Ohmite Manufacturing Co. Board Level Heat Sink C126-025-1VE

Description
Ohmite introduces the C series (Pat. Pending). This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-126, TO-220, TO-247 and TO-264 devices. This powerful heat sink provides tool and fixture free assembly operation, largest surface areas and smallest space occupation. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling.
Request a Quote Datasheet
Description
Ohmite introduces the C series (Pat. Pending). This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-126, TO-220, TO-247 and TO-264 devices. This powerful heat sink provides tool and fixture free assembly operation, largest surface areas and smallest space occupation. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Board Level Heat Sink - C126-025-1VE - Richardson RFPD
Downers Grove, IL, United States
Board Level Heat Sink
C126-025-1VE
Board Level Heat Sink C126-025-1VE
Ohmite introduces the C series (Pat. Pending). This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-126, TO-220, TO-247 and TO-264 devices. This powerful heat sink provides tool and fixture free assembly operation, largest surface areas and smallest space occupation. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling.

Ohmite introduces the C series (Pat. Pending). This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-126, TO-220, TO-247 and TO-264 devices. This powerful heat sink provides tool and fixture free assembly operation, largest surface areas and smallest space occupation. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling.

Supplier's Site
Heat Sinks - C126-025-1VE-ND - DigiKey
Thief River Falls, MN, United States
Heat Sink TO-126 Aluminum 3.5W @ 28°C Board Level, Vertical

Heat Sink TO-126 Aluminum 3.5W @ 28°C Board Level, Vertical

Buy Now Datasheet

Technical Specifications

  Richardson RFPD DigiKey
Product Category Heat Sinks Heat Sinks
Product Number C126-025-1VE C126-025-1VE-ND
Product Name Board Level Heat Sink Heat Sinks
H 19.56 mm (0.7700 inch)
Device Passive Heat Sink
Weight 12.7 g (0.4480 oz)
Unlock Full Specs
to access all available technical data

Similar Products

Molybdenum copper series - 80800930 - ToneCooling Technology Co., Ltd
ToneCooling Technology Co., Ltd
Specs
L 90 mm (3.52 inch)
W 89.5 mm (3.52 inch)
H 69 mm (2.72 inch)
View Details
Heatsinks - 9033141 - RS Components, Ltd.
RS Components, Ltd.
Specs
L 200 mm (7.87 inch)
W 215 mm (8.46 inch)
H 77 mm (3.03 inch)
View Details
Stamped Heat Sinks -  - Rego Electronics Inc.
Rego Electronics Inc.
Specs
Device Passive Heat Sink
View Details