Infineon Technologies AG Wireless Connectivity - AIROC™ Bluetooth® & Multiprotocol - AIROC™ Bluetooth® Modules - CYBLE-333073-02 CYBLE-333073-02

Description
Applications Solutions for inductive wireless charging above 50 W Infineon’s AIROC™ CYBLE-333073-02 is a fully certified Bluetooth® LE module based on Infineon’s CYW20835. This embedded module includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.0 and is available in 13.31 x 21.89 x 1.95 mm SMT form-factor and is certified to FCC, ISED, MIC, and CE regulations. Infineon’s AIROC™ CYBLE-333073-02 module is fully integrated with onboard crystal oscillator, passive components, flash memory, support for an external antenna through a RF solder pad, output and the CYW20835 system on chip. These highly integrated modules are globally certified to support fast time-to-market. Infineon’s AIROC™ CYBLE-333073-02 module complies with Bluetooth® core specification version 5.2 and has gone through Qualification with Required Testing path with Declaration ID D056777 and QDID 176091 . Infineon’s AIROC™ CYBLE-333073-02 module is designed to support a wide spectrum of Bluetooth® applications in home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or Bluetooth® connected IoT areas.
Request a Quote Datasheet
Description
Applications Solutions for inductive wireless charging above 50 W Infineon’s AIROC™ CYBLE-333073-02 is a fully certified Bluetooth® LE module based on Infineon’s CYW20835. This embedded module includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.0 and is available in 13.31 x 21.89 x 1.95 mm SMT form-factor and is certified to FCC, ISED, MIC, and CE regulations. Infineon’s AIROC™ CYBLE-333073-02 module is fully integrated with onboard crystal oscillator, passive components, flash memory, support for an external antenna through a RF solder pad, output and the CYW20835 system on chip. These highly integrated modules are globally certified to support fast time-to-market. Infineon’s AIROC™ CYBLE-333073-02 module complies with Bluetooth® core specification version 5.2 and has gone through Qualification with Required Testing path with Declaration ID D056777 and QDID 176091 . Infineon’s AIROC™ CYBLE-333073-02 module is designed to support a wide spectrum of Bluetooth® applications in home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or Bluetooth® connected IoT areas.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Wireless Connectivity - AIROC™ Bluetooth® & Multiprotocol - AIROC™ Bluetooth® Modules - CYBLE-333073-02 - CYBLE-333073-02 - Infineon Technologies AG
Neubiberg, Germany
Wireless Connectivity - AIROC™ Bluetooth® & Multiprotocol - AIROC™ Bluetooth® Modules - CYBLE-333073-02
CYBLE-333073-02
Wireless Connectivity - AIROC™ Bluetooth® & Multiprotocol - AIROC™ Bluetooth® Modules - CYBLE-333073-02 CYBLE-333073-02
Applications Solutions for inductive wireless charging above 50 W Infineon’s AIROC™ CYBLE-333073-02 is a fully certified Bluetooth® LE module based on Infineon’s CYW20835. This embedded module includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.0 and is available in 13.31 x 21.89 x 1.95 mm SMT form-factor and is certified to FCC, ISED, MIC, and CE regulations. Infineon’s AIROC™ CYBLE-333073-02 module is fully integrated with onboard crystal oscillator, passive components, flash memory, support for an external antenna through a RF solder pad, output and the CYW20835 system on chip. These highly integrated modules are globally certified to support fast time-to-market. Infineon’s AIROC™ CYBLE-333073-02 module complies with Bluetooth® core specification version 5.2 and has gone through Qualification with Required Testing path with Declaration ID D056777 and QDID 176091 . Infineon’s AIROC™ CYBLE-333073-02 module is designed to support a wide spectrum of Bluetooth® applications in home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or Bluetooth® connected IoT areas.

Applications

  • Solutions for inductive wireless charging above 50 W

Infineon’s AIROC™ CYBLE-333073-02 is a fully certified Bluetooth® LE module based on Infineon’s CYW20835. This embedded module includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.0 and is available in 13.31 x 21.89 x 1.95 mm SMT form-factor and is certified to FCC, ISED, MIC, and CE regulations.

Infineon’s AIROC™ CYBLE-333073-02 module is fully integrated with onboard crystal oscillator, passive components, flash memory, support for an external antenna through a RF solder pad, output and the CYW20835 system on chip. These highly integrated modules are globally certified to support fast time-to-market.

Infineon’s AIROC™ CYBLE-333073-02 module complies with Bluetooth® core specification version 5.2 and has gone through Qualification with Required Testing path with Declaration ID D056777 and QDID 176091 .

Infineon’s AIROC™ CYBLE-333073-02 module is designed to support a wide spectrum of Bluetooth® applications in home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or Bluetooth® connected IoT areas.

Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Network and Communication Chips
Product Number CYBLE-333073-02
Product Name Wireless Connectivity - AIROC™ Bluetooth® & Multiprotocol - AIROC™ Bluetooth® Modules - CYBLE-333073-02
Technology Bluetooth
Unlock Full Specs
to access all available technical data

Similar Products

RF and Wireless - RF Switches - BGS12AL74E6327XTSA1 - Shenzhen Shengyu Electronics Technology Limited
Specs
Operating Temperature -30 to 85 C (-22 to 185 F)
View Details
RF Transceiver ICs - BCM20732YT-ND - DigiKey
Infineon Technologies AG
Specs
Device Type Transceiver
Technology Bluetooth
Operating Frequency 2400 MHz
View Details
RF Transceiver ICs - 448-CYW20704UA2KFFB1GTTR-ND - DigiKey
Specs
Device Type Transceiver
Technology Bluetooth
Interface USB
View Details
2 suppliers