Wakefield Thermal, Inc. Heat Sinks 603K

Heat Sink TO-66 Aluminum 5.0W @ 40°C Board Level

Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary.