Dow Chemical Company (The) Dow DOWSIL™ 1-4174 TC Thermally Conductive Adhesive Gray 1.5 kg Cartridge 3135641

Description
Dow DOWSIL™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It is heat curing, self-leveling, flowable, high tensile strength, and allows controlled bond line thickness. 1.5 kg Cartridge.
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Description
Dow DOWSIL™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It is heat curing, self-leveling, flowable, high tensile strength, and allows controlled bond line thickness. 1.5 kg Cartridge.
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Suppliers

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Description
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Dow DOWSIL™ 1-4174 TC Thermally Conductive Adhesive Gray 1.5 kg Cartridge - 1-4174 TC ADHESIVE 1.5KG - Ellsworth Adhesives
Germantown, WI, USA
Dow DOWSIL™ 1-4174 TC Thermally Conductive Adhesive Gray 1.5 kg Cartridge
1-4174 TC ADHESIVE 1.5KG
Dow DOWSIL™ 1-4174 TC Thermally Conductive Adhesive Gray 1.5 kg Cartridge 1-4174 TC ADHESIVE 1.5KG
Dow DOWSIL™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It is heat curing, self-leveling, flowable, high tensile strength, and allows controlled bond line thickness. 1.5 kg Cartridge.

Dow DOWSIL™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It is heat curing, self-leveling, flowable, high tensile strength, and allows controlled bond line thickness. 1.5 kg Cartridge.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number 1-4174 TC ADHESIVE 1.5KG
Product Name Dow DOWSIL™ 1-4174 TC Thermally Conductive Adhesive Gray 1.5 kg Cartridge
Cure / Technology Single Component
Features Thermally Conductive
Viscosity 58000 cP
Thermal Conductivity 1.9 W/m-K (1.1 BTU-ft/hr-ft²-F)
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