Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in natural convection applications.
| Richardson RFPD | |
|---|---|
| Product Category | Heat Sinks |
| Product Number | 680-125220 |
| Product Name | Board Level Heat Sink |
| H | 31.75 mm (1.25 inch) |
