ResinLab EP1350 Black is a two component, low viscosity, high performing epoxy encapsulant designed for electronic potting and encapsulating. Features a very high Tg, low CTE, and superior electrical insulation properties in extreme conditions. Highly filled providing low shrinkage upon cure and high thermal conductivity. Includes a rubber toughening agent. 1 qt Kit.
| Ellsworth Adhesives | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | EP1350 QT KIT |
| Product Name | ResinLab EP1350 Epoxy Encapsulant Black 1 qt Kit |
| Cure / Technology | Two Component |
| Chemical System | Epoxy |
| Thermal Conductivity | 0.7300 W/m-K (0.4218 BTU-ft/hr-ft²-F) |
| Tensile (Break) | 2500 psi (17237 KPa) |
