The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about 150°C/watt to 22°C/watt.
HEAT SINK; Thermal Resistance:-; Packages Cooled:-; External Width - Metric:6.35mm; External Height - Metric:8.99mm; External Length - Metric:13mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; Product Range:- RoHS Compliant: Yes
| Richardson RFPD | Newark, An Avnet Company | |
|---|---|---|
| Product Category | Heat Sinks | Heat Sinks |
| Product Number | 258 | 46F8613 |
| Product Name | Board Level Heat Sink | Heat Sink; Thermal Resistance Wakefield Thermal |
| H | 12.7 mm (0.5000 inch) | 8.99 mm (0.3539 inch) |
| Mounting | Conventional | |
| Thermal Resistance | 12 °C / W |
