Digi-Key Electronics Datasheets for Encapsulants and Potting Compounds

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more

Product Name Notes
ADHESIVE SEAL CLEAR NONCORROSIVE
ADHESIVE SEAL SIL NON-CORROSIVE
ADHESIVE SEAL SIL TRANS FLOWABLE
ADHESIVE SEAL SIL WH FAST CURE
ADHESIVE SEAL SIL WHITE FLOWABLE
ADHESIVE SEALANT SIL BLACK PASTE
ADHESIVE SEALANT SIL GP PASTE
ADHESIVE SEALANT SIL TRANSLUCENT
ADHESIVE SEALANT SIL WHITE PASTE
BLACK EPOXY, POTTING COMPOUND
BLACK FLEXIBLE URETHANE POTTING
BLACK RIGID URETHANE POTTING COM
EPOXY POTTING COMPOUND BLACK/YEL
FLAME RETARDENT EPOXY
HIGH TEMPERATURE EPOXY
POTTING COMPOUND BLACK 200ML
POTTING COMPOUND BLACK 400ML
POTTING COMPOUND BLACK 50ML
POTTING COMPOUND CLEAR 200ML
POTTING COMPOUND CLEAR 400ML
POTTING COMPOUND FLAME RETARDT
POTTING COMPOUND RED HIGH TEMP
POTTING COMPOUND SILICONE 2 PART
SI 5140 METHOXY 300ML CQ/BN
SI 5140 METHOXY 85 GR TB/BN
THERMAL POTTING EPOXY 0.75KG PAC
TRANSLUCENT EPOXY, POTTING COMPO
TWO-PART POTTING COMPOUND 100ML
TWO-PART POTTING COMPOUND 200ML
TWO-PART POTTING COMPOUND 400ML