The heatsink measures 17 mm in height, 28 mm in width, and 7.5 mm in depth, constructed from aluminum alloy with a black anodized finish. It is designed for use with BGA and PBGAs, making it suitable for cooling applications in CPUs and GPUs. The heatsink can be attached using the included adhesive thermal tape, facilitating easy installation without the need for soldering. It is compliant with RoHS regulations, ensuring it meets environmental standards. The thermal resistance characteristics are not specified in the provided datasheet, which may be a consideration for engineers assessing thermal performance needs.
Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.
Heat Sink BGA, CPU, GPU Aluminum Alloy Top Mount
HEATSINK, 17X28X7.5MM, ALUMINIUM ALLOY; Thermal Resistance:-; Packages Cooled:BGA; External Width - Metric:28mm; External Height - Metric:7.62mm; External Length - Metric:16.8mm; External Diameter - Metric:-; Product Range:BG Series RoHS Compliant: Yes
| Richardson RFPD | DigiKey | Newark, An Avnet Company | |
|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | BGAH170-075E | 273-BGAH170-075E-ND | 52AH8336 |
| Product Name | Board Level Heat Sink | Heat Sinks | Heatsink, 17X28X7.5Mm, Aluminium Alloy; Thermal Resistance Ohmite |
| Device | Passive Heat Sink | ||
| Mounting | Tape or adhesive compound | ||
| Thermal Resistance | 17.1 °C / W | ||
| Material | Aluminum |
