Ellsworth Adhesives Datasheets for Conductive Compounds
Conductive compounds provide an electrically and/or thermally conductive path between components.
Conductive Compounds: Learn more
| Product Name | Notes |
|---|---|
| 3M TC-2707 Thermally Conductive Epoxy Adhesive Gray is a two component epoxy that uses aluminum metal filler. It offers high adhesive strength, good gap filling, low viscosity for potting applications,... | |
| 3M Thermally Conductive Epoxy Adhesive TC-2810 Cream is a two component, boron nitride filled adhesive that offers low outgassing, good thermal conductivity, and low chloride ion content. 50 mL Duo-Pak... | |
| Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air... | |
| Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at... | |
| Bergquist Gap Pad 5000S35 High Thermal Fiberglass Pad offers conformability, electrical insulation, and tear resistance. The material has tack on both sides making it easy to handle and effective in... | |
| Bergquist Gap Pad VO High Thermal Fiberglass Pad offers conformability, electrical insulation, and tear resistance. The material has tack on one side and is used to manage heat and fill... | |
| Bergquist Gap Pad VO Ultra Soft High Thermal Fiberglass Pad is a highly conformable, electrically isolating material that is used for applications that require minimal pressure and isolation between heat... | |
| Bergquist Hi-Flow 650P Thermally Conductive Polyimide Pad that is used as an insulated barrier between electrical devices and the heat sink. It offers high temperature reliabililty, dielectric strength, and cut-through... | |
| Bergquist Liqui-Bond SA 1800 is a one component, thermally conductive silicone adhesive that is used for structural bonding applications that are exposed to extreme environments. It offers high thermal conductivity... | |
| Bergquist Liqui-Bond SA 2000 is a one component, thermally conductive silicone adhesive that is used for structural bonding applications that are exposed to extreme environments. It cures at elevated temperatures... | |
| Bergquist Poly-Pad 1000 Thermally Conductive Fiberglass with a filled polyester resin, is used for high performance applications and devices that require non-silicone conformal coatings such as power supplies, semiconductors, and... | |
| Bergquist Poly-Pad 400 Thermally Conductive Fiberglass Pad with a filled polyester resin, is used for silicone-sensitive applications and devices that require conformal coatings such as power supplies, semiconductors, and automotive... | |
| Bergquist Poly-Pad K-10 Thermally Conductive Polyimide Pad with a ceramic-filled polyester resin, is used for silicone sensitive applications and devices such as power supplies, semiconductors, and motor controls. It offers... | |
| Bergquist Poly-Pad K-4 Thermally Conductive Polyimide Pad with a ceramic-filled polyester resin, is used for silicone sensitive applications and devices such as power supplies, semiconductors, and motor controls. It offers... | |
| Bergquist SIL-PAD Q-PAD II High Thermal Aluminum Pad is a thermal interface material that is used to replace thermal grease. It provides maximum heat transfer, eliminates dust collection, and has... | |
| Dow DOWSIL™ 1-4173 TC Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It... | |
| Dow DOWSIL™ 1-4173 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used for bonding heat sinks, housings, base plates, lids, and circuit applications. It provides... | |
| Dow DOWSIL™ 1-4173 Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is... | |
| Dow DOWSIL™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It... | |
| Dow DOWSIL™ 3-1818 Thermally Conductive Adhesive Gray is a one component, thixotropic adhesive that is used for bonding with common materials in the electronics industry. It has a fast heat... | |
| Dow DOWSIL™ 3-6751 Thermally Conductive Adhesive Gray is a two component, heat curing, low viscosity silicone that is used to cool electronics, automotives, and power supply applications during thermal transfers. | |
| Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates,... | |
| Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing,... | |
| Dow DOWSIL™ Q1-9226 Thermally Conductive Adhesive Gray is a two component, heat curing, silicone adhesive that is used for bonding with a variety of substrates such as filled plastics, metals,... | |
| Dow DOWSIL™ SC 102 Thermally Conductive Compound White is a one component, non-curing, silicone paste that is used to gap fill material between heat sinks and electronic heat sources. It... | |
| Dow DOWSIL™ SE 1700 W/C Thermally Conductive Adhesive Clear is a two-part non-flowing, heat cure, and high tensile strength adhesive. It is primarily used for sealing ceramic condensers, sealing PCB... | |
| Dow DOWSIL™ SE 4420 White is a one component, moisture cure, thermally conductive silicone adhesive designed to provide the efficient thermal transfer for cooling electronic modules. 330 mL Cartridge. | |
| Dow DOWSIL™ SE 4422 Thermally Conductive Adhesive Gray is a one component, semi-flowable adhesive. It is designed to provide efficient thermal transfer for home appliance devices and the cooling of... | |
| Dow DOWSIL™ SE 4430 Gray is a low viscosity, thermally conductive elastomer that provides efficient thermal transfer for cooling electronic modules in power supply applications. Part B, 1 kg Bottle. | |
| Dow DOWSIL™ SE 4430 White is a low viscosity, thermally conductive elastomer that provides efficient thermal transfer for cooling electronic modules in power supply applications. Part A, 1 kg Bottle. | |
| Dow DOWSIL™ SE 4486 Thermally Conductive Adhesive is a one component, moisture and heat curing, silicone elastomer that is used for potting power supplies, attaching base plates and heat sinks. | |
| Dow DOWSIL™ TC-2035 Thermally Conductive Adhesive is a two component, silicone heat curing adhesive with primerless adhesion and low bond line thickness. It offers outstanding dielectric properties, stable performance at... | |
| Dow DOWSIL™ TC-4025 Thermally Conductive Gap Filler Blue is a two component, room temperature curing, silicone elastomer that is used as a protective coating for electrical applications. It provides flexibility,... | |
| Dow DOWSIL™ TC-5026 Thermally Conductive Compound Gray is a one component grease like silicone material. It offers high thermal conductivity, low bleed, and high temperature stability. 1 kg Bottle. | |
| Dow DOWSIL™ TC-5150 Blue is a one component, high performance, non-curable, thermally conductive gap filler designed to dissipate heat from electronics to a heat sink providing a reliable cooling solution... | |
| Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating... | |
| Dow DOWSIL™ TC-5622 Thermally Conductive Compound Gray is a one component, silicone grease like material with low bleed and high temperature stability. It offers low thermal resistance, solventless formulation, and... | |
| Dow DOWSIL™ TC-6020 Thermally Conductive Encapsulant Part A White is a two-part silicone elastomer. It offers adhesion to aluminum, high thermal conductivity, and excellent dielectric properties. It is for use... | |
| Dow DOWSIL™ TC-6020 Thermally Conductive Encapsulant Part B Gray is a two-part silicone elastomer. It offers high thermal conductivity, excellent dielectric properties, and adhesion to aluminum. It is used in... | |
| Dow DOWSIL™ TC-6032 is a two component, thermally conductive encapsulant that is used for electronic and electric component applications. It is heat curing, flowable, and self leveling. 10 kg Kit. | |
| Dow SE 4445 CV Thermally Conductive Gel Gray is a two component, heat curing gel that is used for potting electronic modules, base material for thermally conductive gel sheet, and... | |
| Dow TC-2030 Thermally Conductive Adhesive Gray is a two component, heat curing, silicone compound that is used for bonding electrical components. It provides heat dissipation, mechanical stability, and electrical insulation. | |
| Henkel Loctite 315 is a one component, thermally conductive acrylic adhesive used for bonding electrical components to heat sinks with an insulating gap. 25 mL Cartridge. Activator 7387 is required... | |
| Henkel Loctite 315 is a one component, thermally conductive acrylic adhesive used for bonding electrical components to heat sinks with an insulating gap. 300 mL Cartridge. | |
| Henkel Loctite 383 is a thermally conductive adhesive system designed for bonding heat generating components including transformers and transistors to printed circuit boards or heat sinks. 25 mL Kit. | |
| Henkel Loctite 384 is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. Provides excellent heat dissipation for thermally sensitive components. 25 mL Kit. | |
| Henkel Loctite 384 is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. Provides excellent heat dissipation for thermally sensitive components. 25 mL Syringe. | |
| Henkel Loctite 3873 Thermally Conductive Acrylic Adhesive is a one component, high strength, adhesive that is used for bonding heat generating devices. It offers high viscosity, high modulus, and is... | |
| Henkel Loctite 3888 is a room temperature cure epoxy adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical... | |
| Henkel Loctite 4203 Prism is a general purpose instant adhesive toughened with elastomers for flexibility, impact resistance, and improved resistance to heat and humidity. 1 lb Bottle. | |
| Henkel Loctite 4203 Prism is a general purpose instant adhesive toughened with elastomers for flexibility, impact resistance, and improved resistance to heat and humidity. 20 g Tube. | |
| Henkel Loctite 4204 Prism is a medium viscosity, thermally resistant general purpose cyanoacrylate adhesive toughened with elastomers for flexibility, impact resistance and resistance to heat and humidity. 20 g Bottle. | |
| Henkel Loctite 4204 Prism one component, medium viscosity general purpose adhesive that is suitable for applications where heat resistance is needed. It is toughened with elastomers for flexibility, impact resistance... | |
| Henkel Loctite 4205 is a general purpose instant adhesive toughened with elastomers for flexibility, impact resistance, and improved resistance to heat and humidity. 20 g Tube. | |
| Henkel Loctite 4205 is a general purpose instant adhesive toughened with elastomers for flexibility, impact resistance, and improved resistance to heat and humidity. 200 g Tube. | |
| Henkel Loctite 4210 Black is a one component, high viscosity, thermal resistant, cyanoacrylate adhesive. It is toughened with elastomers for impact and peel strength as well as improved resistance to... | |
| Henkel Loctite 4211 is a one component, high viscosity, thermal resistant, cyanoacrylate adhesive. It is toughened with elastomers for impact and peel strength as well as improved resistance to hot... | |
| Henkel Loctite Ablestik 2151 Blue is a two component, room temperature curing epoxy adhesive. It is electrically insulating, thermally conductive, and has high adhesion with durable, high-impact bonds. 3 g... | |
| Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good... | |
| Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND, is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good... | |
| Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic... | |
| Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a two component, highly filled, epoxy adhesive paste that is used for applications exposed to cryogenic temperatures and for... | |
| Henkel Loctite Ablestik 286 White, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, piping, and other maintenance... | |
| Henkel Loctite STYCAST 1495 K Black, formerly Emerson and Cuming, is a two component, highly filled, liquid epoxy encapsulant that is used for electronic components that need environmental protection, good... | |
| Henkel Loctite STYCAST 1495 K Black, formerly Emerson and Cuming, is an epoxy encapsulant that is used for electronic components that require good flowability and thermal conductivity. It offers low... | |
| Henkel Loctite STYCAST 2762 Black is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal... | |
| Henkel Loctite STYCAST 2762 FT Black, formally Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low... | |
| Henkel Loctite STYCAST 2762 FT Black, formerly Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low... | |
| Henkel Loctite STYCAST 2850FT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and... | |
| Henkel Loctite STYCAST 2850FT Blue, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and... | |
| Henkel Loctite STYCAST 2850FT Blue, formerly Emerson and Cuming, is a two component, thermally conductive, epoxy encapsulant that is used for encapsulating components that are exposed to thermal shock and... | |
| Henkel Loctite STYCAST 2850FT White, formerly Emerson and Cuming, is a two component, thermally conductive, epoxy encapsulant that is used for encapsulating components that are exposed to thermal shock and... | |
| Henkel Loctite STYCAST 2850FT-FR Black, formerly Emerson and Cuming, is a two component, room temperature curing, fire resistant, epoxy encapsulant that is used for components that are exposed to thermal... | |
| Henkel Loctite STYCAST 2850GT Black, formerly Emerson and Cuming, is a two component, epoxy encapsulant that is used for encapsulating component that are exposed to thermal shock and need heat... | |
| Henkel Loctite STYCAST 2850GT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and... | |
| Henkel Loctite STYCAST 2850KT Blue, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for high voltage components and replacing heat sinks. It... | |
| Henkel Loctite STYCAST 2850MT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for encapsulating components that are exposed to thermal shock,... | |
| Henkel Loctite STYCAST 2850MT Blue, formerly Emerson and Cuming, is a two component, room temperature and heat curing, epoxy encapsulant that is used for high voltage applications and for components... | |
| Henkel Loctite STYCAST 2851FT Black, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent... | |
| Henkel Loctite STYCAST 2851MT Blue, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent... | |
| Henkel Loctite STYCAST 5952 Red, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as... | |
| Henkel Loctite STYCAST 5952 White, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as... | |
| Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate... | |
| Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors,... | |
| Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate... | |
| Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors,... | |
| KitPackers Packaged Henkel Loctite STYCAST 2850FT Black is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat... | |
| Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electroni c encapsulating applications. It provides low stress on components, environmental resistance, and excellent... | |
| Parker Lord CoolTherm® TC-2002 is a two component, thermally conductive adhesive used for structural bonding applications. It provides superior heat dissipation, electrical insulation, and low coefficient of thermal expansion. 490... | |
| ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance... | |
| ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the... | |
| Techspray Silicone Free Heat Sink Compound is used to cool thermistors, calrods, thermocouple wells, and other electrical components. It is non-ozone depleting, easy to apply, and will not harden, separate,... |