Wi-Fi 6/6E tri-band 2x2 Wi-Fi and Bluetooth® 5.3 SoC
The AIROC™ CYW55573 is part of Infineon’s Wi-Fi 6/6E and Bluetooth® 5.3 SoC family. The solution supports Wi-Fi 6/6E features, is tri-band capable (2.4G, 5G, 6G). Its features improve range, power efficiency, network robustness, and security, while reducing the total Bill of Materials cost and board space. The solution delivers an exceptional high-quality video/audio streaming and seamless connectivity experience in congested network environments and significantly reduces latency by operating in the 6G spectrum.
Summary of Features
Wi-Fi 6/6E, Tri-band, 2x2 MIMO, release 1 and 2 features: OFDMA, MU-MIMO, TWT, DCM
20/40/80 MHz channels, 1024-QAM, up to 1.2 Gbps PHY data rate
STA and Soft AP mode
Enhanced range, power savings, network efficiency features
Multi-Layer security for protection of individual subsystems through whole product life-cycle
Smart coexistence between Wi-Fi and Bluetooth, or to external LTE, 15.4 radio
Bluetooth®
Bluetooth® 5.3 certified, Dual-mode operation
LE audio with Auracast(trademark) broadcast,,LE- 2Mbps, Long Range , Advertising Extensions
Bluetooth transmitting option of 20dbm,13dbm or 0 dbm
General features
Interfaces: WLAN: PCIe, SDIO , Bluetooth®: UART, I2S, PCM
Temperature: -40°C to 85°C
Package
FCBGA 0.65 mm pitch
WLCSP: 0.2mm pitch
WLBGA: 0.35mm pitch
Benefits
High-performance beyond Wi-Fi 6/6e requirements
Optimizes power in chip level and system level
Maximizes network efficiency
Extends edge AI and IoT device capabilities with robust connections and extended range
Bluetooth® LE audio delivers high-quality audio
Multi-layer security & network intelligence for greater protection
Accelerates time to market
Reduces development costs
Datasheet and Evaluation software
Datasheet and evaluation software is available to select customers. Contact our sales teams to learn more.
Embedded Edge Wi-Fi 6/6E Podcast
Applications
Microinverter solutions
Designers who used this product also designed with
S25FS256SAGNFI001 | Quad SPI Flash
ISC230N10NM6 | N-Channel Power MOSFET
S25FS256SAGMFV003 | Quad SPI Flash
IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET
S25FS256SAGNFI001 | Quad SPI Flash
ISC230N10NM6 | N-Channel Power MOSFET
S25FS256SAGMFV003 | Quad SPI Flash
IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET
S25FS256SAGNFI001 | Quad SPI Flash
ISC230N10NM6 | N-Channel Power MOSFET
S25FS256SAGMFV003 | Quad SPI Flash
IPLK80R750P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET
Wi-Fi 6/6E tri-band 2x2 Wi-Fi and Bluetooth® 5.3 SoC
The AIROC™ CYW55573 is part of Infineon’s Wi-Fi 6/6E and Bluetooth® 5.3 SoC family. The solution supports Wi-Fi 6/6E features, is tri-band capable (2.4G, 5G, 6G). Its features improve range, power efficiency, network robustness, and security, while reducing the total Bill of Materials cost and board space. The solution delivers an exceptional high-quality video/audio streaming and seamless connectivity experience in congested network environments and significantly reduces latency by operating in the 6G spectrum.
Summary of Features
- Wi-Fi 6/6E, Tri-band, 2x2 MIMO, release 1 and 2 features: OFDMA, MU-MIMO, TWT, DCM
- 20/40/80 MHz channels, 1024-QAM, up to 1.2 Gbps PHY data rate
- STA and Soft AP mode
- Enhanced range, power savings, network efficiency features
- Multi-Layer security for protection of individual subsystems through whole product life-cycle
- Smart coexistence between Wi-Fi and Bluetooth, or to external LTE, 15.4 radio
Bluetooth®
- Bluetooth® 5.3 certified, Dual-mode operation
- LE audio with Auracast(trademark) broadcast,,LE- 2Mbps, Long Range , Advertising Extensions
- Bluetooth transmitting option of 20dbm,13dbm or 0 dbm
General features
- Interfaces: WLAN: PCIe, SDIO , Bluetooth®: UART, I2S, PCM
- Temperature: -40°C to 85°C
Package
- FCBGA 0.65 mm pitch
- WLCSP: 0.2mm pitch
- WLBGA: 0.35mm pitch
Benefits
- High-performance beyond Wi-Fi 6/6e requirements
- Optimizes power in chip level and system level
- Maximizes network efficiency
- Extends edge AI and IoT device capabilities with robust connections and extended range
- Bluetooth® LE audio delivers high-quality audio
- Multi-layer security & network intelligence for greater protection
- Accelerates time to market
- Reduces development costs
Datasheet and Evaluation software
Datasheet and evaluation software is available to select customers. Contact our sales teams to learn more.
Embedded Edge Wi-Fi 6/6E Podcast
Applications
Designers who used this product also designed with
- S25FS256SAGNFI001 |
Quad SPI Flash
- ISC230N10NM6 |
N-Channel Power MOSFET
- S25FS256SAGMFV003 |
Quad SPI Flash
- IPLK80R750P7 |
500V-950V CoolMOS™ N-Channel Power MOSFET
- S25FS256SAGNFI001 |
Quad SPI Flash
- ISC230N10NM6 |
N-Channel Power MOSFET
- S25FS256SAGMFV003 |
Quad SPI Flash
- IPLK80R750P7 |
500V-950V CoolMOS™ N-Channel Power MOSFET
- S25FS256SAGNFI001 |
Quad SPI Flash
- ISC230N10NM6 |
N-Channel Power MOSFET
- S25FS256SAGMFV003 |
Quad SPI Flash
- IPLK80R750P7 |
500V-950V CoolMOS™ N-Channel Power MOSFET