Bergquist Company (The) Bergquist Hi-Flow 650P Thermally Conductive Polyimide Pad Gold 11 in x 12 in x 0.0055 in HI-FLOW 650P (2.0) 0.0055IN/0.140MM

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Bergquist Hi-Flow 650P Thermally Conductive Polyimide Pad Gold 11 in x 12 in x 0.0055 in - HI-FLOW 650P (2.0) 0.0055IN/0.140MM - Ellsworth Adhesives
Germantown, WI, USA
Bergquist Hi-Flow 650P Thermally Conductive Polyimide Pad Gold 11 in x 12 in x 0.0055 in
HI-FLOW 650P (2.0) 0.0055IN/0.140MM
Bergquist Hi-Flow 650P Thermally Conductive Polyimide Pad Gold 11 in x 12 in x 0.0055 in HI-FLOW 650P (2.0) 0.0055IN/0.140MM
Bergquist Hi-Flow 650P Thermally Conductive Polyimide Pad that is used as an insulated barrier between electrical devices and the heat sink. It offers high temperature reliabililty, dielectric strength, and cut-through resistance. 11 in x 12 in, 0.0055 in thick.

Bergquist Hi-Flow 650P Thermally Conductive Polyimide Pad that is used as an insulated barrier between electrical devices and the heat sink. It offers high temperature reliabililty, dielectric strength, and cut-through resistance. 11 in x 12 in, 0.0055 in thick.

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Technical Specifications

  Ellsworth Adhesives
Product Category Thermal Compounds and Thermal Interface Materials
Product Number HI-FLOW 650P (2.0) 0.0055IN/0.140MM
Product Name Bergquist Hi-Flow 650P Thermally Conductive Polyimide Pad Gold 11 in x 12 in x 0.0055 in
Cure / Technology Single Component
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