Encapsulants and Potting Compounds Datasheets

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Encapsulants and Potting Compounds Datasheets From:
Headquarters
Arnold Magnetic Technologies
United States
CHT USA Inc.
United States
DigiKey
United States
ELANTAS PDG, Inc.
United States
Ellsworth Adhesives
Germantown, WI
Master Bond, Inc.
Hackensack, NJ
RS Components, Ltd.
United Kingdom
Shenzhen DeepMaterial Technologies Co., Ltd
China
TE Connectivity
United States
ACCRAbond, Inc.
Olive Branch, MS
Allied Electronics, Inc.
Fort Worth, TX
Aremco Products, Inc.
Valley Cottage, NY
Bluestar Silicones USA Corp.
East Brunswick, NJ
Chemence Inc.
United States
Dampney Company, Inc.
Everett, MA
DuPont Electronics & Imaging
United States
Electro-Lite Corporation
Bethel, CT
Epoxies Etc...
Cranston, RI
Epoxy Technology
United States
GS Polymers, Inc.
Brea, CA
Hapco, Inc.
Hanover, MA
Henkel Corporation - Electronics
Irvine, CA
Henkel Corporation - Industrial
United States
Koford Engineering, LLC
Winchester, OH
LG Chemical of America Inc.
Englewood Cliffs, NJ
MacDermid Alpha Electronics Solutions
United States
Monocrystal, Inc.
Russia
Novagard Solutions
Cleveland, OH
OMEGA Engineering, Inc.
Norwalk, CT
Protavic America, Inc.
Londonderry, NH
R. S. Hughes Company, Inc.
Sunnyvale, CA
Sauereisen, Inc.
Pittsburgh, PA
Techsil Limited
United Kingdom
Wacker Chemical Corp.
Adrian, MI
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