Wakefield Thermal, Inc. Board Level Heat Sink 647-10ABPE

Description
Wave-solderable pins on 1 in centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9).
  • Board Level Heat Sink - 647-10ABPE - Richardson RFPD
    Richardson RFPD
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Description
Wave-solderable pins on 1 in centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9).
Request a Quote Datasheet

Suppliers

Company
Product
Description
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Board Level Heat Sink - 647-10ABPE - Richardson RFPD
Richardson RFPD
Downers Grove, IL, United States
Board Level Heat Sink
647-10ABPE
Board Level Heat Sink 647-10ABPE
Wave-solderable pins on 1 in centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9).

Wave-solderable pins on 1 in centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9).

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD
Product Category Heat Sinks
Product Number 647-10ABPE
Product Name Board Level Heat Sink
H 25.4 mm (1 inch)
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