Digi-Key Electronics Datasheets for Encapsulants and Potting Compounds
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more
| Product Name | Notes |
|---|---|
| ADHESIVE SEAL CLEAR NONCORROSIVE | |
| ADHESIVE SEAL SIL NON-CORROSIVE | |
| ADHESIVE SEAL SIL TRANS FLOWABLE | |
| ADHESIVE SEAL SIL WH FAST CURE | |
| ADHESIVE SEAL SIL WHITE FLOWABLE | |
| ADHESIVE SEALANT SIL BLACK PASTE | |
| ADHESIVE SEALANT SIL GP PASTE | |
| ADHESIVE SEALANT SIL TRANSLUCENT | |
| ADHESIVE SEALANT SIL WHITE PASTE | |
| BLACK EPOXY, POTTING COMPOUND | |
| BLACK FLEXIBLE URETHANE POTTING | |
| BLACK RIGID URETHANE POTTING COM | |
| EPOXY POTTING COMPOUND BLACK/YEL | |
| FLAME RETARDENT EPOXY | |
| HIGH TEMPERATURE EPOXY | |
| POTTING COMPOUND BLACK 200ML | |
| POTTING COMPOUND BLACK 400ML | |
| POTTING COMPOUND BLACK 50ML | |
| POTTING COMPOUND CLEAR 200ML | |
| POTTING COMPOUND CLEAR 400ML | |
| POTTING COMPOUND FLAME RETARDT | |
| POTTING COMPOUND RED HIGH TEMP | |
| POTTING COMPOUND SILICONE 2 PART | |
| SI 5140 METHOXY 300ML CQ/BN | |
| SI 5140 METHOXY 85 GR TB/BN | |
| THERMAL POTTING EPOXY 0.75KG PAC | |
| TRANSLUCENT EPOXY, POTTING COMPO | |
| TWO-PART POTTING COMPOUND 100ML | |
| TWO-PART POTTING COMPOUND 200ML | |
| TWO-PART POTTING COMPOUND 400ML |