Infineon Technologies AG Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - DF17MR12W1M1HF_B86 DF17MR12W1M1HF_B86

Description
EasyPACK™ 1B 1200 V, 33 mΩ and 1 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1, NTC and PressFIT Contact Technology. Summary of Features Easy family with 12mm height enhanced generation 1 trench technology Very low module stray inductance Gate-source voltages of +23 V and -10 V Very low stray inductance Overload capabilities up to 175°C PressFIT pins Benefits Easy to design Highest power density by lowest RDS Outstanding module efficiency A low FIT rate for cosmic ray induced fails Applications Photovoltaic
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Description
EasyPACK™ 1B 1200 V, 33 mΩ and 1 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1, NTC and PressFIT Contact Technology. Summary of Features Easy family with 12mm height enhanced generation 1 trench technology Very low module stray inductance Gate-source voltages of +23 V and -10 V Very low stray inductance Overload capabilities up to 175°C PressFIT pins Benefits Easy to design Highest power density by lowest RDS Outstanding module efficiency A low FIT rate for cosmic ray induced fails Applications Photovoltaic
Request a Quote
Datasheet
Datasheet Summary
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EasyPACK™ 1B module containing two 1200 V CoolSiC™ trench MOSFETs with continuous drain currents of 50 A and 25 A, integrated NTC thermistor, and PressFIT terminals. The module has a mass of 24 g and internal inductance of 14 nH. It supports gate-source voltages from -7 V to +20 V and operates with a junction temperature up to 175 °C. The device meets IEC 60747, IEC 60749, and IEC 60068 industrial application standards and features basic insulation per IEC 61140 with a relative tracking index exceeding 200 and a relative temperature index of 140 °C for electrical insulation.

Datasheet Summary
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EasyPACK™ 1B module containing two 1200 V CoolSiC™ trench MOSFETs with continuous drain currents of 50 A and 25 A, integrated NTC thermistor, and PressFIT terminals. The module has a mass of 24 g and internal inductance of 14 nH. It supports gate-source voltages from -7 V to +20 V and operates with a junction temperature up to 175 °C. The device meets IEC 60747, IEC 60749, and IEC 60068 industrial application standards and features basic insulation per IEC 61140 with a relative tracking index exceeding 200 and a relative temperature index of 140 °C for electrical insulation.

Suppliers

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Supplier Links
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - DF17MR12W1M1HF_B86 - DF17MR12W1M1HF_B86 - Infineon Technologies AG
Neubiberg, Germany
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - DF17MR12W1M1HF_B86
DF17MR12W1M1HF_B86
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - DF17MR12W1M1HF_B86 DF17MR12W1M1HF_B86
EasyPACK™ 1B 1200 V, 33 mΩ and 1 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1, NTC and PressFIT Contact Technology. Summary of Features Easy family with 12mm height enhanced generation 1 trench technology Very low module stray inductance Gate-source voltages of +23 V and -10 V Very low stray inductance Overload capabilities up to 175°C PressFIT pins Benefits Easy to design Highest power density by lowest RDS Outstanding module efficiency A low FIT rate for cosmic ray induced fails Applications Photovoltaic

EasyPACK™ 1B 1200 V, 33 mΩ and 1 MPPTs booster module with CoolSiC™ MOSFET enhanced generation 1, NTC and PressFIT Contact Technology.


Summary of Features

  • Easy family with 12mm height
  • enhanced generation 1 trench technology
  • Very low module stray inductance
  • Gate-source voltages of +23 V and -10 V
  • Very low stray inductance
  • Overload capabilities up to 175°C
  • PressFIT pins

Benefits

  • Easy to design
  • Highest power density by lowest RDS
  • Outstanding module efficiency
  • A low FIT rate for cosmic ray induced fails

Applications

  • Photovoltaic
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Metal-Oxide Semiconductor FET (MOSFET)
Product Number DF17MR12W1M1HF_B86
Product Name Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - DF17MR12W1M1HF_B86
Transistor Technology / Material Silicon carbide
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