Infineon Technologies AG Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - DF8MR12W1M1HF_B67 DF8MR12W1M1HF_B67

Description
EasyPACK™ 1B 1200 V, 16 mΩ and 2 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1 and PressFIT Contact Technology. Summary of Features Best-in-class packages with 12 mm height Combination of leading edge WBG material and Easy module packages Very low module stray inductance Wide RBSOA 1200 V CoolSiC™ MOSFET with enhanced generation 1 trench technology Enlarged recommended gate drive voltage window from +15…+18 V & 0…-5 V Extended maximum gate-source voltages of +23 V and -10 V Tvjop under overload condition up to 175°C PressFIT pins Integrated NTC temperature sensor Benefits Outstanding module efficiency which enables system cost advantages System efficiency improvement for reduced cooling requirements Enabling higher frequency to Increase power density Best cost performance ratio which leads to reduced system costs Applications Photovoltaic Designers who used this product also designed with 1EDI20N12AF | Gate driver ICs IMBF170R1K0M1 | Silicon Carbide MOSFET Discretes 1EDI20N12AF | Gate driver ICs IMBF170R1K0M1 | Silicon Carbide MOSFET Discretes 1EDI20N12AF | Gate driver ICs IMBF170R1K0M1 | Silicon Carbide MOSFET Discretes
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Description
EasyPACK™ 1B 1200 V, 16 mΩ and 2 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1 and PressFIT Contact Technology. Summary of Features Best-in-class packages with 12 mm height Combination of leading edge WBG material and Easy module packages Very low module stray inductance Wide RBSOA 1200 V CoolSiC™ MOSFET with enhanced generation 1 trench technology Enlarged recommended gate drive voltage window from +15…+18 V & 0…-5 V Extended maximum gate-source voltages of +23 V and -10 V Tvjop under overload condition up to 175°C PressFIT pins Integrated NTC temperature sensor Benefits Outstanding module efficiency which enables system cost advantages System efficiency improvement for reduced cooling requirements Enabling higher frequency to Increase power density Best cost performance ratio which leads to reduced system costs Applications Photovoltaic Designers who used this product also designed with 1EDI20N12AF | Gate driver ICs IMBF170R1K0M1 | Silicon Carbide MOSFET Discretes 1EDI20N12AF | Gate driver ICs IMBF170R1K0M1 | Silicon Carbide MOSFET Discretes 1EDI20N12AF | Gate driver ICs IMBF170R1K0M1 | Silicon Carbide MOSFET Discretes
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Datasheet
Datasheet Summary
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The DF8MR12W1M1HF_B67 is an EasyPACK™ 1B power module integrating CoolSiC™ trench MOSFETs for high-efficiency switching applications, primarily in solar systems. It features PressFIT contacts and an integrated NTC thermistor for temperature monitoring. The module has a 1200 V drain-source voltage rating, with a continuous drain current of 45 A at a case temperature of 65 °C and a peak pulsed current of 100 A. Internal stray inductance is 10 nH, with terminal resistances of 3 mΩ and 2 mΩ between power terminals. The module is mounted using clamps with a force range of 20 to 50 N, weighs 24 g, and operates with a storage temperature range of -40 °C to 125 °C. It meets IEC 60747, IEC 60749, and IEC 60068 industrial application standards, and provides 3 kV RMS insulation voltage with a relative tracking index exceeding 200 and an RTI of 140 °C.

Datasheet Summary
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The DF8MR12W1M1HF_B67 is an EasyPACK™ 1B power module integrating CoolSiC™ trench MOSFETs for high-efficiency switching applications, primarily in solar systems. It features PressFIT contacts and an integrated NTC thermistor for temperature monitoring. The module has a 1200 V drain-source voltage rating, with a continuous drain current of 45 A at a case temperature of 65 °C and a peak pulsed current of 100 A. Internal stray inductance is 10 nH, with terminal resistances of 3 mΩ and 2 mΩ between power terminals. The module is mounted using clamps with a force range of 20 to 50 N, weighs 24 g, and operates with a storage temperature range of -40 °C to 125 °C. It meets IEC 60747, IEC 60749, and IEC 60068 industrial application standards, and provides 3 kV RMS insulation voltage with a relative tracking index exceeding 200 and an RTI of 140 °C.

Suppliers

Company
Product
Description
Supplier Links
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - DF8MR12W1M1HF_B67 - DF8MR12W1M1HF_B67 - Infineon Technologies AG
Neubiberg, Germany
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - DF8MR12W1M1HF_B67
DF8MR12W1M1HF_B67
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - DF8MR12W1M1HF_B67 DF8MR12W1M1HF_B67
EasyPACK™ 1B 1200 V, 16 mΩ and 2 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1 and PressFIT Contact Technology. Summary of Features Best-in-class packages with 12 mm height Combination of leading edge WBG material and Easy module packages Very low module stray inductance Wide RBSOA 1200 V CoolSiC™ MOSFET with enhanced generation 1 trench technology Enlarged recommended gate drive voltage window from +15…+18 V & 0…-5 V Extended maximum gate-source voltages of +23 V and -10 V Tvjop under overload condition up to 175°C PressFIT pins Integrated NTC temperature sensor Benefits Outstanding module efficiency which enables system cost advantages System efficiency improvement for reduced cooling requirements Enabling higher frequency to Increase power density Best cost performance ratio which leads to reduced system costs Applications Photovoltaic Designers who used this product also designed with 1EDI20N12AF | Gate driver ICs IMBF170R1K0M1 | Silicon Carbide MOSFET Discretes 1EDI20N12AF | Gate driver ICs IMBF170R1K0M1 | Silicon Carbide MOSFET Discretes 1EDI20N12AF | Gate driver ICs IMBF170R1K0M1 | Silicon Carbide MOSFET Discretes

EasyPACK™ 1B 1200 V, 16 mΩ and 2 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1 and PressFIT Contact Technology.


Summary of Features

  • Best-in-class packages with 12 mm height
  • Combination of leading edge WBG material and Easy module packages
  • Very low module stray inductance
  • Wide RBSOA
  • 1200 V CoolSiC™ MOSFET with enhanced generation 1 trench technology
  • Enlarged recommended gate drive voltage window from +15…+18 V & 0…-5 V
  • Extended maximum gate-source voltages of +23 V and -10 V
  • Tvjop under overload condition up to 175°C
  • PressFIT pins
  • Integrated NTC temperature sensor

Benefits

  • Outstanding module efficiency which enables system cost advantages
  • System efficiency improvement for reduced cooling requirements
  • Enabling higher frequency to Increase power density
  • Best cost performance ratio which leads to reduced system costs

Applications

  • Photovoltaic

Designers who used this product also designed with


  • 1EDI20N12AF |
    Gate driver ICs
  • IMBF170R1K0M1 |
    Silicon Carbide MOSFET Discretes
  • 1EDI20N12AF |
    Gate driver ICs
  • IMBF170R1K0M1 |
    Silicon Carbide MOSFET Discretes
  • 1EDI20N12AF |
    Gate driver ICs
  • IMBF170R1K0M1 |
    Silicon Carbide MOSFET Discretes
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Metal-Oxide Semiconductor FET (MOSFET)
Product Number DF8MR12W1M1HF_B67
Product Name Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - DF8MR12W1M1HF_B67
Transistor Technology / Material Silicon carbide
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