Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers component thermal specifications.
Heat Sink D²Pak (TO-263), SOL-20, SOT-223, TO-220 Copper 1.0W @ 55°C Top Mount
HEAT SINK; Thermal Resistance:55°C/W; Packages Cooled:SOL-20, SOT-223, TO-220, TO-263; External Width - Metric:18.8mm; External Height - Metric:9.91mm; External Length - Metric:15.2mm; External Diameter - Metric:-; Product Range:- RoHS Compliant: Yes
| Richardson RFPD | DigiKey | Newark, An Avnet Company | |
|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | 217-36CTE6 | 345-1099-ND | 40K3868 |
| Product Name | Board Level Heat Sink | Heat Sinks | Heat Sink; Thermal Resistance Wakefield Thermal |
| H | 9.14 mm (0.3600 inch) | 9.91 mm (0.3902 inch) | |
| Mounting | Surface Mount | SMD Pad | |
| Thermal Resistance | 16 °C / W | 55 °C / W | 55 °C / W |
| Device | Passive Heat Sink |
