Infineon Technologies AG Datasheets for Bluetooth® Chips
Bluetooth® chips are board level components which broadcast in the 2.4 GHz industrial, scientific, and medical (ISM) radio band.
Bluetooth® Chips: Learn more
| Product Name | Notes |
|---|---|
| 1x1 Dual-band Wi-Fi 4 (802.11n) + Bluetooth® 5.4 combo Infineon’s AIROC™ CYW43012 an ultra-low power single-chip, combo device features 1x1 dual-band 2.4 GHz and 5 GHz Wi-Fi 4 (802.11n) and... | |
| 1x1 Dual-band Wi-Fi 5 (802.11ac) + Bluetooth® 5.0 combo Infineon’s AIROC™ CYW43455 single-chip combo device features 1x1 dual-band 2.4 GHz and 5 GHz Wi-Fi 5 (802.11ac) and Bluetooth® 5.0. The... | |
| 1x1 Dual-band Wi-Fi 5 (802.11ac) + Bluetooth® 5.4 combo Infineon’s AIROC™ CYW4373/CYW4373E/CYW 43732 single-chip combo device features 1x1 dual-band 2.4 GHz and 5 GHz Wi-Fi 5 (802.11ac) and Bluetooth® 5.4. | |
| 1x1 Single-band Wi-Fi 4 (802.11n) + Bluetooth® 5.1 combo Infineon’s AIROC™ CYW43438 single-chip combo device features 1x1 single-band 2.4 GHz Wi-Fi 4 (802.11n) and Bluetooth® 5.1 is a reliable entry-level... | |
| 1x1 single-band Wi-Fi 4 (802.11n) + Bluetooth® 5.1 combo Infineon’s AIROC™ CYW4343W single-chip combo device features 1x1 single-band 2.4 GHz Wi-Fi 4 (802.11n) and Bluetooth® 5.1 is a reliable entry-level... | |
| 1x1 Single-band Wi-Fi 4 (802.11n) + Bluetooth® 5.2 combo Infineon’s AIROC™ CYW43364 features 1x1 single-band 2.4 GHz Wi-Fi 4 (802.11n). When coupled with external MCUs from popular vendors or Linux... | |
| 1x1 Single-band Wi-Fi 4 (802.11n) + Bluetooth® 5.4 combo Infineon’s AIROC™ CYW43439 single-chip combo device features 1x1 single-band 2.4 GHz Wi-Fi 4 (802.11n) and Bluetooth® 5.4 is a reliable entry-level... | |
| 1x1 Wi-Fi 5 and Bluetooth 5.2 Combo for Automotive Applications CYW89373 single-chip device provides the highest level of integration for Automotive wireless systems with integrated single-stream IEEE 802.11a/b/g/n/ac MAC/baseband/radio and... | |
| 1x1 Wi-Fi 6/6E and Bluetooth 5.4 Combo for Automotive Applications CYW89550 is a family of single-chip devices that supports single-stream, dual-band/tri-band, IEEE 802.11ax-compliant Wi-Fi 6/6E, and Bluetooth®/Bluetooth ® Low Energy... | |
| 2x2 + 2x2 RSDB Wi-Fi 6/6E and Bluetooth 5.3 Combo for Automotive Applications CYW89570XR is a family of devices that supports 2x2 + 2x2 RSDB, dual-band/tri-band, IEEE 802.11ax-compliant Wi-Fi 6/6E,... | |
| 2x2 Dual-band Wi-Fi 5 (802.11ac) + Bluetooth® 4.1 combo Infineon’s AIROC™ CYW4354 single-chip combo device features 2x2 dual-band 2.4 GHz and 5 GHz Wi-Fi 5 (802.11ac) and Bluetooth® 4.1. In... | |
| 2x2 Dual-band Wi-Fi 5 (802.11ac) + Bluetooth® 5.0 combo Infineon’s AIROC™ CYW4356 single-chip combo device features 2x2 dual-band 2.4 GHz and 5 GHz Wi-Fi 5 (802.11ac) and Bluetooth® 5.1. In... | |
| 2x2 Dual-band Wi-Fi 5 (802.11ac) + Bluetooth® 5.4 combo Infineon’s AIROC™CYW54591/ 54590 single-chip combo device features 2x2 dual-band 2.4 GHz and 5 GHz Wi-Fi 5 (802.11ac) and Bluetooth® 5.4. In... | |
| 2x2 Wi-Fi 6/6E and Bluetooth 5.3 Combo for Automotive Applications CYW89570 is a family of single-chip devices that supports 2x2 MIMO, dual-band/tri-band, IEEE 802.11ax-compliant Wi-Fi 6/6E, and Bluetooth®/Bluetooth ® Low... | |
| AIROC™ CYW20706 Bluetooth® & Bluetooth® LE system on chip The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using... | |
| AIROC™ CYW20719 Bluetooth® and Bluetooth® LE System on Chip The CYW20719 is a Bluetooth® 5.1-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver with Bluetooth® LE, EDR and BR. | |
| AIROC™ CYW20819 Bluetooth® & Bluetooth® LE system on chip The AIROC™ CYW20819 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using... | |
| AIROC™ CYW20820 Bluetooth® & Bluetooth® LE system on chip The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using... | |
| AIROC™ CYW89820 Automotive Bluetooth® system on chip The AIROC™ CYW89820 Automotive Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for automotive and industrial applications. Manufactured... | |
| Applications 48 V power distribution General purpose motor drive - variating frequency and voltage Solutions for inductive wireless charging above 50 W Designers who used this product also designed with... | |
| Applications Adapters and chargers Consumer electronics Mobile devices and smartphones Refrigeration and freezing AIROC™ CYW20721 Bluetooth® and Bluetooth® LE System on Chip The CYW20721 is a Bluetooth® 5.1-compliant, stand-alone baseband... | |
| Applications Automotive body control module (BCM) Infineon’s AIROC™ CYBLE-212006-01 is a fully certified Bluetooth® LE embedded module based on a proven hardware design and Infineon’s PSOC™ 4-BLE. This module includes... | |
| Applications Consumer electronics | |
| Applications General purpose motor drive - variating frequency and voltage | |
| Applications Home appliances Security Camera and Video Doorbell | |
| Applications Solutions for inductive wireless charging above 50 W Infineon’s AIROC™ CYBLE-333073-02 is a fully certified Bluetooth® LE module based on Infineon’s CYW20835. This embedded module includes a royalty-free Bluetooth® | |
| Bluetooth® LE 5.4 MCU with ARM Cortex M3 dedicated for automotive applications The AIROC™ CYW89072 is an automotive grade Bluetooth® 5.2 compliant MCU. This device features a powerful Cortex®-M3... | |
| Bluetooth® LE 5.4 MCU with Industry’s best range, Dual ARM Cortex M33 dedicated for applications and CAN FD Summary of Features Highly integrated Bluetooth® LE 5.4 MCU 96 MHz ARM... | |
| Bluetooth® LE 5.4 Module with Industry’s best range, ARM® Cortex® -M33 dedicated for applications and CAN FD The CYW20829B0-P4EPI100 is a fully integrated Bluetooth® LE wireless module. The CYW20829B0-P4EPI100 includes... | |
| Bluetooth® LE 5.4 Module with Industry’s best range, ARM® Cortex® -M33 dedicated for applications and CAN FD The CYW20829B0-P4TAI100 is a fully integrated Bluetooth® LE wireless module. The CYW20829B0-P4TAI100 includes... | |
| Dual-Mode Bluetooth and Bluetooth LE 5.4 for Automotive Applications with LE-Audio CYW89310 is a family of single-chip devices that supports Bluetooth®/Bluetooth ® Low Energy 5.4 with LE-Audio Summary of Features... | |
| Home // Products // Wireless Connectivity // AIROC™ Bluetooth® & Multiprotocol // AIROC™ Bluetooth® Modules // CYBLE-012011-00 | |
| Home // Products // Wireless Connectivity // AIROC™ Bluetooth® & Multiprotocol // AIROC™ Bluetooth® Modules // CYBLE-212020-01 | |
| Home // Products // Wireless Connectivity // AIROC™ Bluetooth® & Multiprotocol // AIROC™ Bluetooth® Modules // CYBLE-224116-01 | |
| Home // Products // Wireless Connectivity // AIROC™ Bluetooth® & Multiprotocol // AIROC™ Bluetooth® Modules // CYBT-413061-02 | |
| Home // Products // Wireless Connectivity // AIROC™ Bluetooth® & Multiprotocol // AIROC™ Bluetooth® Modules // CYBT-423060-02 | |
| Home // Products // Wireless Connectivity // AIROC™ Bluetooth® & Multiprotocol // AIROC™ Bluetooth® Modules // CYBT-483062-02 | |
| Infineon’s AIROC™ CYBLE-014008-00 is a fully certified Bluetooth® LE embedded module based on a proven hardware design and Infineon’s PSOC™ 4-BLE. This module includes a royalty-free Bluetooth® stack compatible with... | |
| Infineon’s AIROC™ CYBLE-022001-00 is a fully certified Bluetooth® LE embedded module based on a proven hardware design and Infineon’s PSoC™ 4 MCU with AIROC™ Bluetooth® LE. This module includes... | |
| Infineon’s AIROC™ CYBLE-202007-01 is a fully certified Bluetooth® LE embedded module based on a proven hardware design and Infineon’s PSOC™ 4-BLE. This module includes a royalty-free Bluetooth® stack compatible with... | |
| Infineon’s AIROC™ CYBLE-202013-11 is a fully certified Bluetooth® LE embedded module based on a proven hardware design and Infineon’s PSOC™ 4-BLE. This module includes a royalty-free Bluetooth® stack compatible with... | |
| Infineon’s AIROC™ CYBLE-214015-01 is a fully certified Bluetooth® LE embedded module based on a proven hardware design and Infineon’s PSOC™ 4-BLE. This module includes a royalty-free Bluetooth® stack compatible with... | |
| Infineon’s AIROC™ CYBLE-333074-02 is a fully certified Bluetooth® LE module based on Infineon’s CYW20835. This embedded module includes a royalty-free Bluetooth® stack and is available in 13.31 x 21.89 x... | |
| Infineon’s AIROC™ CYBLE-343072-02 is a fully certified Bluetooth® LE module based on Infineon’s CYW20835. This embedded module includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.2 and is available in... | |
| Infineon’s AIROC™ CYBT-213043-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20819. This embedded module is available in 12 x 16.61 x 1.70 mm SMT form-factor. | |
| Infineon’s AIROC™ CYBT-223058-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20819. This embedded module is available in 11x11x1.7mm SMT form-factor. Infineon’s AIROC™ CYBT-223058-02 module is... | |
| Infineon’s AIROC™ CYBT-243053-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20820. This embedded module is available as a 35-ball package in 12x16.61x1.7mm SMT form-factor. Infineon’s... | |
| Infineon’s AIROC™ CYBT-253059-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20820. This embedded module is available as a 35-ball package in 11x11x1.7mm SMT form-factor. Infineon’s... | |
| Infineon’s AIROC™ CYBT-263064-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20819. This embedded module is available in 12.5 x 19 x 1.95 mm SMT form-factor. | |
| Infineon’s AIROC™ CYBT-263065-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20819. This embedded module is available in 12.5 x 19 x 1.95 mm SMT form-factor. | |
| Infineon’s AIROC™ CYBT-273063-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20819. This embedded module is available in 12.5 x 19 x 1.95 mm SMT form-factor. | |
| Infineon’s AIROC™ CYBT-333032-02 is a fully certified Bluetooth® Smart Ready wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20706 silicon device. This module includes a royalty-free... | |
| Infineon’s AIROC™ CYBT-343026-01 is a fully certified Bluetooth® Smart Ready wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20706 silicon device. This module includes a royalty-free... | |
| Infineon’s AIROC™ CYBT-343151-02 is a fully certified Bluetooth® Smart Ready wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20706 silicon device. This module is ideal for... | |
| Infineon’s AIROC™ CYBT-353027-02 is a fully certified Bluetooth® Smart Ready wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20706 silicon device. This module is ideal for... | |
| Infineon’s AIROC™ CYBT-413055-02 is a fully certified dual mode Bluetooth® BR/EDR and Bluetooth® Low Energy wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20719 silicon device. | |
| RSDB Wi-Fi 5 and Bluetooth 5.3 Combo for Automotive Applications CYW89459 single-chip device provides the highest level of integration for Automotive wireless systems with integrated IEEE 802.11a/b/g/n/ac MAC/baseband/radio and Bluetooth... | |
| The CYW20822–P4EPI040 module offers seamless integration, enhanced performance with Bluetooth® Low-Energy Long-Range (LE-LR) support, and exceptional reliability for a wide range of applications. With the right combination of low power... | |
| The CYW20822–P4TAI040 module offers seamless integration, enhanced performance with Bluetooth® Low-Energy Long-Range (LE-LR) support, and exceptional reliability for a wide range of applications. With the right combination of low power... | |
| Ultra-low Power 1x1 Dual-band Wi-Fi 5 (802.11ac) + Bluetooth® 5.4 combo Infineon’s AIROC™ CYW43022 an ultra-low power single-chip, combo device features 1x1 dual-band 2.4 GHz and 5 GHz Wi-Fi 5... | |
| Wi-Fi 6 / 6E Tri-Band Wi-Fi and Bluetooth® / Bluetooth® Low-Energy 5.4 Combo IC The high-performance, versatile AIROC™ CYW55513 tri-band Wi-Fi 6E and Bluetooth® 5.4 single-chip combo surpasses Wi-Fi- 6/6E... | |
| Wi-Fi 6 1x1 Dual-Band Wi-Fi and Bluetooth® Low-Energy 5.4 Connected MCU The AIROCTM CYW55912 is an ultra-low power single-chip connected MCU that supports 1x1 2.4+5GHz Wi-Fi 6, Bluetooth® Low... | |
| Wi-Fi 6 dual-band 2x2 Wi-Fi and Bluetooth® 5.3 SoC The AIROC™ CYW55572 is part of the Wi-Fi 6 and Bluetooth® 5.3 SoC family. The highly integrated solution supports Wi-Fi 6... | |
| Wi-Fi 6 Dual-Band Wi-Fi and Bluetooth® / Bluetooth® Low-Energy 5.4 Combo IC The high-performance, low-power AIROC™ CYW55512 dual-band Wi-Fi 6 and Bluetooth® 5.4 single-chip combo delivers secure, reliable connectivity that... | |
| Wi-Fi 6 Single-Band Wi-Fi and Bluetooth® / Bluetooth® Low Energy 5.4 Combo IC The AIROC™ CYW55511 is a low-power, high-performance 1x1 single-band (2.4GHz) Wi-Fi 6 and Bluetooth® 5.4 single-chip combo... | |
| Wi-Fi 6 Single-Band Wi-Fi and Bluetooth® Low-Energy 5.4 Connected MCU The AIROCTM CYW55911 is an ultra-low power single-chip connected MCU that supports 1x1 2.4GHz Wi-Fi 6, Bluetooth® Low Energy... | |
| Wi-Fi 6/6E tri-band 2x2 Wi-Fi and Bluetooth® 5.3 SoC The AIROC™ CYW55573 is part of Infineon’s Wi-Fi 6/6E and Bluetooth® 5.3 SoC family. The solution supports Wi-Fi 6/6E features, is... | |
| Wi-Fi 6E 1x1 Tri-Band Wi-Fi and Bluetooth® Low-Energy 5.4 Connected MCU The AIROCTM CYW55913 is an ultra-low power single-chip connected MCU that supports 1x1 2.4+5+6GHz Wi-Fi 6E, Bluetooth® Low... | |
| Wi-Fi 6E tri-band Wi-Fi and Bluetooth® 5.3 SoC The highly-integrated, robust AIROC™ CYW55571 is part of the Wi-Fi 6/6E and Bluetooth® 5.3 SoC family. The powerful solution supports Wi-Fi 6/6E... |