Resinlab ResinLab SEC1233 Epoxy Adhesive Silver 4 g Packet SEC1233 4GR

Description
ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g Packet.
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ResinLab SEC1233 Epoxy Adhesive Silver 4 g Packet - SEC1233 4 GRAM - Ellsworth Adhesives
Germantown, WI, USA
ResinLab SEC1233 Epoxy Adhesive Silver 4 g Packet
SEC1233 4 GRAM
ResinLab SEC1233 Epoxy Adhesive Silver 4 g Packet SEC1233 4 GRAM
ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g Packet.

ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g Packet.

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Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number SEC1233 4 GRAM
Product Name ResinLab SEC1233 Epoxy Adhesive Silver 4 g Packet
Cure / Technology Two Component  
Chemical System Epoxy
Features Thermally Conductive
Viscosity 29500 to 582000 cP
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