RS Components, Ltd. 547297

Non-activated No-Clean solder alloy with incorporated resinous flux. Designed for SMD repair applications. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine: 0 %. Flux ratio: 1.5 %. Class J-STD-004 ROL0. Wire Diameter = 1mm Percent Lead = 37% Product Form = Wire Melting Point = +183°C Percent Tin = 63% Flux Type = Rosin Product Weight = 500g Flux Content Percent = 2.6%