Ellsworth Adhesives Datasheets for Encapsulants and Potting Compounds
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more
Page:
1
2
| Product Name | Notes |
|---|---|
| Aculon NanoProof® 3-001X Clear is a non-curing, anti-stiction, anti-wetting, conformal coating. It offers protection from corrosion, chemicals, and moisture for printed circuit boards and electronic components. The conformal coating is... | |
| Aculon NanoProof® 3-002 Light Green is a non-curing, anti-stiction, anti-wetting, conformal coating. It offers protection from corrosion, chemicals, and moisture for printed circuit boards and electronic components. The conformal coating... | |
| Aculon NanoProof® 3-01 Acrylic Light Green is a non-curing, anti-stiction, anti-wetting, conformal coating. It offers protection from corrosion, chemicals, and moisture for printed circuit boards and electronic components. The conformal... | |
| Aculon NanoProof® 3-01 Light Green 1 is a non-curing, anti-stiction, anti-wetting, conformal coating. It offers protection from corrosion, chemicals, and moisture for printed circuit boards and electronic components. The conformal... | |
| Aculon NanoProof® 3-01 Light Green is a non-curing, anti-stiction, anti-wetting, conformal coating. It offers protection from corrosion, chemicals, and moisture for printed circuit boards and electronic components. The conformal coating... | |
| Aculon NanoProof® 3-02 Light Green is a non-curing, anti-stiction, anti-wetting, conformal coating. It offers protection from corrosion, chemicals, and moisture for printed circuit boards and electronic components. The conformal coating... | |
| Aculon NanoProof® 3-04 Light Green is a non-curing, anti-stiction, anti-wetting, conformal coating. It offers protection from corrosion, chemicals, and moisture for printed circuit boards and electronic components. The conformal coating... | |
| Aculon NanoProof® 3-08 Light Green is a non-curing, anti-stiction, anti-wetting, conformal coating. It offers protection from corrosion, chemicals, and moisture for printed circuit boards and electronic components. The conformal coating... | |
| Aculon NanoProof® 3-10 Light Green is a non-curing, anti-stiction, anti-wetting, conformal coating. It offers protection from corrosion, chemicals, and moisture for printed circuit boards and electronic components. The conformal coating... | |
| Dow DOWSIL™ 1-2577 Conformal Coating Clear is a one component, low viscosity, silicone resin coating that is used to protect electronic components from stress and abrasions. It is an RTV,... | |
| Dow DOWSIL™ 1-2620 Dispersion RTV Conformal Coating Clear Yellow is a one component, low viscosity, silicone resin coating that is used to protect electronic components from stress and abrasions. It... | |
| Dow DOWSIL™ 3-1953 Conformal Coating Clear is a one component, medium viscosity, solvent free silicone that is used for print wire boards, circuit boards, and other sensitive electronic components. It... | |
| Dow DOWSIL™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and... | |
| Dow DOWSIL™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and... | |
| Dow DOWSIL™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. | |
| Dow DOWSIL™ 3-6121 Low Temperature Elastomer Clear is a two component, room to high temperature curing, silicone encapsulant that is used to protect electrical components from contaminants, moisture, and stress. | |
| Dow DOWSIL™ Q1-4010 Conformal Coating Clear is a one component, heat curing, solvent free elastomer that is used as a protective coating for printed wiring boards, sensitive components, flexible and... | |
| Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical... | |
| Dow DOWSIL™ X3-6211 Encapsulant Clear is a one component, UV curing, thixotropic gel that is used for stress relief, electrical insulation, and protection against moisture, high voltages, and extreme temperatures. | |
| Dow SYLGARD™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate... | |
| Dow SYLGARD™ 164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies,... | |
| Dow SYLGARD™ 170 Fast Cure Silicone Elastomer Black is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as... | |
| Dow SYLGARD™ 170 Silicone Elastomer is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers,... | |
| Dow SYLGARD™ 182 Silicone Elastomer Clear is a two component, heat curing encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers,... | |
| Dow SYLGARD™ 184 Silicone Elastomer Clear is a two component, flowable encapsulant that is used for amplifiers, connectors, power supplies, LED lighting, sensors, transformers, high voltage resistor packs, and industrial... | |
| Dow SYLGARD™ 567 Primerless Silicone Encapsulant Black is a two component material that is used in potting applications for automotive assemblies, power supplies, high voltage resistor packs, LED lighting, industrial... | |
| ELANTAS PDG CONAPOXY FR-1274 Epoxy Black is a two component, potting and casting system that is used for encapsulating electronics, coils, transformers, and strain sensitive devices. It cures at room... | |
| ELANTAS PDG CONAPOXY FR-1820 Epoxy is a two component, potting and casting system that is used as a non-abrasive filler for machine equipment. It has a short pot life and... | |
| ELANTAS PDG CONAPOXY RN-1000 Epoxy Resin is a potting and casting resin that when paired with CONACURE EA-02, EA-028, or EA-87 offers excellent electrical properties, thermal shock resistance, low exotherm,... | |
| ELANTAS PDG CONAPOXY RN-1200 Epoxy Resin is an undiluted potting and casting resin that when paired with CONACURE EA-02, EA-028, EA-87, or EA-117 offers excellent electrical properties, thermal shock resistance,... | |
| ELANTAS PDG CONATHANE EN-1556 Polyurethane Resin System Black is a two component, polyether based system that is used for casting, molding, potting, and encapsulating electrical assemblies such as connectors, print... | |
| ELANTAS PDG CONATHANE TU-901 Polyurethane Encapsulant Light Amber is a two-component polyurethane system. It is used for potting or casting applications requiring excellent UV stability and elastomeric properties. It has... | |
| ELANTAS PDG CONATHANE UF-3 Polyurethane Foam is a two component, liquid system that is used for packaging electronic assemblies. It cures at room temperature and offers low vapor pressure, insulation,... | |
| Henkel Loctite STYCAST 2651 Black, formerly Emerson and Cuming, is a two component, filled, liquid epoxy encapsulant that is used for general purpose applications. It is dielectric grade, versatile, and... | |
| Henkel Loctite STYCAST 2651MM Black, formerly Emerson and Cuming, is a two component, filled, liquid epoxy encapsulant that is used for general purpose applications. It offers low viscosity, machinability, and... | |
| KitPackers Packaged Henkel Loctite STYCAST 2850FT Black is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat... | |
| ResinLab Eleset™ UR6060 Polyurethane Encapsulant Clear is a two component, room temperature curing resin that is used for LED encapsulation and high quality castings. It is low viscosity, easy-to-mix, and... | |
| ResinLab EP1282 Clear is a two component, room temperature or heat curing, unfilled, flame resistant, epoxy encapsulant that is used for medium castings. It offers good wetting, semi-rigid polymer, high... | |
| ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance... | |
| ResinLab EP1295 Black is a two component, room temperature or heat curing, flame resistant epoxy casting system that has good air release, free flow, halogen free, and medium viscosity. It... | |
| ResinLab EP1300 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium castings. It is electronic grade, free flowing, and... | |
| ResinLab EP1300 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium castings. It is electronic grade, free flowing, and... | |
| ResinLab EP1305 Black is a two component, room temperature or heat curing, urethane epoxy that is used for bonding metal, ceramics, and PVC. It is thixotropic, non-sagging, and toughened. 50... | |
| ResinLab EP1305LV Black is a two component, room temperature or heat curing, epoxy casting resin that is used for bonding metal and PVC. It is free flowing, good wetting, self... | |
| ResinLab EP1310 Clear is a two component, room temperature curing, medium reactivity epoxy encapsulant designed for medium to large castings. Features good optical clarity and excellt water and chemical resistance. | |
| ResinLab EP1340 Black is a two component, room temperature or heat curing, flame resistant epoxy casting system that is used for bonding to most materials and filling voids. It is... | |
| ResinLab EP1350 Black is a two component, low viscosity, high performing epoxy encapsulant designed for electronic potting and encapsulating. Features a very high Tg, low CTE, and superior electrical insulation... | |
| ResinLab EP1385 Epoxy Encapsulant Black is a two component electronic grade epoxy encapsulant. It is used for small or medium castings and formulated for applications requiring resistance to E-85 type... | |
| ResinLab EP691 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is... | |
| ResinLab EP691F Clear is a two component, room temperature or heat curing, epoxy encapsulant that is used for medium to large castings and filling voids. It is electronic grade, rigid,... | |
| ResinLab EP965 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is... | |
| ResinLab EP965 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is... | |
| ResinLab EP9651 Black is a nonylphenol-free version of Resinlab EP965. It is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding... | |
| ResinLab EP965LVLX Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium casting, bonding with most materials, and filling voids. | |
| ResinLab EP965LVLX Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium casting, bonding with most materials, and filling voids. | |
| ResinLab EP965SC7 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is... | |
| ResinLab EP965SC7 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is... | |
| ResinLab EP965T1 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is... | |
| ResinLab UR1049 Cream is a two component, room temperature curing, polyurethane foam that is used for environmental protection and bonding plastics, metals, and assemblies. It is water blown, MDI based,... | |
| ResinLab UR3001 HP Black is a two component, room temperature curing, unfilled, urethane encapsulating system that is used for environmental protection and bonding plastics, metals, and assemblies. It is gel-like,... | |
| ResinLab UR3001HP Clear is a two component, room temperature curing, unfilled, urethane encapsulating system that is used for environmental protection and bonding plastics, metals, and assemblies. It is gel-like, flexible,... | |
| ResinLab UR3001HP2 Black is a two component, room temperature curing, unfilled, urethane encapsulating system that is used for environmental protection and bonding plastics, metals, and assemblies. It is gel-like, flexible,... | |
| ResinLab UR3001HP2 Clear is a two component, room temperature curing, unfilled, urethane encapsulating system that is used for environmental protection and bonding plastics, metals, and assemblies. It is gel-like, flexible,... | |
| ResinLab UR3001HP2 Urethane Encapsulant Clear is a two component, room temperature curing, unfilled, urethane encapsulating system that is used for bonding plastics, metals, and assemblies. It is very flexible, low... | |
| ResinLab UR3010 Black is a two component, room temperature curing, unfilled, polyurethane potting system that is used for bonding plastics, metals, and assemblies. It is very flexible, low viscosity, good... | |
| ResinLab UR3010 Clear is a two component, room temperature curing, unfilled, polyurethane potting system that is used for bonding plastics, metals, and assemblies. It is very flexible, low viscosity, good... | |
| ResinLab UR6000 Urethane Encapsulant Black is a two component, room temperature curing resin that is used for potting and encapsulation of electronic devices. It is low viscosity with a 4:1... | |
| ResinLab UR6001 Urethane Encapsulant Black is a two component, room temperature curing resin that is used for side by side cartridges as well as bulk meter mix dispense equipment. Flame... | |
| ResinLab W112800 Epoxy Encapsulant Part A Clear is a two component solvent based epoxy coating. It cures at room temperature to a tough, semi-rigid polymer. It also has good resistance... | |
| ResinLab W112800 Epoxy Encapsulant Part B Clear is a two component solvent based epoxy coating. It cures at room temperature to a tough, semi-rigid polymer. It also has good resistance... | |
| VSi Parylene Dimer Type N White is a parylene depositing dimer used as a protective coating in parylene projects. It is biocompatible, highly resistant to corrosive vapors, gases, and chemicals,... |
| << Prev |