Heat Sink BGA Aluminum Top Mount
The 625 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS).
HEAT SINK, ALUMINIUM, 25MM; Thermal Resistance:-; Packages Cooled:BGA; External Width - Metric:25mm; External Height - Metric:-; External Length - Metric:25mm; External Diameter - Metric:-; Heat Sink Material:Aluminium RoHS Compliant: Yes
| DigiKey | Richardson RFPD | Newark, An Avnet Company | |
|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | 345-1109-ND | 625-25ABT4E | 08R0086 |
| Product Name | Heat Sinks | Board Level Heat Sink | Heat Sink, Aluminium, 25Mm; Thermal Resistance Wakefield Thermal |
| Device | Passive Heat Sink | ||
| Weight | 5.44 g (0.1920 oz) | ||
| Mounting | Tape or adhesive compound | Tape or adhesive compound | |
| Thermal Resistance | 12 °C / W | 1.13 °C / W |
