RS Components, Ltd. Datasheets for Solder
Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
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| Product Name | Notes |
|---|---|
| 60/40 tin/lead solder wire with no rosin (colophony) in flux. Resin-free. Low level of flux residue. Minimal flux residues removed by dry brushing. Low odour Wire Diameter = 0.4mm Percent... | |
| 60/40 tin/lead solder wire with no rosin (colophony) in flux. Resin-free. Low level of flux residue. Minimal flux residues removed by dry brushing. Low odour Wire Diameter = 0.7mm Percent... | |
| 60/40 tin/lead solder wire with no rosin (colophony) in flux. Resin-free. Low level of flux residue. Minimal flux residues removed by dry brushing. Low odour Wire Diameter = 1.2mm Percent... | |
| 96SC Crystal 400 No-Clean solder wire with incorporated flux. On a spool. Halide-free. Constant heat, low spatter. High speed soldering, range of activities suitable for all applications. Good spread on... | |
| 97SC alloy with 400 flux core. Halide-free, classification J-STD:ROL0. Designed for processes requiring high long-term reliability. 2.2% flux with limited, transparent residue. Clean, highly reliable soldering. Excellent wetting on copper... | |
| A careful balance of resins and activators provides clear residues without the need for cleaning in most applications. Crystalâ„¢ 400 is halide-free and is suitable for soldering copper, brass and... | |
| A tin/lead solder which exhibits a very sharp (eutectic) melting transition and is ideal for repairs on fabricated boards. Thermal damage to components can be minimised due to lower temperatures. | |
| Activated No-Clean solder alloy with incorporated resinous flux. Designed for industrial applications in the electronics and connector industries. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine content:... | |
| Alloy with extremely low content of impurities and reduced oxidation for high quality soldering. Bar dimensions: 380 x 15 x 8 mm. Percent Lead = 37% Product Form = Granules... | |
| Contains a small amount of copper which reduces wear of soldering iron bits and enables fine copper wires to be soldered more efficiently. 5 cores of Ersin® flux. Reel weight... | |
| Contains flux which can be washed off using water, avoiding the need for CFC-based neutralisers. 3 cores of Hydro-X water soluble flux Wire Diameter = 0.71mm Percent Lead = 40%... | |
| Contains flux which can be washed off using water, avoiding the need for CFC-based neutralisers. 3 cores of Hydro-X water soluble flux Wire Diameter = 1.22mm Percent Lead = 40%... | |
| Contains no lead and a special flux to address the concerns of PCB assemblers who wish to use Rosin-free solders. 5 Cores of Ecosol® 105 Rosin (Colophony) free flux. Fast... | |
| De-soldering braid packaged in static dissipative bobbins. Significantly reduces rework/repair time. Minimises the risk of damage to the board. Patented non-corrosive, halide free, organic no-clean flux. BGA desolder braid is... | |
| Desoldering braid 10 1.0mm - Soldering & Desoldering Tools - Desoldering Wicks & Braids | |
| Desoldering braid 15 1.5mm - Soldering & Desoldering Tools - Desoldering Wicks & Braids | |
| Desoldering braid 20 2.0mm - Soldering & Desoldering Tools - Desoldering Wicks & Braids | |
| Desoldering braid 30 3.0mm - Soldering & Desoldering Tools - Desoldering Wicks & Braids | |
| Desoldering,wick - Soldering & Desoldering Tools - Desoldering Wicks & Braids | |
| Extruded solder containing 60% tin and 40% lead which is ideal for solder baths or pots. The high purity and lack of undesirable elements gives less dross on initial melting,... | |
| Fast, safe, de-soldering braid specifically formulated for use with Lead-free applications More efficient than conventional de-soldering braids. Non-corrosive, ultra high purity no-clean flux. Will not leave ionic contamination on the... | |
| Finely woven pure copper braid, quickly removes excess material during hand soldering rework. Braid is rigid to prevent unwanted flexing, absorbent and will not unravel when bit pressure is placed... | |
| Flux-filled, activated soft soldering wires, halogen content < 1%. Single-core soldering wire for manual soldering in electrical engineering Wire Diameter = 1mm Product Form = Wire Melting Point = +227°C... | |
| General use lead-free solder paste supplied in a 25g syringe. Ideal for lead-free prototype work. For dispensing applications. Compatible with 96SC CR32A GS88 solder paste. Can be left on the... | |
| High purity extruded solder alloy containing 99.3% tin & 0.7% copper, suitable for solder baths or pots. Less dross on initial melting. More solder joints weight for weight. Improved wetting... | |
| High-temperature three-metal alloy Pb93.5 Sn5 Ag1.5. Application: soldering with a high melting point for applications in the lamp, motors, the mechanical industry or soldering that requires a more malleable joint. | |
| Highly pure soldering alloy—60% tin, 40% lead—ideal for soldering baths and soldering pots. Less slag is produced during the initial melting due to the lack of oxides and other undesirable... | |
| Ideal for jointing aluminium, tin-plated brass, nickel, copper or stainless steel but is not suitable for electrical joints. Soft solder with low melting point which enables it to be used... | |
| Ideal for joints which will not be affected during the soldering and reflowing of other nearby joints made with lower temperature solders. 5 cores of Ersin® flux Wire Diameter =... | |
| ISO-Tin electronic solder, eutectic alloy in pressed triangular bars. For all conventional soldering methods, wave soldering, drag soldering and dip soldering Percent Lead = 37% Product Form = Stick Melting... | |
| Lead free solder designed for hand soldering applications. 3% halide-activated non-corrosive rosin flux Wire Diameter = 0.5mm Product Form = Wire Melting Point = +227 - +240°C Percent Tin =... | |
| Lead free solder designed for hand soldering applications. 3% halide-activated non-corrosive rosin flux Wire Diameter = 0.71mm Product Form = Wire Melting Point = +227 - +240°C Percent Tin =... | |
| Lead free solder designed for hand soldering applications. 3% halide-activated non-corrosive rosin flux Wire Diameter = 1.22mm Product Form = Wire Melting Point = +227 - +240°C Percent Tin =... | |
| Lead-free alloy for use with wave soldering machines and tinning crucibles. Complies with Directive RoHS 2002 / 95 / CE. Product Form = Granules Melting Point = +217 - +228°C... | |
| Lead-free alloy for use with wave soldering machines and tinning crucibles. Complies with Directive RoHS 2002 / 95 / CE. Product Form = Wire Melting Point = +228°C Percent Silver... | |
| Lead-free alloy solder wire Sn 95.5 Ag 3.8 Cu 0.7 on plastic coils. Flux core based on modified resin and organic activators. EL version with 3.5% flux, halogen-free, for general... | |
| Lead-free fine grade solder paste for stencil printing applications down to 0.4mm (16 thou) pitch. Clear residue which meets Bellcore TRW-NWT-000078 without post-solder cleaning. Can be printed up to 150mm/s. | |
| LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of... | |
| MOB39 Solder Flux Gel is for descaling surfaces prior to application of solder paste in stencil printing or spot application processes. It is also used for repairing printed circuit boards. | |
| No clean solder paste with low wastage qualities. Halide free flux classification ROL0 to ANSI/J-STD-004. Outstanding humidity resistance. Colourless residue for easy post reflow inspection. Extended open time & tack-life... | |
| No-Clean desoldering wick for repairing SMD circuit boards. Uses a halide-free flux. Very low non-corrosive, clear and hygroscopic residue. Contents in plastic, anti-static, vacuum-packed spools. Width = 0.8mm Length =... | |
| No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Product Form = Paste Melting Point =... | |
| No-Clean solder paste suitable for stencil printing in reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Percent Lead = 36% Product Form =... | |
| No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are designed for soldering connectors to all substrates. RT15 spools with fast wetting are suitable for SMD repairs. | |
| Non-activated No-Clean solder alloy with incorporated resinous flux. Designed for SMD repair applications. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine: 0 %. Flux ratio: 1.5 %. | |
| RA soldering wire with 5 activated colophony cores with 2.5% F-SW 26 flux. Outstanding wetting and spreading properties, also suitable for difficult solders in electrical engineering and electronics. High-purity alloys... | |
| Resin based 60/40 tin/lead solder wire. Clear no clean flux residue. Wets well to all PCB and component finishes. Ideal for wide range of soldering jobs. Superior wetting. Utilising a... | |
| Resin based 60/40 tin/lead solder wire. Utilising a synthetically refined resin. Effective activator package. Clear no clean flux residue. Wets well to all PCB and component finishes. Ideal for wide... | |
| Resin based lower cost lead-free solder wire. Alloy prolongs life of soldering iron tips. Good spread and wetting. Bright solder joints Wire Diameter = 0.4mm Product Form = Wire Melting... | |
| Resin based lower cost lead-free solder wire. Alloy prolongs life of soldering iron tips. Good spread and wetting. Bright solder joints Wire Diameter = 0.8mm Product Form = Wire Melting... | |
| Resin based lower cost lead-free solder wire. Alloy prolongs life of soldering iron tips. Good spread and wetting. Bright solder joints Wire Diameter = 1.2mm Product Form = Wire Melting... | |
| Rosin-free solder for fast and sustained soldering on copper and brass. 5 Cores of Ecosol® 105 Rosin (Colophony) free flux. Similar performance to traditional solders. High activity - no dewetting. | |
| RS Pro solder wire is perfect for various soldering applications. The flux used in this solder wire has been formulated to wet all common PCB and component finishes. The clear... | |
| Sn60 Pb40 alloy for use at high temperatures. Bar dimensions: 380 x 15 x 8 mm. High resistance to oxidation. For use in baths and crucibles. Percent Lead = 40%... | |
| Sn60Pb39Cu1 alloy with flux core. Reduced wear of soldering iron tips, thus more productive soldering of copper wires. Solidus at 183 °C, liquidus at 215 °C. Flux content of 3.5%... | |
| Sn62Pb36Ag2 alloy, solder with low melting point. In contrast with other alloys, already solidus at 179 °C — useful for repairs to manufactured PCBs. Thanks to careful temperature control, heat... | |
| Solder wire 99C Crystal 511. No-Clean solder wire with incorporated flux and clear residue. High speed soldering, range of activities suitable for all applications. Constant heat, low spatter. Wire Diameter... | |
| Soldering agent, alloy Sn40Pb60, with flux core. For manufacturing and repairing metal hardware made from copper and brass. Solid at 183 °C, liquid at 234 °C. Flux model 1.1.2B /... | |
| Soldering wire made from lead-free Sn99Cu0.7NiGe alloy on plastic reels. Flux core based on modified resin and organic activators. EL version with 3.5% flux, halogen-free, for general soldering. RA activated... | |
| Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 0.5mm Percent Lead = 36% Product Form =... | |
| Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 0.5mm Percent Lead = 40% Product Form =... | |
| Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 0.75mm Percent Lead = 40% Product Form =... | |
| Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 1.5mm Percent Lead = 40% Product Form =... | |
| Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 1mm Percent Lead = 40% Product Form =... | |
| Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 1mm Percent Lead = 93% Product Form =... | |
| Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 2mm Percent Lead = 40% Product Form =... | |
| The electronic solder wire HS10 is a proven and reliable product of Stannol research, which was developed to meet high-quality requirements in industrial electronic production and for quick rework. The... | |
| This conductive ‘electric’ paint from Bare Conductive is hugely versatile and suitable for use in a wide range of applications: Trade Name = Electric Paint Package Type = Jar Package... | |
| This lead free solder wire from RS is a great value, low cost alternative to the more expensive, branded solder wire available. Of course, lower cost does not mean a... | |
| This lead-free solder wire from RS is a resin-based SAC305 solder wire. SAC305 is a specially-formulated lead-free alloy that contains 96.5% tin, 3% silver and 0.5% copper. SAC305 alloy comes... | |
| This no-clean wick (supplied in an antistatic box) dispenses with the need for any sort of cleaning after de-soldering. The copper braiding is covered in a synthetic resin (without halogen)... | |
| This resin-based solder wire is a 60/40 tin/lead solder wire, with the solder flux formulated for wetting all common Printed Circuit Boards (PCBs) and components. The residue left after soldering... | |
| This solder is more suitable for making/repairing copper and brass metalware. 5 cores of Ersin® flux Wire Diameter = 1.63mm Percent Lead = 50 - 60% Product Form = Wire... | |
| This solder is more suitable for making/repairing copper and brass metalware. 5 cores of Ersin® flux Wire Diameter = 2.03mm Percent Lead = 50 - 60% Product Form = Wire... | |
| This solder wire from RS is a resin-based, SAC305 lead free solder wire that utilises a synthetically refined resin and effective activator package. The alloy used in this solder wire... | |
| This solder wire from RS stands apart due to its colophony-free formulation, making it ideal for those who are sensitive to the rosin fumes that are traditionally found in solder... | |
| Three colour coded watertight crimp splices/heat shrink butt connectors covered with dual wall heat shrinkable tubing and hot melt inner liner. They offer excellent strain relief, visual inspection, solvent and... | |
| Tin and silver alloy in packaging suitable for wave soldering machines and tinning crucibles. Bar dimensions: 380 x 15 x 8 mm. Product Form = Granules Melting Point = +221°C... | |
| Tin lead solder, also known as soft solder, is an alloy suitable for high-quality work by professionals to repair or rework intermetallic bonds that require a low melting temperature. This... | |
| Tin, Lead and Silver solder alloy. Incorporated flux with CR type natural resin base, Class 2 (1.6 to 2.6 %). Chlorine content: 1 %. Suitable for SMD and rework applications. | |
| Tin-lead-silver soldering alloy with 2.5% colophony flux core. Pb93Sn5Ag2 solder with high melting point. Particularly suitable for use on products subject to high temperatures such as ovens and engines. The... | |
| Two types of long open time SMT paste for stencilling or dispensing (with syringe). They print below 0.5mm (20 thou) pitch and meet IPC-SF-818 and Bellcore TR-NWT-0000 78 without cleaning. | |
| Typical uses are screen printing of PCBs (for surface mounting of chip and leadless components), fired-on ceramics, and gold/silver-plated surfaces. Methods of heating are hot air, vapour phase, infrared, hot... | |
| Unleaded, No-Clean, Halide-free, pin-testable, humidity resistant solder paste, ideal for Electronics Lead-Free processes & re-work. Wide print process and reflow windows. Long abandon time. Low slump. Clear colourless residues. High... | |
| Very low residue no clean flux for good quality components / PCBs. 2 cores Wire Diameter = 0.7mm Percent Lead = 40% Product Form = Wire Melting Point = +183... | |
| Very low residue no clean flux for good quality components / PCBs. 2 cores Wire Diameter = 1.2mm Percent Lead = 40% Product Form = Wire Melting Point = +183... | |
| WELDING CONSUMABLE SOUDOFER COPPER 2,4MM - Soldering & Desoldering Tools - Solders |
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