Ellsworth Adhesives Datasheets for Conductive Compounds

Conductive compounds provide an electrically and/or thermally conductive path between components.
Conductive Compounds: Learn more

Product Name Notes
3M TC-2707 Thermally Conductive Epoxy Adhesive Gray is a two component epoxy that uses aluminum metal filler. It offers high adhesive strength, good gap filling, low viscosity for potting applications,...
3M Thermally Conductive Epoxy Adhesive TC-2810 Cream is a two component, boron nitride filled adhesive that offers low outgassing, good thermal conductivity, and low chloride ion content. 50 mL Duo-Pak...
Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air...
Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at...
Bergquist Gap Pad 5000S35 High Thermal Fiberglass Pad offers conformability, electrical insulation, and tear resistance. The material has tack on both sides making it easy to handle and effective in...
Bergquist Gap Pad VO High Thermal Fiberglass Pad offers conformability, electrical insulation, and tear resistance. The material has tack on one side and is used to manage heat and fill...
Bergquist Gap Pad VO Ultra Soft High Thermal Fiberglass Pad is a highly conformable, electrically isolating material that is used for applications that require minimal pressure and isolation between heat...
Bergquist Hi-Flow 650P Thermally Conductive Polyimide Pad that is used as an insulated barrier between electrical devices and the heat sink. It offers high temperature reliabililty, dielectric strength, and cut-through...
Bergquist Liqui-Bond SA 1800 is a one component, thermally conductive silicone adhesive that is used for structural bonding applications that are exposed to extreme environments. It offers high thermal conductivity...
Bergquist Liqui-Bond SA 2000 is a one component, thermally conductive silicone adhesive that is used for structural bonding applications that are exposed to extreme environments. It cures at elevated temperatures...
Bergquist Poly-Pad 1000 Thermally Conductive Fiberglass with a filled polyester resin, is used for high performance applications and devices that require non-silicone conformal coatings such as power supplies, semiconductors, and...
Bergquist Poly-Pad 400 Thermally Conductive Fiberglass Pad with a filled polyester resin, is used for silicone-sensitive applications and devices that require conformal coatings such as power supplies, semiconductors, and automotive...
Bergquist Poly-Pad K-10 Thermally Conductive Polyimide Pad with a ceramic-filled polyester resin, is used for silicone sensitive applications and devices such as power supplies, semiconductors, and motor controls. It offers...
Bergquist Poly-Pad K-4 Thermally Conductive Polyimide Pad with a ceramic-filled polyester resin, is used for silicone sensitive applications and devices such as power supplies, semiconductors, and motor controls. It offers...
Bergquist SIL-PAD Q-PAD II High Thermal Aluminum Pad is a thermal interface material that is used to replace thermal grease. It provides maximum heat transfer, eliminates dust collection, and has...
Dow DOWSIL™ 1-4173 TC Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It...
Dow DOWSIL™ 1-4173 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used for bonding heat sinks, housings, base plates, lids, and circuit applications. It provides...
Dow DOWSIL™ 1-4173 Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is...
Dow DOWSIL™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It...
Dow DOWSIL™ 3-1818 Thermally Conductive Adhesive Gray is a one component, thixotropic adhesive that is used for bonding with common materials in the electronics industry. It has a fast heat...
Dow DOWSIL™ 3-6651 Thermally Conductive Adhesive is a two component, low viscosity silicone encapsulant. It has good thermal conductivity, low modulus, and 1:1 mix ratio. It is used for the...
Dow DOWSIL™ 3-6751 Thermally Conductive Adhesive Gray is a two component, heat curing, low viscosity silicone that is used to cool electronics, automotives, and power supply applications during thermal transfers.
Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates,...
Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing,...
Dow DOWSIL™ 340 Heat Sink Compound White is a one component, non-curing, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing,...
Dow DOWSIL™ Q1-9226 Thermally Conductive Adhesive Gray is a two component, heat curing, silicone adhesive that is used for bonding with a variety of substrates such as filled plastics, metals,...
Dow DOWSIL™ SC 102 Thermally Conductive Compound White is a one component, non-curing, silicone paste that is used to gap fill material between heat sinks and electronic heat sources. It...
Dow DOWSIL™ SE 1700 W/C Thermally Conductive Adhesive Clear is a two-part non-flowing, heat cure, and high tensile strength adhesive. It is primarily used for sealing ceramic condensers, sealing PCB...
Dow DOWSIL™ SE 4420 Thermally Conductive Adhesive White is a one-part, semi-flowable adhesive. It is designed to provide efficient thermal transfer for the cooling of modules, including telecon and power...
Dow DOWSIL™ SE 4420 White is a one component, moisture cure, thermally conductive silicone adhesive designed to provide the efficient thermal transfer for cooling electronic modules. 330 mL Cartridge.
Dow DOWSIL™ SE 4430 Gray is a low viscosity, thermally conductive elastomer that provides efficient thermal transfer for cooling electronic modules in power supply applications. Part B, 1 kg Bottle.
Dow DOWSIL™ SE 4430 White is a low viscosity, thermally conductive elastomer that provides efficient thermal transfer for cooling electronic modules in power supply applications. Part A, 1 kg Bottle.
Dow DOWSIL™ SE 4486 Thermally Conductive Adhesive is a one component, moisture and heat curing, silicone elastomer that is used for potting power supplies, attaching base plates and heat sinks.
Dow DOWSIL™ SE 9184 White RTV Adhesive is a one component, room temperature curing, silicone adhesive that is used for bonding and thermal transfer for cooling electrical applications. It is...
Dow DOWSIL™ TC-2035 Thermally Conductive Adhesive is a two component, silicone heat curing adhesive with primerless adhesion and low bond line thickness. It offers outstanding dielectric properties, stable performance at...
Dow DOWSIL™ TC-4025 Thermally Conductive Gap Filler Blue is a two component, room temperature curing, silicone elastomer that is used as a protective coating for electrical applications. It provides flexibility,...
Dow DOWSIL™ TC-4525 Thermally Conductive Gap Filler is a two component, room temperature curing, silicone gel that is used to dissipate heat from electronic components. It offers long term stability,...
Dow DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant Gray is a two component, heat curing silicone material that provides thermal management and environmental protection for electronic components. It has low viscosity,...
Dow DOWSIL™ TC-5026 Thermally Conductive Compound Gray is a one component grease like silicone material. It offers high thermal conductivity, low bleed, and high temperature stability. 1 kg Bottle.
Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating...
Dow DOWSIL™ TC-5622 Thermally Conductive Compound Gray is a one component, silicone grease like material with low bleed and high temperature stability. It offers low thermal resistance, solventless formulation, and...
Dow DOWSIL™ TC-6020 Thermally Conductive Encapsulant Part A White is a two-part silicone elastomer. It offers adhesion to aluminum, high thermal conductivity, and excellent dielectric properties. It is for use...
Dow DOWSIL™ TC-6020 Thermally Conductive Encapsulant Part B Gray is a two-part silicone elastomer. It offers high thermal conductivity, excellent dielectric properties, and adhesion to aluminum. It is used in...
Dow SE 4445 CV Thermally Conductive Gel Gray is a two component, heat curing gel that is used for potting electronic modules, base material for thermally conductive gel sheet, and...
Dow SYLGARD™ 3-6605 Thermally Conductive Elastomer Gray is a two component, heat curing, medium viscosity, silicone elastomer that is used to protect electrical components from extreme environments, moisture, and stress.
Dow TC-2030 Thermally Conductive Adhesive Gray is a two component, heat curing, silicone compound that is used for bonding electrical components. It provides heat dissipation, mechanical stability, and electrical insulation.
Henkel Loctite 315 is a one component, thermally conductive acrylic adhesive used for bonding electrical components to heat sinks with an insulating gap. 25 mL Cartridge.Activator 7387 is required for...
Henkel Loctite 315 is a one component, thermally conductive acrylic adhesive used for bonding electrical components to heat sinks with an insulating gap. 300 mL Cartridge.
Henkel Loctite 383 is a thermally conductive adhesive system designed for bonding heat generating components including transformers and transistors to printed circuit boards or heat sinks. 25 mL Kit.
Henkel Loctite 384 is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. Provides excellent heat dissipation for thermally sensitive components. 25 mL Kit.
Henkel Loctite 384 is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. Provides excellent heat dissipation for thermally sensitive components. 25 mL Syringe.
Henkel Loctite 3873 Thermally Conductive Acrylic Adhesive is a one component, high strength, adhesive that is used for bonding heat generating devices. It offers high viscosity, high modulus, and is...
Henkel Loctite 3888 is a room temperature cure epoxy adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical...
Henkel Loctite 402 Adhesive Silver is a two component, room temperature curing, epoxy paste that is used for sealing and bonding electronic components, heat sensitive materials, plastic laminates, metals, and...
Henkel Loctite 4203 Prism is a general purpose instant adhesive toughened with elastomers for flexibility, impact resistance, and improved resistance to heat and humidity. 1 lb Bottle.
Henkel Loctite 4203 Prism is a general purpose instant adhesive toughened with elastomers for flexibility, impact resistance, and improved resistance to heat and humidity. 20 g Tube.
Henkel Loctite 4204 Prism is a medium viscosity, thermally resistant general purpose cyanoacrylate adhesive toughened with elastomers for flexibility, impact resistance and resistance to heat and humidity. 20 g Bottle.
Henkel Loctite 4204 Prism one component, medium viscosity general purpose adhesive that is suitable for applications where heat resistance is needed. It is toughened with elastomers for flexibility, impact resistance...
Henkel Loctite 4205 is a general purpose instant adhesive toughened with elastomers for flexibility, impact resistance, and improved resistance to heat and humidity. 20 g Tube.
Henkel Loctite 4205 is a general purpose instant adhesive toughened with elastomers for flexibility, impact resistance, and improved resistance to heat and humidity. 200 g Tube.
Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good...
Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND, is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good...
Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic...
Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a two component, highly filled, epoxy adhesive paste that is used for applications exposed to cryogenic temperatures and for...
Henkel Loctite Ablestik 286 White, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, piping, and other maintenance...
Henkel Loctite Prism 4210 Black is a one component, high viscosity, thermal resistant, cyanoacrylate adhesive. It is toughened with elastomers for impact and peel strength as well as improved resistance...
Henkel Loctite Prism 4211 is a one component, high viscosity, thermal resistant, cyanoacrylate adhesive. It is toughened with elastomers for impact and peel strength as well as improved resistance to...
Henkel Loctite STYCAST 1495 K Black, formerly Emerson and Cuming, is a two component, highly filled, liquid epoxy encapsulant that is used for electronic components that need environmental protection, good...
Henkel Loctite STYCAST 1495 K Black, formerly Emerson and Cuming, is an epoxy encapsulant that is used for electronic components that require good flowability and thermal conductivity. It offers low...
Henkel Loctite STYCAST 2762 Black is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal...
Henkel Loctite STYCAST 2762 FT Black, formally Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low...
Henkel Loctite STYCAST 2762 FT Black, formerly Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low...
Henkel Loctite STYCAST 2850FT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and...
Henkel Loctite STYCAST 2850FT Blue, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and...
Henkel Loctite STYCAST 2850FT Blue, formerly Emerson and Cuming, is a two component, thermally conductive, epoxy encapsulant that is used for encapsulating components that are exposed to thermal shock and...
Henkel Loctite STYCAST 2850FT White, formerly Emerson and Cuming, is a two component, thermally conductive, epoxy encapsulant that is used for encapsulating components that are exposed to thermal shock and...
Henkel Loctite STYCAST 2850FT-FR Black, formerly Emerson and Cuming, is a two component, room temperature curing, fire resistant, epoxy encapsulant that is used for components that are exposed to thermal...
Henkel Loctite STYCAST 2850GT Black, formerly Emerson and Cuming, is a two component, epoxy encapsulant that is used for encapsulating component that are exposed to thermal shock and need heat...
Henkel Loctite STYCAST 2850GT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and...
Henkel Loctite STYCAST 2850KT Blue, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for high voltage components and replacing heat sinks. It...
Henkel Loctite STYCAST 2850MT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for encapsulating components that are exposed to thermal shock,...
Henkel Loctite STYCAST 2850MT Blue, formerly Emerson and Cuming, is a two component, room temperature and heat curing, epoxy encapsulant that is used for high voltage applications and for components...
Henkel Loctite STYCAST 2851FT Black, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent...
Henkel Loctite STYCAST 2851MT Blue, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent...
Henkel Loctite STYCAST 5952 Red, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as...
Henkel Loctite STYCAST 5952 White, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as...
Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate...
Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors,...
Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate...
Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors,...
KitPackers Packaged Henkel Loctite STYCAST 2850FT Black is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat...
Parker LORD® CoolTherm® MD-140 Silver is a thermally conductive, silver-filled epoxy adhesive designed for thermally demanding die attach applications. Low stress, low iconic levels, fast cure and excellent dispensability. 10...
Parker LORD® CoolTherm® MD-140 Silver is a thermally conductive, silver-filled epoxy adhesive designed for thermally demanding die attach applications. Low stress, low iconic levels, fast cure and excellent dispensability. 5...
ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance...
ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the...
Techspray Silicone Free Heat Sink Compound is used to cool thermistors, calrods, thermocouple wells, and other electrical components. It is non-ozone depleting, easy to apply, and will not harden, separate,...