Wave-solderable pins on 1 in centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9).
| Richardson RFPD | |
|---|---|
| Product Category | Heat Sinks |
| Product Number | 647-10ABPE |
| Product Name | Board Level Heat Sink |
| H | 25.4 mm (1 inch) |