Richardson RFPD Datasheets for Heat Sinks
Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel.
Heat Sinks: Learn more
| Product Name | Notes |
|---|---|
| 4000 series O-ring tub for the Wolfspeed. XM3 module with MDT pin fin baseplate The 4012D O-ring tub is a double-sided aluminum friction stir welded tub for direct cooling of... | |
| Ohmite introduces the SV-LED Series, high performance, low cost, configurable, scalable and compact power heatsink for LED modules. This powerful, high aspect ratio heatsink comes in two standard heights. It... | |
| Ohmite’s R2 Series (patent pending) heatsink provides a large surface area along with our C Series clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features... | |
| PRICING INCLUDES GROUND TRANSPORTATION FREIGHT WITHIN THE CONTINENTAL U.S. FOR WEB ORDERS ONLY. Please contact Richardson RFPD for higher volume pricing. As the largest stocking distributor for Wakefield-Vette extrusions in... | |
| Q-Bridge Thermal Conductor is manufactured with the highest quality materials for reliable and repeatable performance providing a cost effective thermal management solution. These devices are constructed with Aluminum Nitride (AlN)... | |
| Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the... | |
| Skived Fin heat sinks can be an alternative to extruded heat sinks when looking for a fin density which can’t be achieved by extrusion technology. Skived heat sinks can be... | |
| The TO270WB-COIN is a gold-plated copper coin used as a thermal interface for mounting RF Power transistors to a printed circuit board. The TO270WB-COIN is used in the DE705 RF... | |
| The unique design (patent pending) of the W Series heat sinks combines a tin plated, solderable, integral spring clip with an extruded aluminum heat sink body for an all-in-one solution... | |
| TRANSCLAMP-1 is a clamping device designed to provide improved thermal and electrical performance for RF Power Transistors. The clamp dimensions have been optimized for most “Gemini” packaged RF power transistors. |
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