Wave-solderable pins on 1 in centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9).
HEAT SINK; Thermal Resistance:5.17°C/W;
| Richardson RFPD | Newark, An Avnet Company | |
|---|---|---|
| Product Category | Heat Sinks | Heat Sinks |
| Product Number | 647-20ABPE | 42M0660 |
| Product Name | Board Level Heat Sink | Heat Sink; Thermal Resistance Wakefield Thermal |
| H | 50.8 mm (2 inch) | 50.8 mm (2 inch) |
| Mounting | PCB | |
| Thermal Resistance | 3.1 °C / W | 5.17 °C / W |
