amplify a signal or open or close a circuit.
Transistors: Learn more
| Product Name | Notes |
|---|---|
| 1700V IHMB 130mm chopper IGBT Module with IGBT4, AlSiC base-plate and enlarged diode - The best solution for your traction and industry applications Summary of Features T(vjop) = 150°C High... | |
| 1700V IHMB 190mm chopper IGBT Module with IGBT4, AlSiC base-plate and enlarged diode - The best solution for your traction and industry applications. Summary of Features Extended Operation Temperature T(vj... | |
| 2000 V, 60 A Boost EasyPACK™ 3B CoolSiC™ MOSFET Module EasyPACK™ 3B CoolSiC™ MOSFET 2000 V 60 A Boost module with PressFit PIN and NTC. Summary of Features Best in... | |
| 3-Level 1200 V CoolSiC™ MOSFET Easy Module EasyPACK™ 2B 1200 V / 8 mΩ 3-Level module with CoolSiC™ MOSFET with enhanced generation 1, integrated NTC temperature sensor, pre-applied thermal interface... | |
| 4500V IHV, 800 A 190mm chopper IGBT Module with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode and isolated AlSiC Base Plate - The best solution for your traction and industry applications... | |
| 62 mm 1200 V, 400 A chopper IGBT modules are the right choice for your design. Summary of Features Superior solution for frequency controlled inverter drives UL/CSA Certification with UL1557... | |
| 62 mm 1200 V, 450 A chopper IGBT4 module with emitter controlled HE diode. Also available with pre-applied Thermal Interface Material. Summary of Features designed for frequency controlled drives UL/CSA... | |
| 62 mm 1200 V, 450 A chopper IGBT4 module with pre-applied Thermal Interface Material. Summary of Features designed for frequency controlled drives UL/CSA Certification with UL1557 E83336 Overload capability up... | |
| 62 mm 1700 V, 300 A chopper IGBT4 module with emitter controlled HE diode. Also availble with pre-applied Thermal Interface Material. Summary of Features designed for frequency controlled drives UL/CSA... | |
| 62 mm 1700 V, 300 A chopper IGBT4 module with pre-applied Thermal Interface Material. Summary of Features designed for frequency controlled drives UL/CSA Certification with UL1557 E83336 Overload capability up... | |
| 62 mm 1700 V, 800 A Diode IGBT module with EC3. Summary of Features Superior solution for frequency controlled inverter drives UL/CSA Certification with UL1557 E83336 Operating temperature up to... | |
| 6500 V IHV 250 A 130 mm chopper IGBT Module with IGBT3 - The best solution for your traction and industry applications Summary of Features Low VCEsat AlSiC Base... | |
| 6500 V IHV, 500 A 190 mm chopper IGBT Module with IGBT3 - The best solution for your medium voltage and drives applications. Summary of Features Low VCE(sat) AlSiC... | |
| Applications Automotive Automotive secondary power distribution unit Diesel direct injection High-voltage DC-DC converter for electric vehicles Power conversion EasyPACK™ CoolSiC™ Automotive MOSFET 1200V Half Bridge Module EasyPACK™ 1B, 8... | |
| Booster 1200 V CoolSiC™ MOSFET Module EasyPACK™ 1B 1200 V, 33 mΩ and 2 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1, NTC and PressFIT Contact Technology Summary of... | |
| Booster 1200 V CoolSiC™ MOSFET Module EasyPACK™ 1B 1200 V, 33 mΩ and 3 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1, NTC and PressFIT Contact Technology. Summary of... | |
| EasyDUAL™ 1B, 1200 V, 100 A common emitter IGBT module with TRENCHSTOP™ IGBT T7, EC7, Pressfit Pin, and NTC. Summary of Features Easy family with 12mm height Very low stray... | |
| EasyDUAL™ 2B CoolSiC™ MOSFET half-bridge module 1200 V, 11 mΩ G1 with integrated NTC temperature sensor, PressFIT contact technology and pre-applied thermal interface material (TIM). Summary of Features Best-in-class packages... | |
| EasyPACK™ 1B 1200 V, 16 mΩ and 2 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1 and PressFIT Contact Technology. Summary of Features Best-in-class packages with 12 mm height... | |
| EasyPACK™ 1B 1200 V, 33 mΩ and 1 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1, NTC and PressFIT Contact Technology. Summary of Features Easy family with 12mm height... | |
| EasyPACK™ 1B 1200 V, 75 A 3-level phase leg IGBT module with active "Neutral Point Clamp 2" topology, NTC, High Speed IGBT H3 and PressFIT Contact Technology. Summary of Features... | |
| EasyPACK™ 1B CoolSiC™ MOSFET 1200 V, 17 mΩ booster single MPPT module with enhanced generation 1, NTC and PressFIT Contact Technology. Summary of Features Best-in-class packages with 12 mm height... | |
| EasyPACK™ 1B CoolSiC™ MOSFET fourpack module 1200 V, 17 mΩ G1 with NTC and PressFIT contact technology. Summary of Features Best-in-class packages with 12 mm height Leading edge WBG material... | |
| EasyPACK™ 1B CoolSiC™ MOSFET fourpack module 1200 V, 17 mΩ G1 with NTC, pre-applied thermal interface material (TIM) and PressFIT contact technology. Summary of Features Best-in-class packages with 12 mm... | |
| EasyPACK™ 1B CoolSiC™ MOSFET fourpack module 1200 V, 33 mΩ G1 with NTC and PressFIT contact technology. Summary of Features Best-in-class packages with 12 mm height Leading edge WBG material... | |
| EasyPACK™ 1B Module with fast TRENCHSTOP™ IGBT3, Rapid 1 diode and PressFIT / NTC Summary of Features Automotive High Speed IGBT H3 and Rapid 1 Diode Low Switching Losses Low... | |
| EasyPACK™ 2B 1200 V, 200 A 3-level phase leg IGBT module with active "Neutral Point Clamp 2", NTC, High Speed IGBT H3 and PressFIT Contact Technology. Summary of Features Low... | |
| EasyPACK™ 2B 650 V 225 A 3-level phase leg IGBT module with High Speed IGBT H3, NTC, active "Neutral Point Clamp 2", PressFIT Contact Technology and pre-applied Thermal Interface Material. | |
| EasyPACK™ 2B CoolSiC™ MOSFET 3-level module 2000 V, 6 mΩ with NTC temperature sensor, PressFIT Contact Technology and aluminium nitride ceramic. Summary of Features Best in Class packages with 12mm... | |
| EasyPACK™ 3B 1200 V, 500 A three-level NPC2 IGBT module with TRENCHSTOP™ IGBT7 H7, integrated NTC temperature sensor and high current pin. Summary of Features Best in Class packages with... | |
| EasyPACK™ 3B 650 V, 400 A 3-level IGBT module with TRENCHSTOP™ 5, NTC and PressFIT contact technology for 1000V DC PV systems in three level NPC1 topology for up to... | |
| EasyPACK™ 3B 950 V, 400 A ANPC (active neutral point clamping) IGBT module with 1200 V CoolSiC™ diode, TRENCHSTOP™ IGBT7, Emitter Controlled diode, NTC and PressFIT contact technology. Together with... | |
| EasyPACK™ 3B 950 V, 400 A ANPC (active neutral point clamping) IGBT module with TRENCHSTOP™ IGBT7, Emitter Controlled diode, NTC and PressFIT contact technology. Together with FS3L200R10W3S7F_B11, it provides a... | |
| EasyPACK™ 3B CoolSiC™ MOSFET 1200 V, 3 mOhm ANPC module with L7, EC7, integrated NTC temperature sensor and High Current Pin. Summary of Features Easy family with 12mm height enhanced... | |
| EasyPACK™ 3B CoolSiC™ MOSFET fourpack module 1200 V, 11 mΩ with NTC temperature sensor and PressFIT Contact Technology. Summary of Features Best in Class packages with 12mm height Leading edge... | |
| EasyPACK™ 3B CoolSiC™ MOSFET fourpack module 2000 V, 10 mΩ G1 with NTC temperature sensor and PressFIT Contact Technology. Summary of Features Best in Class packages with 12 mm height... | |
| EasyPACK™ 3B, CoolSiC™ MOSFET fourpack module 2000 V, 6 mΩ G1 with NTC temperature sensor and PressFIT Contact Technology Summary of Features Best in Class packages with 12 mm height... | |
| EasyPACK™ 4B 950 V, 600 A 3-Level IGBT module with TRENCHSTOP™ IGBT7 and 1200 V CoolSiC™ Schottky Diode. Summary of Features EasyPACK™ 4B with three substrates ANPC topology with four... | |
| EasyPACK™ 650 V, 100 A booster IGBT module with TRENCHSTOP™ 5 H5, CoolSiC™ Schottky diode, PressFIT contact technology and pre-applied Thermal Interface Material. Summary of Features Increased blocking voltage capability... | |
| EasyPACK™ 650 V, 100 A booster IGBT module with TRENCHSTOP™ 5 H5, CoolSiC™ Schottky diode, solder pins contact technology and pre-applied Thermal Interface Material. Summary of Features Increased blocking voltage... | |
| EconoPACK™ 3 1700 V, 100 A fourpack IGBT module with Trench/Fieldstop IGBT 4, emitter controlled diode, input rectifier and NTC. Summary of Features Low VCEsat with positive temperature coefficient Established... | |
| EconoPACK™ 3 1700 V, 150 A fourpack IGBT module with Trench/Fieldstop IGBT 4, emitter controlled diode, input rectifier and NTC. Summary of Features Low VCEsat with positive temperature coefficient Established... | |
| EconoPACK™ 3 1700 V, 200 A fourpack IGBT module with Trench/Feldstopp IGBT4, Emitter Controlled diode and NTC. Summary of Features Low VCEsat with positive temperature coefficient Established Econo module... | |
| EconoPACK™ 3 1700 V, 200 A fourpack IGBT module with Trench/Fieldstop IGBT 4, emitter controlled diode, input rectifier and NTC. Summary of Features Low VCEsat with positive temperature coefficient Established... | |
| EconoPACK™ 4 1200 V 3-level phase leg IGBT module with fast Trench/Fieldstop IGBT4, "Neutral Point Clamp 2" topology and PressFIT Contact Technology Summary of Features Extended Operation Temperature T(vj op)... | |
| EconoPACK™ 4 1200 V 3-level phase leg IGBT module with fast Trench/Fieldstop IGBT4, "Neutral Point Clamp 2" topology, PressFIT Contact Technology and pre-applied Thermal Interface Material. Summary of Features Extended... | |
| EconoPACK™ 4 1200 V, 400 A 3-level phase leg IGBT module with fast TRENCHSTOP™ IGBT4, "Neutral Point Clamp 2" topology and PressFIT Contact Technology. Also available with Thermal Interface Material. | |
| EconoPACK™ 4 650 V 3-level phase leg IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode and NTC Summary of Features Increased blocking voltage capability to 650 V Extended Operation... | |
| EconoPACK™ 4 650 V 3-level phase leg IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and pre-applied Thermal Interface Material. Summary of Features Increased blocking voltage capability to... | |
| EconoPACK™ 4 650 V three phase chopper IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode and NTC Summary of Features Increased blocking voltage capability to 650 V Extended Operation... | |
| EconoPACK™ 4 650 V, 300 A 3-level phase leg IGBT module with TRENCHSTOP™ IGBT4, Emitter Controlled 4 diode and NTC. Also available with Thermal Interface Material. Summary of Features Increased... | |
| IHV B 3300 V, 1000 A 190mm chopper IGBT Module with IGBT3 - The best solution for your medium voltage and drives applications. Summary of Features High DC Stability High... | |
| PrimePACK™ 2 1200 V, 1200 A dual IGBT module with TRENCHSTOP™ IGBT5 and .XT fast switching interconnection technology, Emitter Controlled 5 diode, NTC and pre-applied Thermal Interface Material. Summary of... | |
| PrimePACK™ 3 1200 V, 1400 A half-bridge dual IGBT module with TRENCHSTOP™ IGBT4, Emitter Controlled 4 diode, NTC, soft switching chip and pre-applied Thermal Interface Material. Summary of Features Extended... | |
| PrimePACK™ 3 1700 V, 1000 A half bridge dual IGBT module with TRENCHSTOP™ IGBT4, NTC and fast switching chip. Also available with pre-applied Thermal Interface Material. Summary of Features Extended... | |
| PrimePACK™ 3 1700 V, 1400 A half-bridge dual IGBT module with TRENCHSTOP™ IGBT4, Emitter Controlled 4 diode, NTC and soft switching chip. Also available with pre-applied Thermal Interface Material. Summary... | |
| PrimePACK™ 3+ 1700 V, 1500 A dual IGBT module with TRENCHSTOP™ IGBT5, .XT interconnection technology, Emitter Controlled 5 diode and NTC. Also available with pre-applied Thermal Interface Material. Summary of... | |
| PrimePACK™ 3+ 1700 V, 1500 A dual IGBT module with TRENCHSTOPTM 5, emitter controlled 5 diode, NTC, .XT interconnection technology and pre-applied Thermal Interface Material. Summary of Features Extended... | |
| PrimePACK™2 1200 V, 1200 A dual IGBT module with .XT fast switching interconnection technology, TRENCHSTOP™ IGBT5, Emitter Controlled 5 diode and NTC. Also available with pre-applied Thermal Interface Material. Summary... | |
| PrimePACK™2 1700 V, 1200 A dual IGBT module with TRENCHSTOP™ IGBT5 and .XT interconnection technology, Emitter Controlled 5 diode and NTC. Summary of Features Extended operating temperature (T vjop =... | |
| PrimePACK™2 1700 V, 1200 A dual IGBT module with TRENCHSTOP™ IGBT5 and .XT interconnection technology, Emitter Controlled 5 diode, NTC and pre-applied Thermal Interface Material. Summary of Features Extended operating... | |
| PrimePACK™2 1700 V, 650 A chopper IGBT module with IGBT4 and NTC. Summary of Features Extended Operation Temperature Tvj op High DC Stability High Current Density Low Switching Losses... | |
| PrimePACK™3 1700 V , 1000 A chopper IGBT module with TRENCHSTOP™ IGBT4 and NTC. Also available with pre-applied Thermal Interface Material. Summary of Features Extended Operation Temperature Tvj op... | |
| PrimePACK™3 1700 V, 1000 A half bridge dual IGBT module with TRENCHSTOP™ IGBT4, NTC and fast switching chip. Pre- applied with Thermal Interface Material. Summary of Features Extended operation temperature... | |
| PrimePACK™3+ 1200 V, 1500 A dual IGBT module with TRENCHSTOPTM IGBT5 and .XT fast switching interconnection technology, Emitter Controlled 5 diode, NTC and pre-applied Thermal Interface Material. Summary of... | |
| PrimePACK™3+ 1200 V, 1500 A dual IGBT module with TRENCHSTOPTM IGBT5 and .XT interconnection technology, Trench/Fieldstop IGBT5, Emitter Controlled 5 diode and NTC. Also available with pre-applied Thermal Interface... | |
| The power module implements the second generation CoolSiC™ Automotive MOSFET 1200 V, optimized for electric drive train applications, from mid- to high-range automotive power classes to high-range commercial, construction, and... | |
| XHP™ 2 1700 V, 1200 A dual IGBT module with .XT interconnection technology and TRENCHSTOP™ IGBT5 for high reliability and robustness, combined with system availability and long lifetime for high... | |
| XHP™ 2 1700 V, 1200 A dual IGBT module with .XT interconnection technology, TRENCHSTOP™ IGBT5 and Thermal Interface Material for high reliability and robustness, combined with system availability and long... |
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