Infineon Technologies AG Wireless Connectivity - AIROC™ Bluetooth® & Multiprotocol - AIROC™ Bluetooth® LE & Bluetooth® - CYW20820 CYW20820

Description
AIROC™ CYW20820 Bluetooth® & Bluetooth® LE system on chip The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20820 is a highly integrated device which delivers up to 11.5 dBm transmit output power in LE and BR modes and up to 2.5 dBm in EDR mode, reducing the device footprint and the costs associated with implementing Bluetooth® solutions. The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application. AIROC™ CYW20820 Modules Infineon's AIROC™ CYW20820 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20820 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE modules CYBT-243053-02 and CYBT-253059-02 are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications. Microcontroller Powerful Arm® Cortex®-M4 core with a maximum speed of 96 MHz Bluetooth® stack in ROM allowing standalone operation without any external MCU 256-KB on-chip flash 176-KB on-chip RAM 1 MB on-chip ROM Bluetooth® stack, peripheral drivers, security functions built into ROM allowing application to efficiently use on-chip flash AES-128 and True Random Number Generator (TRNG) Security functions in ROM including ECDSA signature verification Over-the-air (OTA) firmware updates Bluetooth® sub-system Complies with Bluetooth® core specification version 5.4 QDID: 217016 DID: D062320 Includes support for BR, EDR 2 Mbps and 3 Mbps, eSCO, Bluetooth LE, and LE 2 Mbps. 5 dBM Tx output power (LE), 11.5 dBM Tx output power (BR), 2.5 dBM Tx output power (EDR) Excellent receiver sensitivity (-94.5 dBm for Bluetooth LE 1 Mbps) Peripherals Up to 22 GPIOs I²C, UART, and PCM interfaces Two Quad-SPI interfaces Auxiliary ADC with up to 28 analog channels Programmable key scan 20 x 8 matrix Three-axis quadrature signal decoder General-purpose timers and PWM Real-time clock (RTC) and watchdog timers (WDT) Getting started CYW20820 Ultra Low Power, BLE/BR/LE Bluetooth® 5.2 SoC Datasheet Download ModusToolbox™ Bluetooth® SDK Join the Wireless Community Applications Adapters and chargers Consumer electronics Convenient, smart, and secure wearables supporting your health and well-being. Cordless power tools and outdoor power equipment Smart speaker designs
Request a Quote Datasheet
Description
AIROC™ CYW20820 Bluetooth® & Bluetooth® LE system on chip The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20820 is a highly integrated device which delivers up to 11.5 dBm transmit output power in LE and BR modes and up to 2.5 dBm in EDR mode, reducing the device footprint and the costs associated with implementing Bluetooth® solutions. The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application. AIROC™ CYW20820 Modules Infineon's AIROC™ CYW20820 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20820 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE modules CYBT-243053-02 and CYBT-253059-02 are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications. Microcontroller Powerful Arm® Cortex®-M4 core with a maximum speed of 96 MHz Bluetooth® stack in ROM allowing standalone operation without any external MCU 256-KB on-chip flash 176-KB on-chip RAM 1 MB on-chip ROM Bluetooth® stack, peripheral drivers, security functions built into ROM allowing application to efficiently use on-chip flash AES-128 and True Random Number Generator (TRNG) Security functions in ROM including ECDSA signature verification Over-the-air (OTA) firmware updates Bluetooth® sub-system Complies with Bluetooth® core specification version 5.4 QDID: 217016 DID: D062320 Includes support for BR, EDR 2 Mbps and 3 Mbps, eSCO, Bluetooth LE, and LE 2 Mbps. 5 dBM Tx output power (LE), 11.5 dBM Tx output power (BR), 2.5 dBM Tx output power (EDR) Excellent receiver sensitivity (-94.5 dBm for Bluetooth LE 1 Mbps) Peripherals Up to 22 GPIOs I²C, UART, and PCM interfaces Two Quad-SPI interfaces Auxiliary ADC with up to 28 analog channels Programmable key scan 20 x 8 matrix Three-axis quadrature signal decoder General-purpose timers and PWM Real-time clock (RTC) and watchdog timers (WDT) Getting started CYW20820 Ultra Low Power, BLE/BR/LE Bluetooth® 5.2 SoC Datasheet Download ModusToolbox™ Bluetooth® SDK Join the Wireless Community Applications Adapters and chargers Consumer electronics Convenient, smart, and secure wearables supporting your health and well-being. Cordless power tools and outdoor power equipment Smart speaker designs
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Wireless Connectivity - AIROC™ Bluetooth® & Multiprotocol - AIROC™ Bluetooth® LE & Bluetooth® - CYW20820 - CYW20820 - Infineon Technologies AG
Neubiberg, Germany
Wireless Connectivity - AIROC™ Bluetooth® & Multiprotocol - AIROC™ Bluetooth® LE & Bluetooth® - CYW20820
CYW20820
Wireless Connectivity - AIROC™ Bluetooth® & Multiprotocol - AIROC™ Bluetooth® LE & Bluetooth® - CYW20820 CYW20820
AIROC™ CYW20820 Bluetooth® & Bluetooth® LE system on chip The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20820 is a highly integrated device which delivers up to 11.5 dBm transmit output power in LE and BR modes and up to 2.5 dBm in EDR mode, reducing the device footprint and the costs associated with implementing Bluetooth® solutions. The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application. AIROC™ CYW20820 Modules Infineon's AIROC™ CYW20820 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20820 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE modules CYBT-243053-02 and CYBT-253059-02 are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications. Microcontroller Powerful Arm® Cortex®-M4 core with a maximum speed of 96 MHz Bluetooth® stack in ROM allowing standalone operation without any external MCU 256-KB on-chip flash 176-KB on-chip RAM 1 MB on-chip ROM Bluetooth® stack, peripheral drivers, security functions built into ROM allowing application to efficiently use on-chip flash AES-128 and True Random Number Generator (TRNG) Security functions in ROM including ECDSA signature verification Over-the-air (OTA) firmware updates Bluetooth® sub-system Complies with Bluetooth® core specification version 5.4 QDID: 217016 DID: D062320 Includes support for BR, EDR 2 Mbps and 3 Mbps, eSCO, Bluetooth LE, and LE 2 Mbps. 5 dBM Tx output power (LE), 11.5 dBM Tx output power (BR), 2.5 dBM Tx output power (EDR) Excellent receiver sensitivity (-94.5 dBm for Bluetooth LE 1 Mbps) Peripherals Up to 22 GPIOs I²C, UART, and PCM interfaces Two Quad-SPI interfaces Auxiliary ADC with up to 28 analog channels Programmable key scan 20 x 8 matrix Three-axis quadrature signal decoder General-purpose timers and PWM Real-time clock (RTC) and watchdog timers (WDT) Getting started CYW20820 Ultra Low Power, BLE/BR/LE Bluetooth® 5.2 SoC Datasheet Download ModusToolbox™ Bluetooth® SDK Join the Wireless Community Applications Adapters and chargers Consumer electronics Convenient, smart, and secure wearables supporting your health and well-being. Cordless power tools and outdoor power equipment Smart speaker designs

AIROC™ CYW20820 Bluetooth® & Bluetooth® LE system on chip

The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20820 is a highly integrated device which delivers up to 11.5 dBm transmit output power in LE and BR modes and up to 2.5 dBm in EDR mode, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.

The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application.

AIROC™ CYW20820 Modules

Infineon's AIROC™ CYW20820 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20820 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE modules CYBT-243053-02 and CYBT-253059-02 are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications.


Microcontroller


  • Powerful Arm® Cortex®-M4 core with a maximum speed of 96 MHz
  • Bluetooth® stack in ROM allowing standalone operation without any external MCU
  • 256-KB on-chip flash
  • 176-KB on-chip RAM
  • 1 MB on-chip ROM
  • Bluetooth® stack, peripheral drivers, security functions built into ROM allowing application to efficiently use on-chip flash
  • AES-128 and True Random Number Generator (TRNG)
  • Security functions in ROM including ECDSA signature verification
  • Over-the-air (OTA) firmware updates

Bluetooth® sub-system


  • Complies with Bluetooth® core specification version 5.4
    • QDID: 217016
    • DID: D062320
  • Includes support for BR, EDR 2 Mbps and 3 Mbps, eSCO, Bluetooth LE, and LE 2 Mbps.
  • 5 dBM Tx output power (LE), 11.5 dBM Tx output power (BR), 2.5 dBM Tx output power (EDR)
  • Excellent receiver sensitivity (-94.5 dBm for Bluetooth LE 1 Mbps)

Peripherals


  • Up to 22 GPIOs
  • I²C, UART, and PCM interfaces
  • Two Quad-SPI interfaces
  • Auxiliary ADC with up to 28 analog channels
  • Programmable key scan 20 x 8 matrix
  • Three-axis quadrature signal decoder
  • General-purpose timers and PWM
  • Real-time clock (RTC) and watchdog timers (WDT)

Getting started


  1. CYW20820 Ultra Low Power, BLE/BR/LE Bluetooth® 5.2 SoC Datasheet
  2. Download ModusToolbox™ Bluetooth® SDK
  3. Join the Wireless Community

Applications

  • Adapters and chargers
  • Consumer electronics
  • Convenient, smart, and secure wearables supporting your health and well-being.
  • Cordless power tools and outdoor power equipment
  • Smart speaker designs
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Network and Communication Chips
Product Number CYW20820
Product Name Wireless Connectivity - AIROC™ Bluetooth® & Multiprotocol - AIROC™ Bluetooth® LE & Bluetooth® - CYW20820
Technology Bluetooth
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