Richardson RFPD Datasheets for Heat Sinks
Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel.
Heat Sinks: Learn more
| Product Name | Notes |
|---|---|
| Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this... | |
| Excellent Performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type) and reduced assembly cost. | |
| Extruded Heat Sink | |
| High-Performance, High-Power Heat Sinks for Vertical Board Mounting | |
| Penguin™ Coolers: Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™ | |
| PRICING INCLUDES GROUND TRANSPORTATION FREIGHT WITHIN THE CONTINENTAL U.S. FOR WEB ORDERS ONLY. Please contact Richardson RFPD for higher volume pricing. As the largest stocking distributor for Wakefield-Vette extrusions in... | |
| Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the... | |
| SpiderClip™ Heat Sink Assembly for IntelDX4™, AMD AM486DX2, and AM486DX4 | |
| Unidirectional Fin Heat Sink for BGAs |
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