Infineon Technologies AG Wireless Connectivity - AIROC™ Wi-Fi and Wi-Fi+Bluetooth® Combo - Wi-Fi 6/6E (802.11ax) - CYW55573 CYW55573

Description
Wi-Fi 6/6E tri-band 2x2 Wi-Fi and Bluetooth® 5.3 SoC The AIROC™ CYW55573 is part of Infineon’s Wi-Fi 6/6E and Bluetooth® 5.3 SoC family. The solution supports Wi-Fi 6/6E features, is tri-band capable (2.4G, 5G, 6G). Its features improve range, power efficiency, network robustness, and security, while reducing the total Bill of Materials cost and board space. The solution delivers an exceptional high-quality video/audio streaming and seamless connectivity experience in congested network environments and significantly reduces latency by operating in the 6G spectrum. Summary of Features Wi-Fi 6/6E, Tri-band, 2x2 MIMO, release 1 and 2 features: OFDMA, MU-MIMO, TWT, DCM 20/40/80 MHz channels, 1024-QAM, up to 1.2 Gbps PHY data rate STA and Soft AP mode Enhanced range, power savings, network efficiency features Multi-Layer security for protection of individual subsystems through whole product life-cycle Smart coexistence between Wi-Fi and Bluetooth, or to external LTE, 15.4 radio Bluetooth® Bluetooth® 5.3 certified, Dual-mode operation LE audio with Auracast(trademark) broadcast,,LE- 2Mbps, Long Range , Advertising Extensions Bluetooth transmitting option of 20dbm,13dbm or 0 dbm General features Interfaces: WLAN: PCIe, SDIO , Bluetooth®: UART, I2S, PCM Temperature: -40°C to 85°C Package FCBGA 0.65 mm pitch WLCSP: 0.2mm pitch WLBGA: 0.35mm pitch Benefits High-performance beyond Wi-Fi 6/6e requirements Optimizes power in chip level and system level Maximizes network efficiency Extends edge AI and IoT device capabilities with robust connections and extended range Bluetooth® LE audio delivers high-quality audio Multi-layer security & network intelligence for greater protection Accelerates time to market Reduces development costs Datasheet and Evaluation software Datasheet and evaluation software is available to select customers. Contact our sales teams to learn more. Embedded Edge Wi-Fi 6/6E Podcast Applications Microinverter solutions Designers who used this product also designed with S25FS256SAGNFI001 | Quad SPI Flash ISC230N10NM6 | N-Channel Power MOSFET S25FS256SAGMFV003 | Quad SPI Flash IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET S25FS256SAGNFI001 | Quad SPI Flash ISC230N10NM6 | N-Channel Power MOSFET S25FS256SAGMFV003 | Quad SPI Flash IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET S25FS256SAGNFI001 | Quad SPI Flash ISC230N10NM6 | N-Channel Power MOSFET S25FS256SAGMFV003 | Quad SPI Flash IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET
Request a Quote Datasheet
Description
Wi-Fi 6/6E tri-band 2x2 Wi-Fi and Bluetooth® 5.3 SoC The AIROC™ CYW55573 is part of Infineon’s Wi-Fi 6/6E and Bluetooth® 5.3 SoC family. The solution supports Wi-Fi 6/6E features, is tri-band capable (2.4G, 5G, 6G). Its features improve range, power efficiency, network robustness, and security, while reducing the total Bill of Materials cost and board space. The solution delivers an exceptional high-quality video/audio streaming and seamless connectivity experience in congested network environments and significantly reduces latency by operating in the 6G spectrum. Summary of Features Wi-Fi 6/6E, Tri-band, 2x2 MIMO, release 1 and 2 features: OFDMA, MU-MIMO, TWT, DCM 20/40/80 MHz channels, 1024-QAM, up to 1.2 Gbps PHY data rate STA and Soft AP mode Enhanced range, power savings, network efficiency features Multi-Layer security for protection of individual subsystems through whole product life-cycle Smart coexistence between Wi-Fi and Bluetooth, or to external LTE, 15.4 radio Bluetooth® Bluetooth® 5.3 certified, Dual-mode operation LE audio with Auracast(trademark) broadcast,,LE- 2Mbps, Long Range , Advertising Extensions Bluetooth transmitting option of 20dbm,13dbm or 0 dbm General features Interfaces: WLAN: PCIe, SDIO , Bluetooth®: UART, I2S, PCM Temperature: -40°C to 85°C Package FCBGA 0.65 mm pitch WLCSP: 0.2mm pitch WLBGA: 0.35mm pitch Benefits High-performance beyond Wi-Fi 6/6e requirements Optimizes power in chip level and system level Maximizes network efficiency Extends edge AI and IoT device capabilities with robust connections and extended range Bluetooth® LE audio delivers high-quality audio Multi-layer security & network intelligence for greater protection Accelerates time to market Reduces development costs Datasheet and Evaluation software Datasheet and evaluation software is available to select customers. Contact our sales teams to learn more. Embedded Edge Wi-Fi 6/6E Podcast Applications Microinverter solutions Designers who used this product also designed with S25FS256SAGNFI001 | Quad SPI Flash ISC230N10NM6 | N-Channel Power MOSFET S25FS256SAGMFV003 | Quad SPI Flash IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET S25FS256SAGNFI001 | Quad SPI Flash ISC230N10NM6 | N-Channel Power MOSFET S25FS256SAGMFV003 | Quad SPI Flash IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET S25FS256SAGNFI001 | Quad SPI Flash ISC230N10NM6 | N-Channel Power MOSFET S25FS256SAGMFV003 | Quad SPI Flash IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Wireless Connectivity - AIROC™ Wi-Fi and Wi-Fi+Bluetooth® Combo - Wi-Fi 6/6E (802.11ax) - CYW55573 - CYW55573 - Infineon Technologies AG
Neubiberg, Germany
Wireless Connectivity - AIROC™ Wi-Fi and Wi-Fi+Bluetooth® Combo - Wi-Fi 6/6E (802.11ax) - CYW55573
CYW55573
Wireless Connectivity - AIROC™ Wi-Fi and Wi-Fi+Bluetooth® Combo - Wi-Fi 6/6E (802.11ax) - CYW55573 CYW55573
Wi-Fi 6/6E tri-band 2x2 Wi-Fi and Bluetooth® 5.3 SoC The AIROC™ CYW55573 is part of Infineon’s Wi-Fi 6/6E and Bluetooth® 5.3 SoC family. The solution supports Wi-Fi 6/6E features, is tri-band capable (2.4G, 5G, 6G). Its features improve range, power efficiency, network robustness, and security, while reducing the total Bill of Materials cost and board space. The solution delivers an exceptional high-quality video/audio streaming and seamless connectivity experience in congested network environments and significantly reduces latency by operating in the 6G spectrum. Summary of Features Wi-Fi 6/6E, Tri-band, 2x2 MIMO, release 1 and 2 features: OFDMA, MU-MIMO, TWT, DCM 20/40/80 MHz channels, 1024-QAM, up to 1.2 Gbps PHY data rate STA and Soft AP mode Enhanced range, power savings, network efficiency features Multi-Layer security for protection of individual subsystems through whole product life-cycle Smart coexistence between Wi-Fi and Bluetooth, or to external LTE, 15.4 radio Bluetooth® Bluetooth® 5.3 certified, Dual-mode operation LE audio with Auracast(trademark) broadcast,,LE- 2Mbps, Long Range , Advertising Extensions Bluetooth transmitting option of 20dbm,13dbm or 0 dbm General features Interfaces: WLAN: PCIe, SDIO , Bluetooth®: UART, I2S, PCM Temperature: -40°C to 85°C Package FCBGA 0.65 mm pitch WLCSP: 0.2mm pitch WLBGA: 0.35mm pitch Benefits High-performance beyond Wi-Fi 6/6e requirements Optimizes power in chip level and system level Maximizes network efficiency Extends edge AI and IoT device capabilities with robust connections and extended range Bluetooth® LE audio delivers high-quality audio Multi-layer security & network intelligence for greater protection Accelerates time to market Reduces development costs Datasheet and Evaluation software Datasheet and evaluation software is available to select customers. Contact our sales teams to learn more. Embedded Edge Wi-Fi 6/6E Podcast Applications Microinverter solutions Designers who used this product also designed with S25FS256SAGNFI001 | Quad SPI Flash ISC230N10NM6 | N-Channel Power MOSFET S25FS256SAGMFV003 | Quad SPI Flash IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET S25FS256SAGNFI001 | Quad SPI Flash ISC230N10NM6 | N-Channel Power MOSFET S25FS256SAGMFV003 | Quad SPI Flash IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET S25FS256SAGNFI001 | Quad SPI Flash ISC230N10NM6 | N-Channel Power MOSFET S25FS256SAGMFV003 | Quad SPI Flash IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET

Wi-Fi 6/6E tri-band 2x2 Wi-Fi and Bluetooth® 5.3 SoC

The AIROC™ CYW55573 is part of Infineon’s Wi-Fi 6/6E and Bluetooth® 5.3 SoC family. The solution supports Wi-Fi 6/6E features, is tri-band capable (2.4G, 5G, 6G). Its features improve range, power efficiency, network robustness, and security, while reducing the total Bill of Materials cost and board space. The solution delivers an exceptional high-quality video/audio streaming and seamless connectivity experience in congested network environments and significantly reduces latency by operating in the 6G spectrum.


Summary of Features

  • Wi-Fi 6/6E, Tri-band, 2x2 MIMO, release 1 and 2 features: OFDMA, MU-MIMO, TWT, DCM
  • 20/40/80 MHz channels, 1024-QAM, up to 1.2 Gbps PHY data rate
  • STA and Soft AP mode
  • Enhanced range, power savings, network efficiency features
  • Multi-Layer security for protection of individual subsystems through whole product life-cycle
  • Smart coexistence between Wi-Fi and Bluetooth, or to external LTE, 15.4 radio

Bluetooth®

  • Bluetooth® 5.3 certified, Dual-mode operation
  • LE audio with Auracast(trademark) broadcast,,LE- 2Mbps, Long Range , Advertising Extensions
  • Bluetooth transmitting option of 20dbm,13dbm or 0 dbm

General features

  • Interfaces: WLAN: PCIe, SDIO , Bluetooth®: UART, I2S, PCM
  • Temperature: -40°C to 85°C

Package

  • FCBGA 0.65 mm pitch
  • WLCSP: 0.2mm pitch
  • WLBGA: 0.35mm pitch

Benefits

  • High-performance beyond Wi-Fi 6/6e requirements
  • Optimizes power in chip level and system level
  • Maximizes network efficiency
  • Extends edge AI and IoT device capabilities with robust connections and extended range
  • Bluetooth® LE audio delivers high-quality audio
  • Multi-layer security & network intelligence for greater protection
  • Accelerates time to market
  • Reduces development costs

Datasheet and Evaluation software


Datasheet and evaluation software is available to select customers. Contact our sales teams to learn more.


Embedded Edge Wi-Fi 6/6E Podcast


Applications

  • Microinverter solutions

Designers who used this product also designed with


  • S25FS256SAGNFI001 |
    Quad SPI Flash
  • ISC230N10NM6 |
    N-Channel Power MOSFET
  • S25FS256SAGMFV003 |
    Quad SPI Flash
  • IPLK80R750P7 |
    500V-950V CoolMOS™ N-Channel Power MOSFET
  • S25FS256SAGNFI001 |
    Quad SPI Flash
  • ISC230N10NM6 |
    N-Channel Power MOSFET
  • S25FS256SAGMFV003 |
    Quad SPI Flash
  • IPLK80R750P7 |
    500V-950V CoolMOS™ N-Channel Power MOSFET
  • S25FS256SAGNFI001 |
    Quad SPI Flash
  • ISC230N10NM6 |
    N-Channel Power MOSFET
  • S25FS256SAGMFV003 |
    Quad SPI Flash
  • IPLK80R750P7 |
    500V-950V CoolMOS™ N-Channel Power MOSFET
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Network and Communication Chips
Product Number CYW55573
Product Name Wireless Connectivity - AIROC™ Wi-Fi and Wi-Fi+Bluetooth® Combo - Wi-Fi 6/6E (802.11ax) - CYW55573
Technology Bluetooth
Unlock Full Specs
to access all available technical data

Similar Products

RF Transceiver ICs - 448-CYW20738A2KML3G-ND - DigiKey
Specs
Device Type Transceiver
Technology Bluetooth
Supply Voltage 1.2V
View Details
RF Transceiver ICs - 448-CYRF7936-40LFXC-ND - DigiKey
Specs
Device Type Transceiver
Operating Frequency 2400 MHz
Data Rate 1000 kbps
View Details
RF Transceiver ICs - BCM4343W1KUBGT-ND - DigiKey
Infineon Technologies AG
Specs
Device Type Transceiver
Technology Bluetooth; Wi-Fi / WiMAX / Wi-Mesh
Operating Frequency 2400 MHz
View Details