Bluetooth® LE 5.4 MCU with ARM Cortex M3 dedicated for automotive applications
The AIROC™ CYW89072 is an automotive grade Bluetooth® 5.2 compliant MCU. This device features a powerful Cortex®-M3 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The microprocessor also includes 848 KB of ROM memory for program storage and boot ROM, 352 KB of RAM for data scratch-pad, and patch RAM code catering to the needs of a variety of automotive applications. This device is capable of automotive grade 2 (–40°C to +105°C) ambient operating temperature performance and is tested to Automotive Electronics Council AEC-Q100 environmental stress guidelines and is manufactured in ISO 9001-approved and TS16949-certified facilities.
Summary of Features
Highly integrated Bluetooth® LE 5.2 MCU
Cortex®-M3 32-bit RISC processor
Embedded ICE-RT debug and JTAG interface units
848 KB ROM
352 KB RAM
2 independent SPI interfaces
1.7 to 3.6 V supply voltage range
Up to 105°C operating temperature
Bluetooth® LE receive sensitivity of -96 dBm
Bluetooth® LE TX Power: up to +9 dBm
Potential Applications
Automotive hands-free radios
Automotive data communications
Keyless entry/remote start/settings
Tire pressure monitoring
Remote sensors/accessories control
Bluetooth® LE 5.4 MCU with ARM Cortex M3 dedicated for automotive applications
The AIROC™ CYW89072 is an automotive grade Bluetooth® 5.2 compliant MCU. This device features a powerful Cortex®-M3 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The microprocessor also includes 848 KB of ROM memory for program storage and boot ROM, 352 KB of RAM for data scratch-pad, and patch RAM code catering to the needs of a variety of automotive applications. This device is capable of automotive grade 2 (–40°C to +105°C) ambient operating temperature performance and is tested to Automotive Electronics Council AEC-Q100 environmental stress guidelines and is manufactured in ISO 9001-approved and TS16949-certified facilities.
Summary of Features
- Highly integrated Bluetooth® LE 5.2 MCU
- Cortex®-M3 32-bit RISC processor
- Embedded ICE-RT debug and JTAG interface units
- 848 KB ROM
- 352 KB RAM
- 2 independent SPI interfaces
- 1.7 to 3.6 V supply voltage range
- Up to 105°C operating temperature
- Bluetooth® LE receive sensitivity of -96 dBm
- Bluetooth® LE TX Power: up to +9 dBm
Potential Applications
- Automotive hands-free radios
- Automotive data communications
- Keyless entry/remote start/settings
- Tire pressure monitoring
- Remote sensors/accessories control
