Richardson RFPD Datasheets for Heat Sinks
Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel.
Heat Sinks: Learn more
| Product Name | Notes |
|---|---|
| 130 Series Crossbar | |
| 130 Series Spring Assembly | |
| 132 Series High-Performance Heat Sinks for Compression Type Devices | |
| 133 SERIES HIGH-PERFORMANCE HEAT SINK FOR COMPRESSION TYPE DEVICES | |
| 139 Series Crossbar | |
| 139 Series Spring Assembly | |
| 143 Series Crossbar | |
| 143 Series Spring Assembly | |
| 144 Series Crossbar | |
| 144 Series Spring Assembly | |
| 145 Series Spring Assembly | |
| High Performance Next Generation Liquid Cold Plate Wakefield Thermal vacuum-brazed liquid cold plates are created by machining two metal plates with interior channels and fin structures (zipper fin), which are... | |
| Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board... | |
| Cup Clips for TO-5 Case Style Semiconductors | |
| Custom radial-Fin heat sink | |
| Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into predrilled circuit boards; scored mounting tabs may be bent after insertion to provide added... | |
| Extruded Heat Sink | |
| Heat Sink Assemblies | |
| High Fin Density Heat Sinks For Power Modules, IGBTs, Relays | |
| High-Efficiency Heat Sinks for Vertical Board Mounting | |
| High-Performance Heat Sinks for Power Modules, IGBTs and Solid State Relays | |
| Keep your ""half brick"" size AT&T and Computer Products power modules cool with these efficient black anodized aluminum heat sinks made for natural or forced convection applications. Deltalink IV is... | |
| Labor-Saving Twisted Fin Heat Sinks | |
| Liquid Cold Plates for Rectifiers and Power Diodes | |
| Liquid Cold Plates for Rectifiers, Diodes, and Power Modules | |
| Low-Cost, Low-Height Wave-solderable Heat Sinks | |
| Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards. Soldered, pre-tinned tabs can be wave soldered directly to the board. A 0.375 in (9.5 mm) mounting slot... | |
| Mounting Hardware for Extruded Heat Sinks. | |
| Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconductor packages. These heat sinks are designed for use where... | |
| Penguin™ Coolers: Pin Fin Heat Sink/Clip Assembly for BGAs and PowerPC™ Packages | |
| Penguin™ Coolers: Unidirectional Fin Heat Sink for BGAs | |
| Performance, Low Profile Heat Sinks for Power Modules & IGBTs | |
| PRICING INCLUDES GROUND TRANSPORTATION FREIGHT WITHIN THE CONTINENTAL U.S. FOR WEB ORDERS ONLY. Please contact Richardson RFPD for higher volume pricing. As the largest stocking distributor for Wakefield-Vette extrusions in... | |
| Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the... | |
| Speed Clips™ | |
| Surface Mount Heat Sinks | |
| The 219 Series heat sinks unique design (Patent Pending) combines the technology of automatically assembling the tin plated solderable wires/rods with that of extruded aluminum anodized heat sink body to... | |
| The 624 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital... | |
| The 624 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital... | |
| The 625 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital... | |
| The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or sink to ambient... | |
| These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style with a maximum height of only 0.375 in (9.4). For added performance, a 271... | |
| This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for improved performance. | |
| Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat dissipation are required. The... | |
| Wakefield Engineering has designed four standard heat sink types for ease of installation and efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount power devices: 465, 476, 486,... | |
| Wakefield- Vette’s exposed tube liquid cold plates ensure minimum thermal resistance between the power device and the cold plate by placing the coolant tube in direct contact with the power... | |
| Wakefield- Vette’s fully buried tube liquid cold plates have the ability to cool both sides of the cold plate because of it’s positioning within the base plate. Another key feature... | |
| Wakefield- Vette’s rolled tube liquid cold plates are usually the most cost effective liquid cold plate solutions. The key attribute for this line of standard cold plates is that the... | |
| With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are recommended for critical space applications where maximum heat dissipation is required for high-power TO-3 case... |
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