Richardson RFPD Datasheets for Heat Sinks

Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel.
Heat Sinks: Learn more

Page: 1 2 3 4 5 6 7
Product Name Notes
Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this...
Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.
Copper narrow channel style heat sink with integrated clip and locking tab for secure attachment to the device. Single center tab can be soldered directly to the PC board.
Excellent Performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type) and reduced assembly cost.
Extruded Heat Sink
High power extruded heat sink with large radial fins and solderable shoulder pins allows vertical mounting without stress on the device leads. Available with shoulder pins to provide fixed clearance...
High-Efficiency Heat Sinks for Vertical Board Mounting
High-Performance Heat Sinks for Vertical Board Mounting
High-Performance Notched Heat Sinks for Vertical Board Mounting
High-Performance, High-Power Heat Sinks for Vertical Board Mounting
Omnidirectional Pin Fin Heat Sink for BGAs and PowerPCTM
Penguin™ Coolers: Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™
Penguin™ Coolers: Omnidirectional Pin Fin Heat Sink for BGAs
PRICING INCLUDES GROUND TRANSPORTATION FREIGHT WITHIN THE CONTINENTAL U.S. FOR WEB ORDERS ONLY. Please contact Richardson RFPD for higher volume pricing. As the largest stocking distributor for Wakefield-Vette extrusions in...
Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the...
SpiderClip™ Heat Sink Assembly for IntelDX4™, AMD AM486DX2, and AM486DX4
The 624 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital...
The 624 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital...
The 625 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital...
The 642 Series is an unidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital...
The Aavid Thermalloy line of low profile surface mount heat sinks are suitable for SMT power semiconductor devices in D-PAK, D2PAK, D3PAK and SO-10 packages. Their unique design removes heat...
The low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one TO-3 or TO-66 metal...
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220 and TO-218 components. Models are available with or without Wave-Solderable pins on 0.40 in...
Unidirectional Fin Heat Sink for BGAs
Wave-solderable pins on 1 in centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9).
Wave-solderable pins on 1 in centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in (15.9). Use this heat sink where weight and board space occupied...

<< Prev Next >>