With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are recommended for critical space applications where maximum heat dissipation is required for high-power TO-3 case styles. Forced convection performance is also exemplary with these double surface fin types. Semiconductor mounting hole style ""F"" offers a single centered 0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for mounting stud-type diodes and rectifiers. Hole pattern ""V"". Material: Aluminum Alloy, Black Anodized.
Heat Sink TO-3 Aluminum 30.0W @ 55°C Board Level, Extrusion
HEAT SINK, NATURAL CONVECTION, 55°C @ 30W; Thermal Resistance:1.83°C/W;
| Richardson RFPD | DigiKey | Newark, An Avnet Company | |
|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | 403-K | 403KWW-ND | 58F505 |
| Product Name | Extruded Heat Sink | Heat Sinks | Heat Sink, Natural Convection, 55°C @ 30W; Thermal Resistance Wakefield Thermal |
| W | 121 mm (4.75 inch) | 121 mm (4.75 inch) | |
| H | 31.75 mm (1.25 inch) | 31.8 mm (1.25 inch) | |
| Thermal Resistance | 55 °C / W | 0.9000 °C / W | 1.83 °C / W |
| Device | Passive Heat Sink |
