DigiKey Datasheets for Heat Sinks
Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel.
Heat Sinks: Learn more
| Product Name | Notes |
|---|---|
| ACTIVE HEATSINK 100X87X16MM NVID | |
| ACTIVE HEATSINK 60X40X8MM NVIDIA | |
| ACTIVE HEATSINK 63X40X8MM NVIDIA | |
| AMD XILINK HEATSINK K24 41X60X20 | |
| AMD XILINX HEATSINK K26 54X68X10 | |
| AMD XILINX HEATSINK K26 54X68X20 | |
| AMD XILINX HEATSINK K26 54X68X25 | |
| Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount | |
| HEATSINK 100X87X16MM NVIDIA JETS | |
| HEATSINK 60X40X8MM NVIDIA JETSON | |
| HEATSINK 63X40X8MM NVIDIA JETSON | |
| HEATSINK JETSON ORIN NX NANO SUP | |
| HEATSINK NVIDA JETSON AGX XAVIER | |
| HEATSINK NVIDA JETSON ORIN NANO/ | |
| LIQUID ASSISTED FANSINK ASMBLY, | |
| NVIDIA JETSON THOR ACTIVE MODULE | |
| NVIDIA JETSON THOR HEATSINK | |
| PLATE NVIDA TTP ORIN NANO/NX | |
| THERM PLATE NVIDA TTP NANO | |
| THERM PLATE NVIDA TTP XAVIER NX |
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