Heat Sink TO-3 Aluminum 30.0W @ 55°C Board Level, Extrusion
With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are recommended for critical space applications where maximum heat dissipation is required for high-power TO-3 case styles. Forced convection performance is also exemplary with these double surface fin types. Semiconductor mounting hole style ""F"" offers a single centered 0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for mounting stud-type diodes and rectifiers. Hole pattern ""V"". Material: Aluminum Alloy, Black Anodized.
HEAT SINK, NATURAL CONVECTION, 55°C @ 30W; Thermal Resistance:1.83°C/W;
| DigiKey | Richardson RFPD | Newark, An Avnet Company | |
|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | 403KWW-ND | 403-K | 58F505 |
| Product Name | Heat Sinks | Extruded Heat Sink | Heat Sink, Natural Convection, 55°C @ 30W; Thermal Resistance Wakefield Thermal |
| Device | Passive Heat Sink | ||
| Mounting | Socket | ||
| Thermal Resistance | 0.9000 °C / W | 55 °C / W | 1.83 °C / W |
| Material | Aluminum |
