AIROC™ CYW20706 Bluetooth® & Bluetooth® LE system on chip
The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20706 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.
The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application.
AIROC™ CYW20706 Modules
Infineon's AIROC™ CYW20706 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20706 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYBT-343151-02, CYBT-333032-02, CYBT-343026-01 and CYBT-353027-02 are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications.
Microcontroller
Arm® Cortex®-M3 32-bit RISC processor with
Embedded ICE-RT debug and SWD interface units
352-KB on-chip RAM
Bluetooth® sub-system
Complies with Bluetooth® core specification version 5.2
Declaration ID D054101
QDID 168182
Includes support for BR, EDR, and Bluetooth® LE
LE data rate up to 2 Mbps
Peripherals
Up to 24 GPIOs
I²C, I²S, UART, and PCM interfaces
Support for EEPROM and serial flash interfaces
Integrated low dropout regulators (LDO)
Getting started
CYW20706 Product Guide
CYW20706 Bluetooth® SoC for Embedded Wireless Devices Datasheet
Download ModusToolbox™ Bluetooth® SDK
Join the Wireless Community
Applications
Bringing a whole new lifestyle and health experience to today’s connected citizen
Semiconductor solutions for home entertainment applications
AIROC™ CYW20706 Bluetooth® & Bluetooth® LE system on chip
The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20706 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.
The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application.
AIROC™ CYW20706 Modules
Infineon's AIROC™ CYW20706 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20706 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYBT-343151-02, CYBT-333032-02, CYBT-343026-01 and CYBT-353027-02 are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications.
Microcontroller
- Arm® Cortex®-M3 32-bit RISC processor with
- Embedded ICE-RT debug and SWD interface units
- 352-KB on-chip RAM
Bluetooth® sub-system
- Complies with Bluetooth® core specification version 5.2
- Declaration ID D054101
- QDID 168182
- Includes support for BR, EDR, and Bluetooth® LE
- LE data rate up to 2 Mbps
Peripherals
- Up to 24 GPIOs
- I²C, I²S, UART, and PCM interfaces
- Support for EEPROM and serial flash interfaces
- Integrated low dropout regulators (LDO)
Getting started
- CYW20706 Product Guide
- CYW20706 Bluetooth® SoC for Embedded Wireless Devices Datasheet
- Download ModusToolbox™ Bluetooth® SDK
- Join the Wireless Community
Applications
- Bringing a whole new lifestyle and health experience to today’s connected citizen
- Semiconductor solutions for home entertainment applications
