Wakefield Thermal, Inc. Board Level Heat Sink 286-CBT

Description
Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into predrilled circuit boards; scored mounting tabs may be bent after insertion to provide added stability. The 286 Series can be wave soldered directly to the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).
Request a Quote Datasheet
Description
Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into predrilled circuit boards; scored mounting tabs may be bent after insertion to provide added stability. The 286 Series can be wave soldered directly to the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Board Level Heat Sink - 286-CBT - Richardson RFPD
Downers Grove, IL, United States
Board Level Heat Sink
286-CBT
Board Level Heat Sink 286-CBT
Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into predrilled circuit boards; scored mounting tabs may be bent after insertion to provide added stability. The 286 Series can be wave soldered directly to the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).

Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into predrilled circuit boards; scored mounting tabs may be bent after insertion to provide added stability. The 286 Series can be wave soldered directly to the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD
Product Category Heat Sinks
Product Number 286-CBT
Product Name Board Level Heat Sink
H 30.23 mm (1.19 inch)
Unlock Full Specs
to access all available technical data

Similar Products

Digifast M.2 NVMe SSD Enclosure, USB3.1 GEN2 Type-C - DGME02B - U-Reach Data Solutions Inc.
Specs
L 102 mm (4.02 inch)
W 35 mm (1.38 inch)
H 11 mm (0.4331 inch)
View Details
Liquid Cooling Heat Sink Base -  - USUSTK LIMITED
Specs
Device Liquid Cooler
Material Copper
View Details
Heat Sinks - 5-1542007-9 - TE Connectivity
Specs
W 50.8 mm (2 inch)
H 22.65 mm (0.8917 inch)
View Details
Forged Heat Sinks - HBP Series - Rego Electronics Inc.
Rego Electronics Inc.
Specs
L 60 to 100 mm (2.36 to 3.94 inch)
W 60 to 100 mm (2.36 to 3.94 inch)
H 6 to 13 mm (0.2362 to 0.5118 inch)
View Details