ResinLab EP965 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.
| Ellsworth Adhesives | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EP965 BLACK - B PL |
| Product Name | ResinLab EP965 Epoxy Encapsulant Part B Black 5 gal Pail |
| Cure / Technology | Two Component |
| Chemical System | Epoxy |
| Features | Encapsulant, Potting Compound |
| Viscosity | 9000 to 16000 cP |
