RS Components, Ltd. Datasheets for Filler Alloys and Consumables
Filler metal alloys and consumables used in welding, brazing or soldering include items in rod sheet, wire spool, coated stick, weld stud, powder, preform or paste forms.
Filler Alloys and Consumables: Learn more
Product Name | Notes |
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60/40 tin/lead solder wire with no rosin (colophony) in flux. Resin-free. Low level of flux residue. Minimal flux residues removed by dry brushing. Low odour Wire Diameter = 0.4mm Percent... | |
60/40 tin/lead solder wire with no rosin (colophony) in flux. Resin-free. Low level of flux residue. Minimal flux residues removed by dry brushing. Low odour Wire Diameter = 0.7mm Percent... | |
60/40 tin/lead solder wire with no rosin (colophony) in flux. Resin-free. Low level of flux residue. Minimal flux residues removed by dry brushing. Low odour Wire Diameter = 1.2mm Percent... | |
96SC Crystal 400 No-Clean solder wire with incorporated flux. On a spool. Halide-free. Constant heat, low spatter. High speed soldering, range of activities suitable for all applications. Good spread on... | |
97SC alloy with 400 flux core. Halide-free, classification J-STD:ROL0. Designed for processes requiring high long-term reliability. 2.2% flux with limited, transparent residue. Clean, highly reliable soldering. Excellent wetting on copper... | |
A careful balance of resins and activators provides clear residues without the need for cleaning in most applications. Crystal⢠400 is halide-free and is suitable for soldering copper, brass and... | |
A complete soldering system that provides an environmentally protected shield termination on cables. The soldering system consists a heat shrinkable sleeve containing fluxed solder and a thermoplastic sealing insert at... | |
A one piece soldering system for jointing signal cables and terminating cable screens. The system consists of heat shrinkable sleeve containing a predetermined amount of fluxed solder and a thermoplastic... | |
A quick drying, (5 to 10 min at 20° C) mildly activated flux in a 200 ml aerosol for use when removing and replacing surface mount components. The application of... | |
A range of lead-free solders supplied in handy sized dispensers. The 0.8mm solder wire is quick melting, easy to use, and ideal for use on micro electronics, fine wires, and... | |
A range of wire splices which are solderable and immersion sealed. Minimum Cable Diameter = 0.8mm Maximum Cable Diameter = 2.8mm Sleeve Length = 30.15mm Dielectric Strength = 2kV Minimum... | |
A range of wire splices which are solderable and immersion sealed. Minimum Cable Diameter = 1.3mm Maximum Cable Diameter = 5mm Sleeve Length = 29.6mm Material = PVDF Minimum Operating... | |
A tin/lead solder which exhibits a very sharp (eutectic) melting transition and is ideal for repairs on fabricated boards. Thermal damage to components can be minimised due to lower temperatures. | |
Activated No-Clean solder alloy with incorporated resinous flux. Designed for industrial applications in the electronics and connector industries. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine content:... | |
Alloy with extremely low content of impurities and reduced oxidation for high quality soldering. Bar dimensions: 380 x 15 x 8 mm. Percent Lead = 37% Product Form = Granules... | |
B-050 solder sleeves are a controlled soldering device terminating ground wires of an electrical cable to tin-plated or bare copper with an insulation rate of +105°C or higher. Minimum Cable... | |
Chisel tip marker provides exact delivery of flux to surface. Suitable for soldering applications where water soluble flux is required. Applies a neutral pH organic water soluble flux for rapid... | |
Commercial Shield Termination with 22 AWG Preinstalled Lead Heat Shrinkable radiation cross linked modifoed polyolefin material. Thermally stabilized thermoplastic meltable sealing ring. Designd for termination of a bare or tin... | |
Consists of copper net with flux F-SW32. Special surface treatment allowing efficient solder removal. 1.6m coil. 2.5mm wide Width = 2.5mm Length = 1.6m | |
Contains a small amount of copper which reduces wear of soldering iron bits and enables fine copper wires to be soldered more efficiently. 5 cores of Ersin® flux. Reel weight... | |
Contains flux which can be washed off using water, avoiding the need for CFC-based neutralisers. 3 cores of Hydro-X water soluble flux Wire Diameter = 0.71mm Percent Lead = 40%... | |
Contains flux which can be washed off using water, avoiding the need for CFC-based neutralisers. 3 cores of Hydro-X water soluble flux Wire Diameter = 1.22mm Percent Lead = 40%... | |
Contains no lead and a special flux to address the concerns of PCB assemblers who wish to use Rosin-free solders. 5 Cores of Ecosol® 105 Rosin (Colophony) free flux. Fast... | |
D-142 compact terminals allow earth tags to be created on screened cables and are compatible with many dielectric and insulating materials, even those that are heat-sensitive. The solder connections are... | |
De-soldering braid packaged in static dissipative bobbins. Significantly reduces rework/repair time. Minimises the risk of damage to the board. Patented non-corrosive, halide free, organic no-clean flux. BGA desolder braid is... | |
Desoldering braid 10 1.0mm - Soldering & Desoldering Tools - Desoldering Wicks & Braids | |
Desoldering braid 15 1.5mm - Soldering & Desoldering Tools - Desoldering Wicks & Braids | |
Desoldering braid 20 2.0mm - Soldering & Desoldering Tools - Desoldering Wicks & Braids | |
Desoldering braid 30 3.0mm - Soldering & Desoldering Tools - Desoldering Wicks & Braids | |
Desoldering,wick - Soldering & Desoldering Tools - Desoldering Wicks & Braids | |
Each terminator consists of heatshrinkable sleeve containing prefluxed solder preform. To install, simply position the terminator over the pre-stripped wire/pin and apply heat. The sleeve will shrink and the solder... | |
Extruded solder containing 60% tin and 40% lead which is ideal for solder baths or pots. The high purity and lack of undesirable elements gives less dross on initial melting,... | |
Fast, safe, de-soldering braid specifically formulated for use with Lead-free applications More efficient than conventional de-soldering braids. Non-corrosive, ultra high purity no-clean flux. Will not leave ionic contamination on the... | |
Finely woven pure copper braid, quickly removes excess material during hand soldering rework. Braid is rigid to prevent unwanted flexing, absorbent and will not unravel when bit pressure is placed... | |
Flexible, solvent resistant latex for masking components, connectors and other items (e.g. pin connectors, adjustable pots, IC sockets) protecting areas against ingress of conformal coating. Also ideal as spot mask... | |
Flexible, solvent resistant latex for masking components, connectors and other items during a conformal coating process and particularly suitable for protection of ingress of conformal coating such as pin connectors... | |
Flux-filled, activated soft soldering wires, halogen content < 1%. Single-core soldering wire for manual soldering in electrical engineering Wire Diameter = 1mm Product Form = Wire Melting Point = +227°C... | |
Formulated for No-Clean applications. Syringe applicator provides exact delivery of flux to surface. Long tack time, extended shelf life. No refrigeration required. Noncorrosive, halide and halogen free. Meets IPC requirements... | |
General use lead-free solder paste supplied in a 25g syringe. Ideal for lead-free prototype work. For dispensing applications. Compatible with 96SC CR32A GS88 solder paste. Can be left on the... | |
Heat shrinkable. Radiation cross-linked modified polyvinylidene fluoride. Thermoplastic meltable rings. Nickel plated copper strands please see 782-2481, 782-2484, 782-2488, 782-2497, 782-2490, 782-2494, 782-2504, 782-2507. Applications include: An environment protected shield... | |
Heat-Shrinkable sleeves that provide strain relief, insulation, moisture resistance and protection for terminations from environmental damage. The transparent heat-shrinkable sleeve contains a pre-measured fluxed solder band and coloured hot-melt glue... | |
High purity extruded solder alloy containing 99.3% tin & 0.7% copper, suitable for solder baths or pots. Less dross on initial melting. More solder joints weight for weight. Improved wetting... | |
High-temperature three-metal alloy Pb93.5 Sn5 Ag1.5. Application: soldering with a high melting point for applications in the lamp, motors, the mechanical industry or soldering that requires a more malleable joint. | |
Highly pure soldering alloyâ60% tin, 40% leadâideal for soldering baths and soldering pots. Less slag is produced during the initial melting due to the lack of oxides and other undesirable... | |
Ideal for BGA rework applications requiring No-Clean Flux. Formulated for No-Clean applications. Syringe applicator provides exact delivery of flux to surface. Long tack time. Extended shelf life. Refrigeration not required. | |
Ideal for jointing aluminium, tin-plated brass, nickel, copper or stainless steel but is not suitable for electrical joints. Soft solder with low melting point which enables it to be used... | |
Ideal for joints which will not be affected during the soldering and reflowing of other nearby joints made with lower temperature solders. 5 cores of Ersin® flux Wire Diameter =... | |
ISO-Tin electronic solder, eutectic alloy in pressed triangular bars. For all conventional soldering methods, wave soldering, drag soldering and dip soldering Percent Lead = 37% Product Form = Stick Melting... | |
Latex gel designed to mask PCB holes and edge contacts prior to soldering. Ideal for temporary sealing of areas requiring further hand soldering or assembly at a later date. Cures... | |
Lead free solder designed for hand soldering applications. 3% halide-activated non-corrosive rosin flux Wire Diameter = 0.5mm Product Form = Wire Melting Point = +227 - +240°C Percent Tin =... | |
Lead free solder designed for hand soldering applications. 3% halide-activated non-corrosive rosin flux Wire Diameter = 0.71mm Product Form = Wire Melting Point = +227 - +240°C Percent Tin =... | |
Lead free solder designed for hand soldering applications. 3% halide-activated non-corrosive rosin flux Wire Diameter = 1.22mm Product Form = Wire Melting Point = +227 - +240°C Percent Tin =... | |
Lead-free alloy for use with wave soldering machines and tinning crucibles. Complies with Directive RoHS 2002 / 95 / CE. Product Form = Granules Melting Point = +217 - +228°C... | |
Lead-free alloy for use with wave soldering machines and tinning crucibles. Complies with Directive RoHS 2002 / 95 / CE. Product Form = Wire Melting Point = +228°C Percent Silver... | |
Lead-free alloy solder wire Sn 95.5 Ag 3.8 Cu 0.7 on plastic coils. Flux core based on modified resin and organic activators. EL version with 3.5% flux, halogen-free, for general... | |
Lead-free fine grade solder paste for stencil printing applications down to 0.4mm (16 thou) pitch. Clear residue which meets Bellcore TRW-NWT-000078 without post-solder cleaning. Can be printed up to 150mm/s. | |
Loctite GC 10 solder paste is a game changer within the industry allowing users to store the paste at room temperature. GC 10 has a shelf life of a year... | |
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of... | |
Mask for protecting printed circuit areas against solder during a wave soldering operation. Polymerisation at ambient temperature or in a dryer not exceeding 60 ° and an exposure time of... | |
MOB39 Solder Flux Gel is for descaling surfaces prior to application of solder paste in stencil printing or spot application processes. It is also used for repairing printed circuit boards. | |
No clean solder paste with low wastage qualities. Halide free flux classification ROL0 to ANSI/J-STD-004. Outstanding humidity resistance. Colourless residue for easy post reflow inspection. Extended open time & tack-life... | |
No-Clean desoldering wick for repairing SMD circuit boards. Uses a halide-free flux. Very low non-corrosive, clear and hygroscopic residue. Contents in plastic, anti-static, vacuum-packed spools. Width = 0.8mm Length =... | |
No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Product Form = Paste Melting Point =... | |
No-Clean solder paste suitable for stencil printing in reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Percent Lead = 36% Product Form =... | |
No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are designed for soldering connectors to all substrates. RT15 spools with fast wetting are suitable for SMD repairs. | |
Non-activated No-Clean solder alloy with incorporated resinous flux. Designed for SMD repair applications. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine: 0 %. Flux ratio: 1.5 %. | |
PCB terminators provide a complete shield with low resistance and matched impedance termination. The terminators come complete with transparent Kynar insulation providing encapsulation, inspectability, strain relief and insulation. A controlled... | |
Pen for precise removal, repair and rework of surface mount devices and any soldering assembly application requiring additional flux. Fine control allows minimal flux application resulting in negligible post-soldering residue. | |
Precision application pens designed for the service and repair engineer to apply small quantities of cleaners, oils and coatings or where application in confined areas is required. Ideal for spot... | |
Prevent soldering protected areas in a wave soldering process by applying temporary cover. Designed to apply smoothly, dry quickly, withstand high lead-free process temperatures, and then be removed easily. Also... | |
Qualified to SAE-AS83519 (Formerly MIL-S-83519. Transparent insulation sleeve. Sleeve provides encapsulation, inspectability, strain relief and insulation. Preflux solder preform provides a controlled soldering process. Heat shrinkable. Radiation cross linked modified... | |
RA soldering wire with 5 activated colophony cores with 2.5% F-SW 26 flux. Outstanding wetting and spreading properties, also suitable for difficult solders in electrical engineering and electronics. High-purity alloys... | |
Resin based 60/40 tin/lead solder wire. Clear no clean flux residue. Wets well to all PCB and component finishes. Ideal for wide range of soldering jobs. Superior wetting. Utilising a... | |
Resin based 60/40 tin/lead solder wire. Utilising a synthetically refined resin. Effective activator package. Clear no clean flux residue. Wets well to all PCB and component finishes. Ideal for wide... | |
Resin based lower cost lead-free solder wire. Alloy prolongs life of soldering iron tips. Good spread and wetting. Bright solder joints Wire Diameter = 0.4mm Product Form = Wire Melting... | |
Resin based lower cost lead-free solder wire. Alloy prolongs life of soldering iron tips. Good spread and wetting. Bright solder joints Wire Diameter = 0.8mm Product Form = Wire Melting... | |
Resin based lower cost lead-free solder wire. Alloy prolongs life of soldering iron tips. Good spread and wetting. Bright solder joints Wire Diameter = 1.2mm Product Form = Wire Melting... | |
Rosin-free solder for fast and sustained soldering on copper and brass. 5 Cores of Ecosol® 105 Rosin (Colophony) free flux. Similar performance to traditional solders. High activity - no dewetting. | |
RS Pro solder wire is perfect for various soldering applications. The flux used in this solder wire has been formulated to wet all common PCB and component finishes. The clear... | |
Sn60 Pb40 alloy for use at high temperatures. Bar dimensions: 380 x 15 x 8 mm. High resistance to oxidation. For use in baths and crucibles. Percent Lead = 40%... | |
Sn60Pb39Cu1 alloy with flux core. Reduced wear of soldering iron tips, thus more productive soldering of copper wires. Solidus at 183 °C, liquidus at 215 °C. Flux content of 3.5%... | |
Sn62Pb36Ag2 alloy, solder with low melting point. In contrast with other alloys, already solidus at 179 °C â useful for repairs to manufactured PCBs. Thanks to careful temperature control, heat... | |
Solder sleeve coaxial cable terminators allow a fast, reliable, easy and economical method of attaching leads to the braid and centre conductor to the cables. The insulating and strain relief... | |
Solder sleeve shield connectors provide a fast, reliable method of grounding leads to cable shields. The solder sleeve assembly contains a precisely engineered preform of flux solder inside a transparent... | |
Solder wire 99C Crystal 511. No-Clean solder wire with incorporated flux and clear residue. High speed soldering, range of activities suitable for all applications. Constant heat, low spatter. Wire Diameter... | |
Soldering agent, alloy Sn40Pb60, with flux core. For manufacturing and repairing metal hardware made from copper and brass. Solid at 183 °C, liquid at 234 °C. Flux model 1.1.2B /... | |
Soldering wire made from lead-free Sn99Cu0.7NiGe alloy on plastic reels. Flux core based on modified resin and organic activators. EL version with 3.5% flux, halogen-free, for general soldering. RA activated... | |
Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 0.5mm Percent Lead = 36% Product Form =... | |
Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 0.5mm Percent Lead = 40% Product Form =... | |
Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 0.75mm Percent Lead = 40% Product Form =... | |
Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 1.5mm Percent Lead = 40% Product Form =... | |
Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 1mm Percent Lead = 40% Product Form =... | |
Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 1mm Percent Lead = 93% Product Form =... | |
Soldering wire with 5 halogen-free activated colophony cores. 3.5% flux 1.1.3B, in accordance with DIN EN 29454 Part 1 Wire Diameter = 2mm Percent Lead = 40% Product Form =... | |
SolderSleeve coaxial cable terminators allow easy reliable terminations for various coaxial cable applications. Insulation and strain relieving capabilities SolderSleeve terminators provide the ideal solution to centre conductor breakage problems. SolderSleeve... | |
Specifically formulated for the higher temperature requirements of lead free applications. Syringe applicator provides exact delivery of flux to surface. Long tack time, extended shelf life. No refrigeration required. Noncorrosive,... | |
Temporary latex solder masking agent for protecting PCBâs from solder and flux overflow during soldering. Fast curing (dries tack-free in around 30 minutes). Easy to use - just peel off... | |
The electronic solder wire HS10 is a proven and reliable product of Stannol research, which was developed to meet high-quality requirements in industrial electronic production and for quick rework. The... | |
The high temperature, peelable temporary mask for Lead-free applications making it ideal for on sensitive components Provides short-term, high temperature protection. Can also be used with tin/lead fluxes. Usable within... | |
The Solder Sleeve introduction kit contains various solder sleeves suitable for terminating a wide range of cable and wire constructions from 0.9mm to 15.1mm. Solder Sleeves provide insulated, environmentally sealed,... | |
The ST Series provide environment resistant shield termination on cables. Minimum Cable Diameter = 1.4mm Maximum Cable Diameter = 4mm Sleeve Length = 16.5mm Material = PVDF Minimum Operating Temperature... | |
The ST Series provide environment resistant shield termination on cables. Minimum Cable Diameter = 2.2mm Maximum Cable Diameter = 5mm Sleeve Length = 16.5mm Material = PVDF Minimum Operating Temperature... | |
The ST Series provide environment resistant shield termination on cables. Minimum Cable Diameter = 4.3mm Maximum Cable Diameter = 8mm Sleeve Length = 19.1mm Material = PVDF Minimum Operating Temperature... | |
The Techspray washable solder mask has been designed to provide you with a temporary cover to prevent soldering protected areas in a wave soldering process. The quick drying wondermask applies... | |
These are controlled soldering devices are designed for termination of a bare or tin plated copper shield on a cable having an insulation rated for at least +85 °C. The... | |
These desoldering wicks are supplied in an anti-static case and require no cleaning after desoldering thanks to their copper braiding coated with a special halide-free synthetic resin. Solder is absorbed... | |
These products are made up of a crimp barrel inside an adhesive heat-shrink sleeve. This system allows for in-line splice connections. Protective index: IP67 Minimum Cable Diameter = 2.8mm Maximum... | |
These sealed sleeves enable several wires to be soldered together, for applications where a high degree of reliability is essential. Recommended for locations that would be difficult to access later. | |
These terminals allow connection of wires to component pins, posts, tabs or terminals. Compatible with numerous dielectric and insulating materials, even those that are heat-sensitive. The solder connections are insulated,... | |
These terminals allow earth tags to be created on shielded cables. Compatible with numerous dielectric and insulating materials, even those that are heat-sensitive. The solder connections are insulated, protected and... | |
Theses Solder Sleeves provide an environment protection shield termination on cables. Minimum Cable Diameter = 3.2mm Maximum Cable Diameter = 6mm Sleeve Length = 20.4mm Material = PVDF Minimum Operating... | |
Theses Solder Sleeves provide an environment protection shield termination on cables. Minimum Cable Diameter = 5.7mm Maximum Cable Diameter = 11mm Sleeve Length = 29.75mm Material = PVDF Minimum Operating... | |
Theses Solder Sleeves provide an environment protection shield termination on cables. Minimum Cable Diameter = 8.9mm Maximum Cable Diameter = 14mm Sleeve Length = 29.75mm Material = PVDF Minimum Operating... | |
This conductive âelectricâ paint from Bare Conductive is hugely versatile and suitable for use in a wide range of applications: Trade Name = Electric Paint Package Type = Jar Package... | |
This conductive âelectricâ paint from Bare Conductive is hugely versatile and suitable for use in a wide range of applications: Trade Name = Electric Paint Package Type = Pen Package... | |
This lead free solder wire from RS is a great value, low cost alternative to the more expensive, branded solder wire available. Of course, lower cost does not mean a... | |
This lead-free solder wire from RS is a resin-based SAC305 solder wire. SAC305 is a specially-formulated lead-free alloy that contains 96.5% tin, 3% silver and 0.5% copper. SAC305 alloy comes... | |
This no-clean wick (supplied in an antistatic box) dispenses with the need for any sort of cleaning after de-soldering. The copper braiding is covered in a synthetic resin (without halogen)... | |
This resin-based solder wire is 60/40 tin/lead and is suitable for a wide range of soldering jobs â although the presence of lead makes this solder wire unsuitable for soldering... | |
This resin-based solder wire is a 60/40 tin/lead solder wire, with the solder flux formulated for wetting all common Printed Circuit Boards (PCBs) and components. The residue left after soldering... | |
This solder is more suitable for making/repairing copper and brass metalware. 5 cores of Ersin® flux Wire Diameter = 1.63mm Percent Lead = 50 - 60% Product Form = Wire... | |
This solder is more suitable for making/repairing copper and brass metalware. 5 cores of Ersin® flux Wire Diameter = 2.03mm Percent Lead = 50 - 60% Product Form = Wire... | |
This solder wire from RS is a resin-based, SAC305 lead free solder wire that utilises a synthetically refined resin and effective activator package. The alloy used in this solder wire... | |
This solder wire from RS stands apart due to its colophony-free formulation, making it ideal for those who are sensitive to the rosin fumes that are traditionally found in solder... | |
Three colour coded watertight crimp splices/heat shrink butt connectors covered with dual wall heat shrinkable tubing and hot melt inner liner. They offer excellent strain relief, visual inspection, solvent and... | |
Tin and silver alloy in packaging suitable for wave soldering machines and tinning crucibles. Bar dimensions: 380 x 15 x 8 mm. Product Form = Granules Melting Point = +221°C... | |
Tin lead solder, also known as soft solder, is an alloy suitable for high-quality work by professionals to repair or rework intermetallic bonds that require a low melting temperature. This... | |
Tin, Lead and Silver solder alloy. Incorporated flux with CR type natural resin base, Class 2 (1.6 to 2.6 %). Chlorine content: 1 %. Suitable for SMD and rework applications. | |
Tin-lead-silver soldering alloy with 2.5% colophony flux core. Pb93Sn5Ag2 solder with high melting point. Particularly suitable for use on products subject to high temperatures such as ovens and engines. The... | |
Transparent Insulation Sleeve. Provides Encapsulation, Inspectability, Strain Relief and Insulation. Heat shrinkable, radiation cross linked modified polyolefin. Thermally stabilized thermoplastic. Applications: Designed to splice tin plated or bare copper stranded... | |
Two types of long open time SMT paste for stencilling or dispensing (with syringe). They print below 0.5mm (20 thou) pitch and meet IPC-SF-818 and Bellcore TR-NWT-0000 78 without cleaning. | |
Typical uses are screen printing of PCBs (for surface mounting of chip and leadless components), fired-on ceramics, and gold/silver-plated surfaces. Methods of heating are hot air, vapour phase, infrared, hot... | |
Unleaded, No-Clean, Halide-free, pin-testable, humidity resistant solder paste, ideal for Electronics Lead-Free processes & re-work. Wide print process and reflow windows. Long abandon time. Low slump. Clear colourless residues. High... | |
Very low residue no clean flux for good quality components / PCBs. 2 cores Wire Diameter = 0.7mm Percent Lead = 40% Product Form = Wire Melting Point = +183... | |
Very low residue no clean flux for good quality components / PCBs. 2 cores Wire Diameter = 1.2mm Percent Lead = 40% Product Form = Wire Melting Point = +183... | |
WELDING CONSUMABLE SOUDOFER COPPER 2,4MM - Soldering & Desoldering Tools - Solders | |
WSW SAC L0 solders have been developed to meet the electronics industryâs increasingly stringent quality requirements. WSW SAC L0 lead-free solder wire with Sn3.0Ag0.5Cu alloy. L0 - Halogen-free flux. For... | |
WSW SAC M1 solders have been developed to meet the electronics industryâs increasingly stringent quality requirements. WSW SAC M1 lead-free solder wire with Sn3.0Ag0.5Cu alloy. M1 - Mildly activated flux... |