Henkel Corporation - Industrial Henkel Loctite Ablestik 286 Thermally Conductive Adhesive Part B White 35 lb Pail 1188151

Description
Henkel Loctite Ablestik 286 White, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, piping, and other maintenance applications. It offers good thermal conductivity, minimum flow, and easy use. Part B, 35 lb Pail.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Henkel Loctite Ablestik 286 Thermally Conductive Adhesive Part B White 35 lb Pail - 286 PTB 35LB PAIL - Ellsworth Adhesives
Germantown, WI, USA
Henkel Loctite Ablestik 286 Thermally Conductive Adhesive Part B White 35 lb Pail
286 PTB 35LB PAIL
Henkel Loctite Ablestik 286 Thermally Conductive Adhesive Part B White 35 lb Pail 286 PTB 35LB PAIL
Henkel Loctite Ablestik 286 White, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, piping, and other maintenance applications. It offers good thermal conductivity, minimum flow, and easy use. Part B, 35 lb Pail.

Henkel Loctite Ablestik 286 White, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, piping, and other maintenance applications. It offers good thermal conductivity, minimum flow, and easy use. Part B, 35 lb Pail.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number 286 PTB 35LB PAIL
Product Name Henkel Loctite Ablestik 286 Thermally Conductive Adhesive Part B White 35 lb Pail
Cure / Technology Two Component  
Unlock Full Specs
to access all available technical data

Similar Products

LCD application UV curing adhesive - DM-6674 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen DeepMaterial Technologies Co., Ltd
Specs
Cure / Technology UV or Radiation Cured
View Details
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications - MasterSil 973S-LO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Addition Cure
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Fluon® Perfluoro Adhesive - EA-2000 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Specs
Chemical System PFA
Type / Form Pellets
Features Laminaes
View Details
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
Specs
Type Thermally Conductive
Cure / Technology Two Component  ; Addition
Features Flame Retardant; UL Rating
View Details