Dow Chemical Company (The) Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler 720 g Kit 99151387

Description
Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating components. It is non-flowable and cures at room temperature or heat accelerated. 720 g Kit.
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Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler 720 g Kit - TC-5515 LT GAP FILLER 720G KIT - Ellsworth Adhesives
Germantown, WI, USA
Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler 720 g Kit
TC-5515 LT GAP FILLER 720G KIT
Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler 720 g Kit TC-5515 LT GAP FILLER 720G KIT
Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating components. It is non-flowable and cures at room temperature or heat accelerated. 720 g Kit.

Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating components. It is non-flowable and cures at room temperature or heat accelerated. 720 g Kit.

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Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number TC-5515 LT GAP FILLER 720G KIT
Product Name Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler 720 g Kit
Cure / Technology Two Component  
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