Ellsworth Adhesives Datasheets for Leveling and Filling Compounds
Leveling and filling compounds are used to level surfaces, fill cavities, and shim or set machinery. They often have filling and sealing properties.
Leveling and Filling Compounds: Learn more
| Product Name | Notes |
|---|---|
| Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air... | |
| Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at... | |
| Bergquist Gap Pad 5000S35 High Thermal Fiberglass Pad offers conformability, electrical insulation, and tear resistance. The material has tack on both sides making it easy to handle and effective in... | |
| Bergquist Gap Pad VO High Thermal Fiberglass Pad offers conformability, electrical insulation, and tear resistance. The material has tack on one side and is used to manage heat and fill... | |
| Bergquist Gap Pad VO Ultra Soft High Thermal Fiberglass Pad is a highly conformable, electrically isolating material that is used for applications that require minimal pressure and isolation between heat... | |
| Bostik Chem-Calk 1200 Clear is a one component, moisture curing, silicone sealant that is used for bonding nonporous materials, aluminum, glass, plastics, and ceramics. It is typically used for sealing... | |
| Dow DOWSIL™ TC-5150 Blue is a one component, high performance, non-curable, thermally conductive gap filler designed to dissipate heat from electronics to a heat sink providing a reliable cooling solution... | |
| Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating... | |
| Parker LORD® CoolTherm® SC-1600 Thermally Conductive Gap Filler is a silicone system used to provide thermal conductivity to electronic applications. It offers low stress on components, durability, and environmental resistance. |