Epoxies Etc... Datasheets for Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more
| Product Name | Notes |
|---|---|
| 10-3000 is a clear 2 part flexible adhesive. 10-3000 is water clear and its low viscosity allows maximum penetration of substrates. Its flexibility maintains a tenacious bond on parts with... | |
| 10-3001 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. | |
| 10-3003 HV is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable... | |
| 10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. | |
| 10-3005 NS and 10-3046 NS are two component fast curing epoxy adhesives. These high bond strength adhesives are 100% solids and therefore contain no solvents. 10-3005 NS and 10-3046 NS... | |
| 10-3006 is a new non-sag fast setting patch & repair epoxy system. This material has a convenient 1:1 mix ratio and will not run when used on vertical surfaces. 10-3006... | |
| 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product... | |
| 10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance. | |
| 10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to... | |
| 10-3026 is a clear, fast setting epoxy resin system. This product forms a semi-flexible and strong bond to metals, pewter, glass, ceramic, felt, concrete, etc. 10-3026 does not contain any... | |
| 10-3031 is a two component electronic grade epoxy system. This material provides excellent chemical and heat resistance. It is available in a standard and low viscosity. | |
| 10-3037 is a thixotropic and general purpose 100% solids epoxy adhesive. This adhesive is easily applied and will not sag or drip. High tensile strength is developed in one day... | |
| 10-3050 is a thixotropic, Non-Sag, gel epoxy designed to protect motor windings from abrasives, chemicals, vibration, oils, jet fuels, etc... 10-3050 self levels to a smooth void free coating once... | |
| 10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can... | |
| 10-3216 is a toughened, flexible, and impact resistant epoxy adhesive. 10-3216 is a two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high... | |
| 10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary... | |
| 10-3785 is a one component (no mixing necessary) epoxy adhesive. This product maintains exceptionally strong structural bonds over a wide temperature range (-55°C to 150°C). A unique and popular feature... | |
| 10-3797 is a one component, fast curing structural adhesive. This epoxy system is a non-sag thixotropic product that cures quickly at low temperatures. 10-3797 is a 100% solids system and... | |
| 20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies... | |
| 20-2024 is a low viscosity, two component, closed cell urethane foam. This is a rigid, non-CFC containing foam. 20-2024 can be used for potting, encapsulating, thermal insulation, flotation devices, sandwich... | |
| 20-2028 is a light weight, two component, closed cell, liquid urethane foaming resin system designed for potting and encapsulating. | |
| 20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self... | |
| 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100... | |
| 20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does... | |
| 20-2145 is an unfilled, high performance, electronic grade urethane system. This material has a 1:1 mix ratio, is very low in viscosity, and offers outstanding physical, thermal, and electrical properties. | |
| 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would... | |
| 20-2182 is a unique high performance two component urethane system. The 20-2182 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries... | |
| 20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This twopart system is engineered to provide low stress on electronic components and to resist moisture. 20-... | |
| 20-2354 R is a two component, low durometer, potting, casting, and encapsulating compound. This unfilled system provides excellent hydrolytic stability and low moisture permeability. It has outstanding thermal cycling properties,... | |
| 20-2355 is an elastomeric polyurethane potting and encapsulating system. This unique formulation is unfilled and repairable. Its low viscosity, low durometer, and room temperature cure make it an ideal candidate... | |
| 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm,... | |
| 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system... | |
| 20-2620 is a two component Polyurethane compound designed for applications requiring "water like" clarity. This room temperature curing system provides excellent environmental protection and will not yellow over time. | |
| 20-3001 is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured. | |
| 20-3003 is a low viscosity, potting, encapsulating, and adhesive system. Its low viscosity allows for good flow and wetting of substrates. | |
| 20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a... | |
| 20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance. The flexibility of 20-3006... | |
| 20-3030 is an unfilled, low viscosity epoxy system. This system was designed for fast, self leveling and ease of use. 20-3030 has a convenient 2:1 mix ratio and will cure... | |
| 20-3035 is a low density, two component epoxy potting and encapsulating system. The weight of 20-3035 is less than half of most commercially available potting compounds. | |
| 20-3036 is a light weight epoxy for potting, casting, and encapsulating electronic components and assemblies. It is formulated in a convenient 2:1 by weight mix ratio. | |
| 20-3042 is a general purpose rigid epoxy encapsulant designed for ease in handling. This low viscosity system exhibits excellent physical, thermal, and electrical insulation properties. | |
| 20-3050 is a heat cure, 100% solids, high performance epoxy system. 20-3050 is a filled system resulting in excellent dimensional stability and extremely low shrinkage. This product has excellent electrical... | |
| 20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties. | |
| 20-3061 is a 100% reactive epoxy resin system which does not contain any solvents or additives which downgrade physical, thermal, and electrical insulation properties. This is a filled low viscosity... | |
| 20-3062 is a room temperature curing, two component, epoxy potting compound, adhesive, and coating system. Both the 20-3062 and 20-3062 LV, (Low Viscosity version of 20-3062), meet the Food and... | |
| 20-3063 is an electronic grade potting and encapsulating compound. This epoxy system is designed for applications requiring an easy and affordable potting process. 20-3063 has an easy to use one... | |
| 20-3064 is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness... | |
| 20-3065 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This system is a 100% reactive resin, which does not contain any solvents, plasticizers, or other additives,... | |
| 20-3066 is a 100% solids epoxy system which exhibits outstanding high temperature resistance. In addition to its' high temperature resistance, 20-3066 also has excellent chemical, solvent, and moisture resistance. | |
| 20-3200 is an all purpose, very low viscosity potting, casting, and encapsulating resin system. Its low viscosity is ideal for applications requiring maximum flow around and under components. | |
| 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties. | |
| 20-3210 is a mica filled casting, potting, and encapsulating resin system. This epoxy system exhibits excellent physical, thermal, and electrical insulation properties. Since mica is one of the best insulating... | |
| 20-3220 is a filled epoxy resin system that does not contain diluents, plasticizers, or other degrading adulterants. This system was formulated for the encapsulation and potting of miniaturized electronic components... | |
| 20-3221 is a very low viscosity epoxy potting, casting and encapsulating resin system. 20-3221 is a filled system resulting in excellent dimensional stability and low shrinkage. | |
| 20-3235 is a low viscosity urethane modified epoxy adhesive and potting compound. | |
| 20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix... | |
| 20-3237 is a new 1:1 ratio, low viscosity Epoxy Rubber System designed for potting delicate electronic components requiring inspection. 20-3237 is an ideal candidate for applications requiring testing and/or repairs... | |
| 20-3238 is a two component high purity grade polymer epoxy system. This is a low viscosity formulation designed for L.E.D. encapsulating, fiber optic applications and any potting application requiring the... | |
| 20-3241 is a two component high purity grade polymer epoxy system. This is a low viscosity formulation designed for encapsulation where low embedment stress to sensitive electronic components is required. | |
| 20-3242FR Epoxy is a two component potting and encapsulating compound. This product has excellent electrical insulation properties and moisture resistance. 20-3242R FR Black and Yellow meet the stringent requirements of... | |
| 20-3290 is a high temperature two part epoxy system. This system has low thermal coefficient of expansion, good thermal shock resistance and high temperature service. 20-3290 is used in a... | |
| 20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength. | |
| 20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with... | |
| 20-3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3650 is... | |
| 40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of... | |
| 40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. | |
| 40-3914 is a one component electrically conductive ink. This Polymer system was developed to provide a good balance of low cost and high conductivity. This thick film ink provides conductivity... | |
| 40-3916 is a two component, nickel filled, electrically conductive, epoxy adhesive. This system was developed to provide a good balance of low cost and high conductivity. 40-3916 is recommended for... | |
| 40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester,... | |
| 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. | |
| 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system... | |
| 50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low... | |
| 50-3100 FR is designed for the fastest and most continuous high heat transfer. 50-3100 FR measures several times faster heat dissipation than other commercially available types. The most important breakthrough... | |
| 50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the... | |
| 50-3107 is a two component potting and encapsulating compound. This system is designed to be self- extinguishing and meets the stringent requirements of UL 94-VO. 50-3107 is thermally conductive and... | |
| 50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance... | |
| 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates... | |
| 50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is... | |
| 50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for... | |
| 50-3151 FR has been formulated to meet the stringent non-burning requirements of UL 94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. 50-3151 FR is... | |
| 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination... | |
| 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. | |
| 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination... | |
| 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is... | |
| 50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high... | |
| 60-7190 is a low viscosity ultraviolet curable coating. This is an electronic grade material which will provide chemical, moisture and vibration protection. 60-7190 is water clear and may be sprayed. | |
| Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications... | |
| Epoxies, Etc... has engineered these materials to satisfy the requirements of many demanding coating and bonding applications that require electrical conductivity. | |
| One component heat cure epoxy system. This is a fast curing material known for its low temperature cure and excellent adhesion. | |
| The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate... | |
| The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. | |
| The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. | |
| These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding... | |
| These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance. | |
| This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel... | |
| This two component urethane series are low durometer (25-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. | |
| UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to... | |
| UV Cure 60-7112 is a non-yellowing UV Curable urethane system. It is designed to provide low stress on electronic components and outstanding adhesion to a variety of substances. UV Cure... | |
| UV Cure 60-7155 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7155 is water clear and is designed to be... |