The 80AC9173 is a heat sink from Wakefield-Vette's 960 Series, designed for BGA applications. It features a lightweight aluminum alloy construction with a black anodized finish, measuring 19mm in width and 23.11mm in height. The heat sink utilizes a push pin attachment method, allowing for easy and quick installation onto PCBs. The design includes compression springs that ensure a secure grip, making it suitable for various airflow conditions. This heat sink is applicable in multiple industries, including telecommunications, medical, and military. It is RoHS compliant, ensuring it meets environmental standards.
Heat Sink BGA Aluminum Top Mount
Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.
HEAT SINK, ALUMINIUM ALLOY, 0.91", BGA; Thermal Resistance:-; Packages Cooled:BGA; External Width - Metric:19.5mm; External Height - Metric:23.11mm; External Length - Metric:20mm; External Diameter - Metric:- RoHS Compliant: Yes
| DigiKey | Richardson RFPD | Newark, An Avnet Company | |
|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | 345-1755-ND | 960-19-23-S-AB-0 | 80AC9173 |
| Product Name | Heat Sinks | Board Level Heat Sink | Heat Sink, Aluminium Alloy, 0.91, Bga; Thermal Resistance Wakefield Thermal |
| Device | Passive Heat Sink | ||
| Mounting | Socket | ||
| Thermal Resistance | 4.8 °C / W | ||
| Material | Aluminum |
